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Fabrication and thermal conductivity of near-net-shaped diamond/copper composites by pressureless infiltration
- Source :
- Journal of Materials Science. 46:3862-3867
- Publication Year :
- 2011
- Publisher :
- Springer Science and Business Media LLC, 2011.
-
Abstract
- Near-net-shaped diamond/copper composites with a relative density of over 99% and thermal conductivity of over 350 Wm−1 K−1 are successfully fabricated by powder press-pressureless infiltration processing. The effects of infiltration temperature, infiltration time, interfacial thickness, and type of protective atmosphere on the thermal conductivity of the diamond/copper composites were investigated. The results showed that the diamond-copper composites with complicated shape exhibited better thermal properties, which can be widely used in electronic packaging field. It was found that the properties of diamond-copper composites infiltrated in high vacuum atmosphere were better than that of composites infiltrated in other atmospheres. The thickness of interface showed great effects on the properties of composites. The carbide interfaces were attributed to the decrease of interfacial thermal resistance and enhancement of wetting properties between the diamonds and copper.
- Subjects :
- Materials science
Mechanical Engineering
Diamond
chemistry.chemical_element
engineering.material
Copper
Carbide
Thermal conductivity
chemistry
Mechanics of Materials
Chemical vapor infiltration
engineering
Relative density
Interfacial thermal resistance
General Materials Science
Wetting
Composite material
Subjects
Details
- ISSN :
- 15734803 and 00222461
- Volume :
- 46
- Database :
- OpenAIRE
- Journal :
- Journal of Materials Science
- Accession number :
- edsair.doi...........97a28ede1dcfe371f7f75b0f5b997f0f