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The low thermal conductivity of β-Ga2O3 is a significant concern for maximizing the potential of this ultra-wide bandgap semiconductor as a power switching device technology. Here, we report on the use of nanocrystalline diamond (NCD) deposited via microwave plasma enhanced chemical vapor deposition (MP-CVD) as a top-side, device-level thermal management solution on a lateral β-Ga2O3 transistor. NCD was grown via MP-CVD on β-(AlxGa1−x)2O3/β-Ga2O3 heterostructures prior to the gate formation of the field-effect transistor. A reduced growth temperature of 400 °C and a SiNx barrier layer were used to protect the oxide semiconductors from etching in the MP-CVD H2 plasma environment. Raman spectroscopy showed a highly sp3-bonded NCD film was obtained at 400 °C, with grain size of about 50–100 nm imaged via atomic force microscopy. The incorporation of the NCD heat-spreading layer resulted in a β-(AlxGa1−x)2O3/β-Ga2O3 heterostructure field-effect transistor showing a decrease in the total thermal resistance at the gate by 42%. The fabrication process, including the NCD etch in the gate region, will need to be improved to minimize the impact of these processes on important device characteristics (i.e., drain current, threshold voltage, and leakage current). [ABSTRACT FROM AUTHOR]

This work demonstrates direct, rapid 2D thermal mapping measurement capabilities of the ultrawide bandgap semiconductor channel of lateral β-(AlxGa1−x)2O3/Ga2O3 transistors without sample contamination, long acquisition times, or sophisticated thermometry such as developing deep-ultra-violet compatible thermoreflectance systems. The temperature rise in the channel of a β-(Al0.21Ga0.79)2O3/Ga2O3 heterostructure field-effect transistor (HFET) was mapped using thermoreflectance imaging at 470 nm. First, the thermoreflectance response of the HFET channel was measured using a monochromator, revealing a maximum of the reflectance change around 470–480 nm. Thermoreflectance calibrations were then performed at 470 nm (peak of the reflectance change) and yielded an average thermoreflectance coefficient of 1.06 ± 0.07 × 10−4 K−1. Subsequent measurements of the device (power densities of 0.15–1.47 W/mm and gate-source voltage of 0 V) enabled extraction of a device-level thermal resistance of 51.1 mm·K/W in the channel at the drain-side of the gate. High-resolution, in situ scanning thermal microscopy measurements of the channel temperature rise show good agreement with and further support the thermoreflectance measurements. Finally, the thermal profile across the entire device length (metal electrodes and semiconductor channel) and width was simultaneously measured using thermoreflectance imaging at 470 nm, and the peak temperature rise was measured in the channel at the drain-side of the gate electrode. [ABSTRACT FROM AUTHOR]

The effect of heteroepitaxial β-(AlxGa1−x)2O3 film thickness and Al content on surface morphology was characterized to experimentally determine the critical thickness limitations of the (010) β-(AlxGa1−x)2O3/Ga2O3 heterostructure. High-resolution x-ray diffraction was used to assess the strain state of the films; reciprocal space mapping (RSM) revealed that even cracked films were still fully strained. In cracked films, diffuse scattering was observed in RSMs, indicating lattice tilting. Cracking of the films was investigated using atomic force microscopy (AFM), x-ray topography (XRT), bright-field scanning transmission electron microscopy (BF-STEM), and high-resolution transmission electron microscopy. Using both AFM and XRT, the [001] direction was observed to be the most prevalent crack direction; however, cracks were also observed in the [100] direction. In uncracked regions of the films, XRT revealed the alignment of threading dislocations along the [001] direction. Cross-sectional imaging of the crack geometry and propagation was performed using BF-STEM, and it was observed that the cracks in the [001] direction extended through the thickness of the β-(AlxGa1−x)2O3 film (∼205 nm) and a further ∼100–200 nm into the β-Ga2O3 substrate. Experimental data for critical film thickness showed good agreement with previous theoretical calculations based on the Griffith criterion for crack propagation. [ABSTRACT FROM AUTHOR]

Defect origins and their propagation behavior were investigated in 25 μm thick homo-epitaxial GaN layers grown on ammono-thermal and void-assisted separation (VAS) substrates using multi-vector x-ray topography in both transmission and reflection geometries. Complex inclusions were identified and their microstructure was analyzed. Additionally, generation of threading dislocation clusters during epitaxial growth is analyzed. Various defects are delineated from the substrate vs epitaxial layers. Growth on the ammono-thermal substrate led to less defective and flatter epitaxial layers compared to the growth on the VAS substrate. Determining the origins and microstructure of defects is crucial toward developing defect mitigation strategies for reliable GaN devices. [ABSTRACT FROM AUTHOR]

Semi-insulating GaN films with controlled dopant profiles have significant potential to improve the performance of high-power electronics. Beryllium doped GaN (GaN:Be) films previously demonstrated a semi-insulating nature, but the Be-dopant profiles in these films exhibited Be surface segregation and accumulation, which would lead to undesired leakage current paths in devices and deterioration of breakdown voltage. Improved growth kinetics of metal modulated epitaxy at low growth temperatures are applied in the study of GaN:Be films to achieve selectively controlled and abrupt step-doped Be profiles. The GaN:Be films were found to be semi-insulating via Hall effect measurements at elevated temperatures of 495 K. The films were shown to effectively electrically compensate surface contaminants at regrowth interfaces. Surface contaminants (O, Si, and C) typically result in unintentional n-type doping at the GaN on GaN regrowth interface. In order to demonstrate the utility of Be doping, GaN:Mg p-type films are grown atop GaN:Be buffer, AlN buffer, and control samples without any insulating buffer on GaN:Fe templates. Remarkably, the p-type films grown atop control samples up to 400 nm thick are compensated from surface contaminants, whereas the films grown atop AlN and GaN:Be insulating layers effectively electrically neutralize the surface contaminants and result in high hole concentrations of 2.3 and 2.5 × 1019 cm−3, respectively. The use of GaN:Be instead of AlN buffers eliminates the need to deconvolve the effects of the AlN/GaN 2D sheet charges and defects from lattice mismatch, removes lateral conduction paths, and reduces inherently high static vertical electric fields that detract from power device performance. [ABSTRACT FROM AUTHOR]

Activation of implanted donors into a highly-resistive, nitrogen-doped homoepitaxial β-Ga2O3 has been investigated. Nitrogen acceptors with the concentration of ∼1017 cm−3 were incorporated during epitaxial growth yielding low-doped (net donor concentration <1014 cm−3) films subsequently implanted with Si, Ge, and Sn. Upon Ohmic contact formation to the implanted regions, sheet resistance values of 314, 926, and 1676 Ω/sq were measured at room temperature for the Si-, Ge-, and Sn-implanted samples, respectively. Room temperature Hall measurements resulted in sheet carrier concentrations and Hall mobilities of 2.13 × 1014 /93, 8.58 × 1013/78, and 5.87 × 1013/63 cm2/(V s), respectively, for these three donor species. Secondary ion mass spectroscopy showed a volumetric dopant concentration of approximately 2 × 1019 cm−3 for the three species, resulting in carrier activation efficiencies of 64.7%, 40.3%, and 28.2% for Si, Ge, and Sn, respectively. Temperature-dependent Hall effect measurements ranging from 15 to 300 K showed a nearly constant carrier concentration in the Si-implanted sample, suggesting the formation of an impurity band indicative of degenerate doping. With a bulk carrier concentration of 1.3 × 1019 cm−3 for the Si implanted sample, a room temperature mobility of 93 cm2/(V s) is among the highest reported in Ga2O3 with a similar carrier concentration. The unimplanted Ga2O3:N regions remained highly resistive after the surrounding areas received implant and activation anneal. These results open the pathway for fabricating Ga2O3 devices through the selective n-type doping in highly resistive epitaxial Ga2O3. [ABSTRACT FROM AUTHOR]

Impact ionization coefficients play a critical role in semiconductors. In addition to silicon, silicon carbide and gallium nitride are important semiconductors that are being seen more as mainstream semiconductor technologies. As a reflection of the maturity of these semiconductors, predictive modeling has become essential to device and circuit designers, and impact ionization coefficients play a key role here. Recently, several studies have measured impact ionization coefficients. We dedicated the first part of our study to comparing three experimental methods to estimate impact ionization coefficients in GaN, which are all based on photomultiplication but feature characteristic differences. The first method inserts an InGaN hole-injection layer, the accuracy of which is challenged by the dominance of ionization in InGaN, leading to possible overestimation of the coefficients. The second method utilizes the Franz–Keldysh effect for hole injection but not for electrons, where the mixed injection of induced carriers would require a margin of error. The third method uses complementary p–n and n–p structures that have been at the basis of this estimation in Si and SiC and leans on the assumption of a constant electric field, and any deviation would require a margin of error. In the second part of our study, we evaluated the models using recent experimental data from diodes demonstrating avalanche breakdown. [ABSTRACT FROM AUTHOR]

Heterojunction field-effect transistors based on the β-(AlxGa1−x)2O3/Ga2O3 heterostructure grown by ozone-assisted molecular beam epitaxy were demonstrated for the first time. Al composition ratios in the 14%–23% range were validated using x-ray diffraction on the three samples grown for this study. Electrochemical capacitance-voltage (ECV) measurements showed the presence of a charge sheet in the delta-doped (AlxGa1−x)2O3 barrier layer. Secondary ion mass spectroscopy and ECV measurements also revealed an unintentional Si peak at the (AlxGa1−x)2O3/Ga2O3 interface. Direct current (IDS-VGS) and transconductance (Gm-VGS) measurements demonstrated depletion-mode transistor operation as well as the presence of a parallel conduction channel. A one-dimensional Poisson model suggested that dopant redistribution in the delta-doped region could cause a secondary channel to form in the barrier in addition to the primary channel near the (AlxGa1−x)2O3/Ga2O3 interface under certain conditions met in these samples. Fabricated devices on sample A did not exhibit breakdown up to the measurement limit of 1100 V, with stability after ten cycles. A maximum output drain current density of 22 mA/mm was measured on sample B. Room temperature Hall measurements yielded a sheet carrier density of 1.12 × 1013 cm−2 with corresponding Hall mobility of 95 cm2/V s in sample C. [ABSTRACT FROM AUTHOR]

The first step of a multi-cycle rapid thermal annealing process was systematically studied. The surface, structure, and optical properties of Mg implanted GaN thin films annealed at temperatures ranging from 900 to 1200 °C were investigated by Raman spectroscopy, photoluminescence, UV-visible spectroscopy, atomic force microscopy, and Nomarski microscopy. The GaN thin films are capped with two layers of in-situ metal organic chemical vapor deposition -grown AlN and annealed in 24 bar of N2 overpressure to avoid GaN decomposition. The crystal quality of the GaN improves with increasing annealing temperature as confirmed by UV-visible spectroscopy and the full widths at half maximums of the E2 and A1 (LO) Raman modes. The crystal quality of films annealed above 1100 °C exceeds the quality of the as-grown films. At 1200 °C, Mg is optically activated, which is determined by photoluminescence measurements. However, at 1200 °C, the GaN begins to decompose as evidenced by pit formation on the surface of the samples. Therefore, it was determined that the optimal temperature for the first step in a multi-cycle rapid thermal anneal process should be conducted at 1150 °C due to crystal quality and surface morphology considerations. [ABSTRACT FROM AUTHOR]

Plasma etching of p-type GaN creates n-type nitrogen vacancy (VN) defects at the etched surface, which can be detrimental to device performance. In mesa isolated diodes, etch damage on the sidewalls degrades the ideality factor and leakage current. A treatment was developed to recover both the ideality factor and leakage current, which uses UV/O3 treatment to oxidize the damaged layers followed by HF etching to remove them. The temperature dependent I–V measurement shows that the reverse leakage transport mechanism is dominated by Poole–Frenkel emission at room temperature through the etch-induced VN defect. Depth resolved cathodoluminescence confirms that the damage is limited to first several nanometers and is consistent with the VN defect. [ABSTRACT FROM AUTHOR]

Threading and basal dislocations were observed and their Burgers vectors ( b → ) were analyzed in 20 µm thick halide vapor phase homoepitaxially grown beta-gallium oxide (β−Ga2O3) films using 15 keV monochromatic synchrotron X-ray topography with symmetric reflection (004) and two asymmetric reflections (205) and (115) in back-reflection and grazing incidence angle geometries, respectively. In a 1 × 1.5 cm2 sample, threading screw dislocations with b → = 001 were observed with a density of 30 cm−2, whereas a single threading edge dislocation with b → = 100 was observed. Basal dislocations with b → = 1 2 112 were observed with a density of ∼20 cm−2, and a single basal dislocation with b → = 010 was observed. Rocking curve mapping of the three reflections was also performed on the entire sample with the same setup and a high resolution x-ray camera to obtain the full width at half maximum (FWHM), strain, and curvature maps in two almost orthogonal directions. The epilayer demonstrated excellent crystalline quality with a median FWHM of 8.2 arc sec in the (004) reflection and a very low median strain of ∼|8 × 10−5| obtained from both sample directions. The median radius of curvature was ∼−100 m along the [100] direction and ∼280 m along the [010] sample axis, indicating very low lattice plane curvature that enables high manufacturability and reliability of devices. [ABSTRACT FROM AUTHOR]

Semi-insulating halide vapor phase epitaxial β-Ga2O3 films without intentional dopants introduced during growth are demonstrated. The sheet resistance measured in the 340–480 K range yielded 268–134 kΩ/◻ and an activation energy of 0.81 eV. Room temperature capacitance-voltage measurements at 1 MHz showed evidence of an ultra-low free carrier concentration n-type film with a free carrier concentration near flatband (VFB ∼ 4.4 V) estimated to be <1014 cm−3, resulting in a high breakdown voltage of 2380 V (3.18 MV/cm) measured on a lateral diode without field termination. Secondary ion mass spectroscopy did not reveal Fe compensating species; however, an average Si concentration of about 5 × 1015 cm−3 and an N concentration of about 2 × 1017 cm−3 were detected, suggesting that N acceptors compensated Si donors to result in a nearly intrinsic β-Ga2O3 film. Photoionization spectroscopy suggested the presence of a deep acceptor-like level located at Ec −0.23 eV. [ABSTRACT FROM AUTHOR]

The electrical quality of HfO2 dielectrics grown by thermal atomic layer deposition at 175 °C on n-type (201) β-Ga2O3 has been studied through capacitance- and current-voltage measurements on metal-oxide-semiconductor capacitors. These capacitors exhibited excellent electrical characteristics, including dual-sweep capacitance-voltage curves with low hysteresis and stretch-out and a frequency-stable dielectric constant of k ~14 when measured between 10 kHz and 1MHz. The C-V curves exhibited a uniform and repeatable +1.05V shift relative to the ideal case when swept from 3.5 to ~5V, yielding positively measured flatband (+2.15 V) and threshold (+1.05 V) voltages that may be useful for normally off n-channel Ga2O3 devices. Using the Terman method, an average interface trap density of 1.3 x 1011 cm-2eV-1 was obtained between 0.2 and 0.6 eV below the conduction band edge. The forward bias current-voltage characteristic was successfully fitted to the Fowler-Nordheim tunneling model at a field strength of 5MV/cm, allowing an extraction of a 1.3 eV conduction band offset between HfO2 and Ga2O3, which matches the value previously determined from x-ray photoelectron spectroscopy. However, a temperature dependence in the leakage current was observed. These results suggest that HfO2 is an appealing dielectric for Ga2O3 device applications. [ABSTRACT FROM AUTHOR]

Proton-induced damage in AlGaN/GaN HEMTs was investigated using energy-dispersive X-ray spectroscopy (EDS) and transmission electron microscopy (TEM), and simulated using a Monte Carlo technique. The results were correlated to electrical degradation using Hall measurements. It was determined by EDS that the interface between GaN and AlGaN in the irradiated HEMT was broadened by 2.2 nm, as estimated by the width of the Al EDS signal compared to the as-grown interface. The simulation results show a similar Al broadening effect. The extent of interfacial roughening was examined using high resolution TEM. At a 2 MeV proton fluence of 6 × 1014 H+/cm², the electrical effects associated with the Al broadening and surface roughening include a degradation of the ON-resistance and a decrease in the electron mobility and 2DEG sheet carrier density by 28.9% and 12.1%, respectively. [ABSTRACT FROM AUTHOR]

InAlN/GaN high electron mobility transistors were irradiated from the front side with 340keV protons to a dose of 5 × 1013 cm-2. Raman thermography showed that the irradiated devices had higher channel temperatures than unirradiated control devices, but only by ~10% under typical biasing conditions. Accordingly, the irradiated devices have higher thermal resistance (400°C/W) compared to reference devices (350°C/W), based on the slope of the power versus channel temperature line. However, increases of 42% in off-state drain breakdown voltage (VBR) and of >92% in critical voltage (Vcri) were observed for the proton irradiated HEMT. This is ascribed to the reduction of the peak electric field at the gate edges by ~50% through the introduction of negative trap charges created from vacancies generated by the proton irradiation. [ABSTRACT FROM AUTHOR]

A threshold reverse bias of ∼21 V was observed leading to a sharp increase in the gate current of AlGaN/GaN high electron mobility transistors biased at low source-drain voltage (5 V). The gate current increases by one to two orders of magnitude at this bias, corresponding to an electric field strength around 1.8 MV cm-1. The gate current increased by roughly five orders of magnitude after step-stressing the gate bias from 10 to 42 V in 1 V increments for 1 min at each bias. The drain current was also decreased by ∼20% after this step-stress cycle. The photoluminescence and electroluminescence intensity from the semiconductor is decreased along the periphery of the gate region after stressing and transmission electron microscopy shows a thin native oxide layer under the gate and this disappears as the gate metal reacts with the underlying AlGaN. [ABSTRACT FROM AUTHOR]

Laser drilling for through-via holes was performed with a Nd:YVO4 laser for an AlGaN/GaN high electron mobility transistor (HEMT) structure on a SiC substrate. Current-voltage (I-V) characteristics, transconductance, and small signal characteristics before and after laser drilling were compared to examine the effect of laser drilling on device performance. The electrical characteristics of the HEMTs did not show significant change after laser drilling, even when performed in close proximity to the device. Laser drilling was found to be a fast and safe technique to drill via hole in AlGaN/GaN HEMT structure and provides an alternative to dry etching for creation of these vias. [ABSTRACT FROM AUTHOR]

As an emerging optical material, graphene's ultrafast dynamics are often probed using pulsed lasers yet the region in which optical damage takes place is largely uncharted. Here, femtosecond laser pulses induced localized damage in single-layer graphene on sapphire. Raman spatial mapping, SEM, and AFM microscopy quantified the damage. The resulting size of the damaged area has a linear correlation with the optical fluence. These results demonstrate local modification of sp2-carbon bonding structures with optical pulse fluences as low as 14 mJ/cm2, an order-of-magnitude lower than measured and theoretical ablation thresholds. [ABSTRACT FROM AUTHOR]

Heterojunctions of p+ B-doped nanocrystalline diamond (NCD) to n- 4H-SiC were studied by electrical and cathodoluminescence (CL) methods. Current rectification at 30 °C had a curvature coefficient γ0 of 42.1 V-1 at zero bias, γmax of 105.35 V-1 at 0.2 V, and a reverse current of <10 nA/cm2. The NCD sheet resistance decreased from 4.1×1011 to 403.56 Ω/sq. as the carrier density Ns was increased from 3.5×105 to 1.5×1016 cm-2 by B2H6 doping. The 348 cm2/V-s mobility of the B-free NCD films was comparable to that of single crystal diamond. CL data revealed traps 0.6-0.8 eV from the NCD EV edge. [ABSTRACT FROM AUTHOR]

Multiple GaN nanowires produced by thermal chemical vapor deposition were employed as gas sensors for detection of hydrogen at concentrations from 200–1500 ppm in N2 at 300 K. Palladium coating of the wires improved the sensitivity by a factor of up to 11 at low ppm concentrations relative to uncoated controls. The GaN nanowires showed relative responses of ∼7.4% at 200 ppm and ∼9.1% at 1500 ppm H2 in N2 after a 10 min exposure. Upon removal of hydrogen from the measurement ambient, ∼90% of the initial GaN conductance was recovered within 2 min. Temperature dependent measurements showed a larger relative response and shorter response time at elevated temperature. The adsorption activation energy of the sensor was 2.2 kcal mol-1 at 3000 ppm H2 in N2. These sensors exhibit low power consumption (<0.6 mW) at 300 K. [ABSTRACT FROM AUTHOR]

A novel method for creating bilayer graphene is described where single-layer CVD graphene grown on Cu is bonded to single-layer epitaxial graphene grown on Si-face SiC. Raman microscopy and x ray photoelectron spectroscopy demonstrate the uniqueness of this bilayer, as compared to a naturally formed bilayer, in that a Bernal stack is not formed with each layer being strained differently yet being closely coupled. Electrical characterization of Hall devices fabricated on the unusual bilayer show higher mobilities, and lower carrier concentrations, than the individual CVD graphene or epitaxial graphene layers. [ABSTRACT FROM AUTHOR]

The electrical quality of HfO2 dielectrics grown by thermal atomic layer deposition at 175 °C on n-type (201) β-Ga2O3 has been studied through capacitance- and current-voltage measurements on metal-oxide-semiconductor capacitors. These capacitors exhibited excellent electrical characteristics, including dual-sweep capacitance-voltage curves with low hysteresis and stretch-out and a frequency-stable dielectric constant of k ~14 when measured between 10 kHz and 1MHz. The C-V curves exhibited a uniform and repeatable +1.05V shift relative to the ideal case when swept from 3.5 to ~5V, yielding positively measured flatband (+2.15 V) and threshold (+1.05 V) voltages that may be useful for normally off n-channel Ga2O3 devices. Using the Terman method, an average interface trap density of 1.3 x 1011 cm-2eV-1 was obtained between 0.2 and 0.6 eV below the conduction band edge. The forward bias current-voltage characteristic was successfully fitted to the Fowler-Nordheim tunneling model at a field strength of 5MV/cm, allowing an extraction of a 1.3 eV conduction band offset between HfO2 and Ga2O3, which matches the value previously determined from x-ray photoelectron spectroscopy. However, a temperature dependence in the leakage current was observed. These results suggest that HfO2 is an appealing dielectric for Ga2O3 device applications. [ABSTRACT FROM AUTHOR]