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Complex interplay between hydrogen-related defect formation and passivation is observed in irradiated bipolar transistors. Hydrogen soaking experiments are performed to evaluate the dependence of defect buildup and annealing in gated lateral bipolar transistors on hydrogen exposure. Comparisons of the radiation responses of transistors tested in 2009 to identical devices from the same wafer tested in 2003 show that aging has reduced the amount of radiation-induced interface trap and oxide trapped charge formation in most cases. These results demonstrate that the way in which the radiation response of a hydrogen-sensitive device evolves with age depends on whether hydrogen is diffusing into or out of the device, and whether the initial defect concentration favors passivation or depassivation reactions. These results strongly suggest that hydrogen exposure cannot replace low-dose-rate irradiation in ELDRS tests for bipolar devices and ICs without extensive characterization testing. [ABSTRACT FROM AUTHOR]

As integrated circuits become smaller and more complex, it has become increasingly difficult to simulate their responses to radiation. The distance and time scales of relevance extend over orders of magnitude, requiring a multi-scale, hierarchical simulation approach. This paper demonstrates the use of multi-scale simulations to examine two radiation-related problems: enhanced low-dose-rate sensitivity (ELDRS) in bipolar transistors and single-event effects (SEE) in CMOS integrated circuits. Examples are included that demonstrate how information can be passed from simulation tools operating at one level of abstraction to those operating at higher levels, while maintaining accuracy and gaining insight. [ABSTRACT FROM AUTHOR]

Heavy ion-induced single events transients (SETs) in advanced digital circuits are becoming a significant reliability issue for space-based systems. In this work, two experiments are performed on devices designed to look specifically at digital single event transients. Small voltage variations, like those that can be found across an integrated circuit, are shown to affect the digital single event transient response significantly. For technologies with supply voltages near 1 V, these potential variations may result in unexpected vulnerability. [ABSTRACT FROM AUTHOR]

Radiation-induced dopant passivation is evidenced for the first time in partially-depleted SOI n-channel MOSFETs. Isochronal annealing experiments following 10 Mrad(SiO2) irradiation demonstrate that the neutralization of boron atoms in the NMOSFET body is most pronounced in the 125°C-150°C temperature range. This results in an abrupt decrease of the threshold voltage and the subthreshold swing, due to the transition of the body from partial to full depletion. The SO! four-gate transistor, inherently present in the partially-depleted MOSFET structure, is demonstrated to be a very efficient tool for monitoring dopant neutralization through irradiation and annealing. Radiation-induced dopant passivation has important consequences regarding the reliability of short-channel partially-depleted NMOSFETs. [ABSTRACT FROM AUTHOR]

Degradation due to irradiation is known to be associated with the presence of hydrogen in the bulk of the gate oxide, in bulk Si, and at the Si/SiO2 interface. Previous studies have shown that the migration of protons in the oxide for positive applied gate bias and their reactions at the interface can account for the time and dose-rate dependence of the degradation. Recent experiments, however, have shown that interfacial degradation can occur even in the presence of strong negative gate bias that prevents the arrival of protons at the interface from the oxide side. This result suggests that mechanisms in addition to proton drift in SiO2 can lead to radiation-induced interface-trap formation. Since previous work on modeling the enhanced low-dose-rate sensitivity (ELDRS) of irradiated bipolar devices was based on formation of an electrostatic barrier that hinders proton transport to the interface at high dose rates, this effect also must be examined in more detail. In this work we use results from first-principles calculations to demonstrate that hydrogen can also be released easily in bulk Si, and especially in the near interfacial area. This hydrogen moves readily to the interface under negative bias. Typical hydrogen precursors in Si are identified as H-dopant complexes. ELDRS shares thus a common origin with another critical reliability phenomenon, the negative bias-temperature instability. [ABSTRACT FROM AUTHOR]

The radiation effects community has long known that single event transients in digital microcircuits will have an increasing importance on error rates as device sizes shrink. However separating these errors from static errors in latch cells has often proved difficult. Thus determining both the significance and the nature of these transient errors has not been easy. In this study, by utilizing a latch that is radiation hard at static clock frequencies the errors due to transients could be separated. By separating the transient error rate from the static upset error rate, the pulse structure of the propagating transients was studied using SPICE. The implications of these pulsewidths will also be discussed. [ABSTRACT FROM AUTHOR]

An overview is presented of displacement damage (DD) effects, total-ionizing-dose (TID) effects, and single-event effects in AlGaN/GaN high electron mobility transistors (HEMTs). High-fluence proton-induced DD creates point defects and impurity complexes at fluences that are comparable to or higher than those encountered in space applications. Defect and impurity dehydrogenation also contributes significantly to the DD/TID response at fluences typical of realistic space environments. The bias applied during irradiation can affect the DD/TID response strongly. Bias stress before irradiation can lead to enhanced proton-induced degradation of AlGaN/GaN HEMTs. Low-frequency noise measurements and density functional calculations provide insight into defect microstructures and energy levels. GaN-based HEMTs can be quite vulnerable to single-event effects in space. Of particular concern is single-event burnout (SEB). The vulnerabilities of GaN-based devices to SEB at voltages below rated limits and significant device-to-device variations in SEB response lead to significant voltage derating for GaN-based power devices in space systems. Developing an improved understanding of the effects of defects and hydrogen on the radiation response of AlGaN/GaN HEMTs can improve the DD/TID response by reducing threshold-voltage shifts and transconductance degradation. Reducing defect densities may also reduce the variation in SEB response, enabling reliable device operation at higher voltages in future space systems. [ABSTRACT FROM AUTHOR]

Gallium nitride (GaN) has attracted great attention as a structural material for advanced microelectromechanical systems (MEMS), thanks to its excellent ensemble of electrical and mechanical properties. Here, we report on studying the effects of ion radiation-induced displacement damage on resonant MEMS made of GaN film grown on aluminum nitride (AlN) buffer layer. We design and fabricate GaN/AlN heterostructure doubly-clamped microstring resonators with length $L \,\, =100$ , 200, 300, 400, 500, 600, and 700 $\mu \text{m}$ , and irradiate the devices with 440-keV Ar $^{+}$ ions, to probe the effects of ion radiation-induced displacement damage on the resonance behavior. The ion energy and range have been selected so that the ions would stop within the GaN layer, thus allowing diagnostics to show the effects of damage in the structure. The multimode resonance frequencies of the devices decrease significantly ($\vert \Delta f\vert /f >50$ %) with the increase of fluence beyond 1014 cm−2. According to scanning electron microscopy (SEM) imaging, the irradiated GaN/AlN resonators are visibly deformed at high fluence, where the amount of curvature increases monotonically with the fluence. The deformation of the structures can be ascribed to the change in both Young’s modulus and built-in stress resulting from ion radiation-induced displacement damage. The results extend the understanding of radiation-induced damage mechanisms in resonant MEMS. [ABSTRACT FROM AUTHOR]

A physics-based TCAD model for enhanced low-dose-rate sensitivity in linear bipolar devices is developed. Quantitative agreement is found with measured data over a wide range of dose rates and H2 concentrations. Analysis of the degradation effects of individual defect types, the implementation of which has been informed by first principles calculations, provides insights into the mechanisms behind enhanced low-dose-rate effects in different hydrogen environments. The effects of initial defect concentration and location and the energetics of the defect-related reactions are explored. Conclusions are drawn about the roles of molecular hydrogen and hydrogenated defects in the radiation response of these devices. [ABSTRACT FROM PUBLISHER]

Low-frequency (1/f) noise measurements were performed at room temperature as a function of gate bias on field-oxide field effect transistors (FOXFETs) that were irradiated with 10-keV X-rays and then annealed at room temperature. The resulting oxide-trap and interface-trap charge densities were estimated by the midgap charge separation technique. Some devices also were exposed to 85% relative humidity at 130degC for three days after irradiation and annealing. Effective border trap densities were estimated from noise measurements in each case. The noise magnitude increases after irradiation and decreases first during annealing and then even more significantly after moisture exposure. The post-humidity-exposure noise for the irradiated devices is well below the pre-irradiation noise for these devices and experimental conditions. The increased noise due to irradiation is attributed to O vacancies and hydrogen bridge (Si-H-Si) defects in the near-interfacial field oxide. The reduction in noise with room-temperature annealing and humidity exposure is due to a combination of thermal and tunnel annealing processes and defect passivation reactions involving water. [ABSTRACT FROM PUBLISHER]

Radiation induced charge trapping in ultrathin HfO2-based n-channel MOSFETs is characterized as a function of dielectric thickness and irradiation bias following exposure to 10 keV X-rays and/or constant voltage stress. Positive and negative oxide-trap charges are observed, depending on irradiation and bias stress conditions. No significant interface-trap buildup is found in these devices under these irradiation and stress conditions. Enhanced oxide-charge trapping occurs in some cases for simultaneous application of constant voltage stress and irradiation, relative to either type of stress applied separately. Room temperature annealing at positive bias after irradiation of transistors with thicker gate dielectric films leads to positive oxide-trapped charge annihilation and/or neutralization in these devices, and net electron trapping. The oxide thickness dependence of the radiation response confirms the extreme radiation tolerance of thin HfO2 dielectric layers of relevance to device applications, and suggests that hole traps in the thicker layers are located in the bulk of the dielectric. A revised methodology is developed to estimate the net effective charge trapping efficiency, fot, for high-κ dielectric films. As a result, estimates of fot for Hf silicate capacitors and Al2O3 transistors in previous work are reduced by up to 18%. [ABSTRACT FROM AUTHOR]

Analog-to-digital converters (ADCs) with different topologies respond differently to total ionizing dose (TID). A flexible behavioral modeling approach is proposed for system-level simulation of TID effects in successive-approximation-register (SAR) ADCs. The radiation-enabled approach can be adapted for a wide range of ADCs of various resolutions, clock speeds, and manufacturers. The empirical model is calibrated and validated, pre-rad and post-rad, for a particular ADC. Pre-rad calibration is performed by introducing distributions of static parameters corresponding to datasheet specifications. The post-rad calibration is accomplished by introducing error sources associated with the comparator and digital-to-analog converter (DAC), corresponding to experimental data. The calibrated model is used to examine the dynamic performance and to estimate the probability of parametric failure during the mission lifetime. [ABSTRACT FROM AUTHOR]

Heavy-ion measurements are used to define a multiply nested sensitive-volume model for a 180-nm static random access memory (SRAM) test structure using the Monte Carlo radiative energy deposition (MRED) tool. We demonstrate that the fundamental assumptions of simple rectangular-parallelepiped (RPP) or integral-RPP models are inappropriate for single-event latchup (SEL) in this test structure, indicating that more advanced modeling is needed. We develop an MRED model that agrees well with latchup data at normal incidence and at roll and tilt angles of 60°. This process should facilitate estimates of SEL cross section and event rates for this and similar technologies in space environments. [ABSTRACT FROM AUTHOR]

Variability of the solar energetic particle environment is investigated for single-event burnout (SEB) reliability of silicon carbide power metal-oxide-semiconductor field-effect transistors. A probabilistic assessment of failure evaluates the benefits of derating voltage, shielding, and mission length. The Prediction of Solar particle Yields for Characterizing Integrating Circuits code is used to calculate a cumulative density function for the fluence of the environment. The lethal ion method is then used to determine what proportion of the environment will cause SEB. The operating voltage determines the lowest linear energy transfer (LET) particle that will cause SEB, and that should be included in the environment distribution. The shielding and mission length also determines the final environment distribution of the mission fluence. When the critical LET for a device is relatively low for the expected mission environment, the method in this article can calculate the probability of failure from a destructive event. The calculated probability of failure enables the consideration of part use outside the safe operating area, especially when derating the operating voltage would eliminate the technology advantage of the part. [ABSTRACT FROM AUTHOR]

Silicon-on-insulator latch designs and layouts that are robust to multiple-node charge collection are introduced. A general Monte Carlo radiative energy deposition (MRED) approach is used to identify potential single-event susceptibilities associated with different layouts prior to fabrication. MRED is also applied to bound single-event testing responses of standard and dual interlocked cell latch designs. Heavy ion single-event testing results validate new latch designs and demonstrate bounds for standard latch layouts. [ABSTRACT FROM AUTHOR]

Lighter doping, pretreatment (exposure to hydrogen in a steam bath), and lower dose rate are each found to exacerbate 10-keV X-ray-induced negative frequency shifts and increase in resistivity measured in T-shaped, asymmetric, piezoresistive, micromachined, and resonating cantilevers. All devices recover to levels close to preirradiation after several hours of postirradiation annealing. The effects are attributed to dose-rate-dependent efficiencies of the depassivation of dopants by hydrogen and surface charging effects, which alter the effective Young’s modulus and shear elastic constants. Increases in resistivity are attributed to increases in scattering causing decreases in mobility. Results indicate the need to consider dopant type and concentration when choosing microelectromechanical systems for use in radiation environments in addition to accounting for low-dose-rate effects. [ABSTRACT FROM AUTHOR]

The radiation response of complementary metal–oxide–semiconductor (CMOS) gate oxides is typically insensitive to true dose-rate effects, but damage in deep-sub-micrometer technologies is dominated by ionization mechanisms in thick isolation oxides surrounding the transistors. Recent results in 65-nm FETs demonstrated that performance degradation in ultrahigh total ionizing dose (TID) experiments is due to defects in the isolation shallow trench isolation oxide or in the materials composing the lightly doped drain spacers. These insulators are thick, deposited, and crossed by a low electric field, characteristics similar to those typical of passivation oxides in linear bipolar technologies for which an enhanced low-dose-rate sensitivity (ELDRS) has been observed and systematically studied. We report in this paper the clear evidence of a dose-rate sensitivity of the TID-induced damage in both 130- and 65-nm CMOS technologies exposed to different radiation sources (X-rays and $\gamma $ -rays from a 60Co source). This sensitivity is attributed to mechanisms similar to those explaining ELDRS in bipolar devices and represents a significant challenge to the definition of a qualification procedure for circuits to be used in extreme radiation environments. [ABSTRACT FROM AUTHOR]

Total-ionizing-dose-induced resonance frequency shifts in piezoresistive micromachined cantilevers are experimentally shown to be dose-rate dependent. Devices were irradiated to 1 Mrad(SiO2) at rates from 5.4 to 30.3 krad(SiO2)/min, with lower rate exposures producing up to four-times more negative frequency shifts than higher rate exposures. Devices that were hydrogenated in a steam bath for 1 h showed shifts similar to those of control (not hydrogenated) devices at higher dose rates, and larger shifts than control devices at lower rates. All devices recovered to levels close to preirradiation after several hours of post-irradiation annealing. The dose-rate dependence is attributed to differences in carrier concentration caused by varying efficiencies of the depassivation of boron by hydrogen at higher and lower dose rates and/or surface charging effects, and the subsequent differences in Young’s modulus that occur as a result. Many of these processes are similar to effects that lead to ELDRS in linear bipolar transistors, emphasizing the need to include low-dose-rate testing of microelectromechanical systems devices when considering them for use in space systems. [ABSTRACT FROM PUBLISHER]

A probabilistic Bayesian modeling method for determining the effects of radiation-induced component-level parameter shifts on system-level performance is described. The modeling method incorporates information about the system design and component-level degradation into a Bayesian network and performs inference on the constructed network using Markov chain Monte Carlo approaches, producing distributions for the range of component responses. Deterministic simulations use the results of the Bayesian inference to determine the combined impact of multiple degraded components on system performance quantities. The goal of the modeling approach is to turn uncertain information into actionable knowledge. The utility of this approach is demonstrated using a case study based on total ionizing dose degradation of line-sensor components in a simple line-tracking robot system. [ABSTRACT FROM PUBLISHER]

MRED is a Python-language scriptable computer application that simulates radiation transport. It is the computational engine for the on-line tool CRÈME-MC. MRED is based on c++ code from Geant4 with additional Fortran components to simulate electron transport and nuclear reactions with high precision. We provide a detailed description of the structure of MRED and the implementation of the simulation of physical processes used to simulate radiation effects in electronic devices and circuits. Extensive discussion and references are provided that illustrate the validation of models used to implement specific simulations of relevant physical processes. Several applications of MRED are summarized that demonstrate its ability to predict and describe basic physical phenomena associated with irradiation of electronic circuits and devices. These include effects from single particle radiation (including both direct ionization and indirect ionization effects), dose enhancement effects, and displacement damage effects. MRED simulations have also helped to identify new single event upset mechanisms not previously observed by experiment, but since confirmed, including upsets due to muons and energetic electrons. [ABSTRACT FROM AUTHOR]

The impact of high-Z metals on energy deposition in thin volumes due to direct ionization by ions in space environments is examined. The importance of energy loss straggling in small volumes typical of those found in advanced devices is also evaluated. It is found that direct ionization by protons over a large energy range may contribute significantly to error rates in advanced silicon on insulator devices due to energy loss straggling. This improves on conventional event rate analysis based on linear energy transfer, which does not describe the contributions of direct ionization by protons to the error rate. [ABSTRACT FROM AUTHOR]

The total-ionizing-dose robustness of low power microcontrollers is investigated. Experiments reveal that with increasing total ionizing dose (TID), the “Timing Window Violations,”i.e., inability of the instruction set to execute within the clock-cycle(s) lead to failures in microcontroller operations. Clock frequency and supply voltage of the microcontroller are varied to determine the maximum clock frequency at which the microcontroller can execute software subroutines without failure. Low power microcontrollers from two different manufacturers were tested. The maximum clock frequency decreases with increasing TID for both parts. A model for the degradation based on analysis of circuit level timing models is presented. The microcontroller robustness implications for system designers and ASIC designers are discussed. [ABSTRACT FROM PUBLISHER]

In this paper, we describe a Monte Carlo approach for estimating the frequency and character of single event effects based on a combination of physical modeling of discrete radiation events, device simulations to estimate charge transport and collection, and circuit simulations to determine the effect of the collected charge. A mathematical analysis of the procedure reveals it to be closely related to the rectangular parallelepiped (RPP) rate prediction method. The results of these simulations show that event-to-event variation may have a significant impact when predicting the single-event rate in advanced spacecraft electronics. Specific criteria for supplementing established RPP-based single event analysis with Monte Carlo computations are discussed. [ABSTRACT FROM AUTHOR]

There is a need for improved physics models to correctly predict single event effects (SEEs) caused by nuclear reaction products from heavy ion radiation. Previous validations for nuclear fragmentation simulations are shown to be insufficient to support SEE analysis applications. A comparison of different physics models with experimental nuclear physics data coupled with energy deposition predictions is presented. [ABSTRACT FROM AUTHOR]

Bipolar test structures were irradiated and annealed with various combinations of molecular hydrogen gas ambients, bias, and thermal conditions. The results show that the buildup and annealing behavior of defects in bipolar base oxides depend strongly on hydrogen concentration. Differences observed in trapped oxide charge annealing rates suggest that the charged defects created in hydrogen-rich environments may be attributed to different types of positive charge in addition to trapped holes. [ABSTRACT FROM PUBLISHER]

Monte-Carlo radiation transport code is coupled with SPICE circuit level simulation to identify regions of single event upset vulnerability in an SEU hardened flip-flop, as well as predict single event upset cross sections and on-orbit soft error rates under static and dynamic operating conditions. [ABSTRACT FROM PUBLISHER]

Transistors and ICs built in several different captive and commercial facilities were exposed to moisture, irradiated, and annealed. The moisture exposures were performed using highly accelerated stress test (HAST) at 130degC and 85% relative humidity. Irradiation of n-channel transistors exposed to HAST followed by a long-term anneal resulted in some increase in interface-trap and oxide-trapped charge buildup. However, exposing p-channel transistors to HAST preirradiation resulted in extremely large and unexpected voltage shifts immediately following irradiation. They were observed for devices with either doped oxide or nitride final chip passivation. Because of this, nitride passivation may not be sufficient to prevent H2O from causing enhanced radiation-induced degradation over long time periods in some devices (e.g., commercial devices with nitride final chip passivation packaged in plastic packages). The smaller voltage shifts for the n-channel transistors may be related to the formation of phosphosilicate glass (PSG) overlying the sources and drains of the n-channel transistors impeding the diffusion of moisture to the gate oxides. It is shown that, the large radiation-induced voltage shifts for the p-channel transistors can lead to enhanced IC parametric degradation and functional failure at lower radiation levels. Large increases in radiation-induced field oxide leakage current were also observed for transistors exposed to HAST preirradiation. Transistors were also annealed (prior to irradiation) and irradiated in H2. Approximately the same level of radiation-induced degradation was observed for n- and p-channel transistors suggesting that the diffusion kinetics for H2 diffusion are considerably different than for H2O diffusion. These results raise the concern that exposure of devices to moisture or hydrogen can lead to long-term radiation-induced aging effects. [ABSTRACT FROM PUBLISHER]

Radiation-induced charge trapping and mobility degradation are measured on uniaxially stressed HfO2-based nMOSFETs. Controlled external mechanical stress is applied via a four-point bending jig while the samples are irradiated using 10-keV X-rays. Positive charge trapping is observed for unstressed devices, and for devices irradiated under both compressive and tensile stress. Reduced trapped charge is measured as the uniaxial stress level increases. These results suggest that the increased stress leads to a reconfiguration of defect microstructure, as compared to the unstressed devices. The reconfiguration consists of changes in bond lengths and angles and a corresponding change in trap energy levels, which can (1) reduce the probability that a defect can capture holes, (2) increase the probability for electron and trapped-hole recombination, and/or (3) increase the mobility of the transporting holes in the oxides of the devices that are irradiated under stress. These results show that increased mechanical stress in high-k dielectrics does not degrade their radiation hardness. We also observe that the post-irradiation channel mobility degrades less in uniaxially stressed devices than unstressed devices. [ABSTRACT FROM PUBLISHER]

Single event latchup (SEL) in a 65 nm CMOS technology is examined with respect to strike angle of incidence and variations in device temperature. A significant difference in device sensitivity is observed with a change in the orientation of grazing angle strikes. The impact of an extremely high aspect ratio sensitive volume on SEL rate is discussed. It is suggested that SEL experiments should be conducted at various lateral orientations when near-grazing beam angles are tested. [ABSTRACT FROM AUTHOR]

Proton-induced energy deposition in a silicon P-i-N focal plane array is analyzed with Monte Carlo based simulations. These simulations include all physical processes, including events resulting from multiple particles incident on a single pixel, to describe the experimental data accurately. Post-processing of Monte Carlo simulations is done to account for the effects of pile up (multiple hits on a single pixel during one integration time) and non-radiation-induced noise in experiment. The results are compared with experimental data, and demonstrate how direct ionization dominates the cross section, yet fluctuations in dE/dx cause a broad range of energy depositions not addressed by an average LET calculation. An event rate is predicted for a full space proton flux and the dominance of direct ionization is shown and compared to computation using constant LET methods in CREME96. This comparison shows that at lower energies, CREME96 sufficiently predicts the event rate, but at higher energies a high fidelity simulation method is needed to capture the distribution. [ABSTRACT FROM AUTHOR]

The impact of 63.3 MeV proton and 10 keV x-ray irradiation on the DC and AC performance of complementary (npn + pnp) SiGe HBTs on thick-film SOI is investigated. Proton and x-ray induced changes in the forward and inverse Gummel characteristics, the output characteristics, and avalanche multiplication are reported for both npn and pnp SiGe HBTs, at both room temperature (300 K) and at cryogenic temperatures (down to 30 K). Comparison of room temperature and cryogenic data suggests interface trap formation at two distinct physical locations in the transistors. Experimental data and calibrated TCAD simulations are used to compare the radiation response of both thick-film SOI devices and thin-film SOI SiGe HBTs. [ABSTRACT FROM AUTHOR]

This paper evaluates the radiation responses of 2.5 V 110 transistors and regular-threshold MOSFETs from a 90 nm commercial bulk CMOS technology. The data obtained 60Co ionizing radiation experiments indicate enhanced TID susceptibility in 110 devices and circuits, which is attributed to the p-type body doping. A quantitative model is used to analyze the effects of doping and oxide trapped charge buildup along the sidewall of the shallow trench isolation oxide. These effects are captured in the general electrostatic equation for surface potential, which can be correlated to off-state leakage current. Device simulations are used in concert with experimental measurements and the analytical model to provide physical insight into the radiation response of each device type. [ABSTRACT FROM AUTHOR]

The radiation tolerance of strained Si/SiGe n-MODFETs is investigated, using 10 keV X-rays, 63 MeV high energy protons, and 4 MeV low energy protons. The effects of radiation exposure on two major device design parameters (LSD and LG) in T-gate Si/SiGe n-MODFETs devices are examined. A strong dependence on source-drain spacing is observed for both the DC and RF characteristics. A drift-diffusion TCAD framework is used for 2-D device simulations. We believe that the low energy protons damage the SiGe/strained-Si/SiGe lattice, leading to partial strain relaxation. The conduction band-offset (CBO) of the strained SiGe/Si heterojunction is lowered leading to higher gate current leakage. The presence of radiation-induced bulk traps in the unrelaxed SiGe layers on the device behavior is also investigated. [ABSTRACT FROM AUTHOR]

We investigate the effects of both X-ray and proton irradiation on a novel 200 GHz/90 GHz (npn/pnp) complementary SiGe:C HBT technology. The dc forward mode total dose tolerance of the pnp HBTs is shown to exceed that of the npn HBTs by a significant margin after being subjected to both 63-MeV proton and 10-key X-ray sources, while the ac characteristics of both devices exhibit no degradation up to X-ray doses as high as 1.8 Mrad(SiO2). Pre- and post-irradiation results from a current feedback operational amplifier implemented in this technology and irradiated up to a dose of 1.8 Mrad(SiO2) are presented, showing no degradation in performance metrics under two low current density bias configurations. [ABSTRACT FROM AUTHOR]

Proton and X-ray irradiation effects are investigated in 0.35 µm conventional, annular, and ringed-source radiation-hardening-by-design (RHBD) CMOS devices. Transistors were irradiated with protons at both 300 K and 77 K. Radiation-induced oxide trapped charges in the shallow trench isolation (STI) oxide deplete the p-substrate and effectively shunt the source and drain, inducing off-state leakage. Without the STI, RHBD nFETs exhibit no radiation-induced off-state shunt leakage currents for devices irradiated at both 300 K and 77 K. Conventional 0.35 µm pFETs were not degraded by proton irradiation, since the leakage path cannot be formed in the n-well. A simple CMOS logic inverter shows no degradation in output voltage after proton irradiation for all tested temperature and bias conditions. More advanced 130 nm node nFETs show less TID sensitivity to STI leakage due possibly to the smaller physical STI volume and/or additional doping located on the STI sidewall. [ABSTRACT FROM AUTHOR]

Using mixed-mode annealing to help evaluate the responses of modern bipolar transistors, we compare the damage processes associated with X-ray irradiation-induced and hot carrier-induced damage in SiGe HBTs. Stress and radiation measurements indicate that the by-products of both X-ray irradiation-induced and hot carrier-induced trap reactions are identical. We use calculations to better understand the operative damage mechanisms, and find that a hydrogen reaction-diffusion model can predict the observed characteristics of our measurements. Calculations indicate that the transport of hydrogen molecules inside the emitter-base oxides determines the trap generation and recovery processes. [ABSTRACT FROM AUTHOR]

Radiation effects on four common DC linear voltage regulators are investigated. Increasing total dose is shown to degrade converter regulation by degrading the loop gain and phase response. Regulator single event transient (SET) response is characterized, and a mitigation technique is proposed. Shunt regulator topologies are found to be superior to series regulator topologies in terms of radiation tolerance. [ABSTRACT FROM AUTHOR]

The total dose radiation response of nitrided and non-nitrided n-type 4H-SiC is reported for metal oxide semiconductor capacitors exposed to 10-keV X-rays under positive bias. The radiation response is affected strongly by differences in the SiC band gap and interface/near interface SiO2 trap density from typical Si MOS devices. Significantly higher net trapped positive charge densities were observed in nitrided n-SiC MOS capacitors compared to the non-nitrided samples. The mechanisms contributing to the differences in the charge trapping in these devices are discussed. Differences in the interfacial layer between SiO2/Si and SiO2/SiC are responsible for the observed dissimilarities in charge trapping behavior. [ABSTRACT FROM AUTHOR]

We present measurements of proton-induced single event transients in ultra-low noise HgCdTe IR detector arrays being developed for space-based astronomy and compare to modeling results. [ABSTRACT FROM AUTHOR]

Proton irradiation decreases the doping concentration and increases the ideality factor and series resistance, but has very little effect on the Schottky barrier height in n-Gallium nitride Schottky diodes. 1.0-MeV protons cause greater degradation than 1.8-MeV protons because of their higher nonionizing energy loss. The displacement damage recovers during annealing. Comparison between Schottky diodes and high electron-mobility transistors suggests that the degradation in both types of devices is predominantly due to carrier removal and mobility degradation caused by radiation-induced defect centers in the crystal lattice, with interface disorder playing a relatively insignificant part in overall device degradation. [ABSTRACT FROM AUTHOR]

Total ionizing dose effects on fully-depleted (FD) silicon-on-insulator (SOI) transistors are studied when the devices are operated in single gate (SG) and double gate (DG) mode. The devices exhibit superiority in mobility and drain current when op- erated in DG mode compared to SG mode. Moreover, the dc characteristics of DG operated device are less vulnerable to total dose radiation induced damage. In particular, radiation-induced interface traps have less electrical effect in DG mode operation. [ABSTRACT FROM AUTHOR]

1.8 MeV proton radiation-induced degradation in high electron mobility transistors with Si-doped AIxGa1-xN and thick GaN cap layersis studied up to a fluence of 1 × 1015 protons/cm2 . The thick GaN cap layer reduces sheet charge modulation induced by the surface states, as it electrostatically separates the active device layers from the surface, thereby enhancing the device performance. The devices exhibit good tolerance up to 1014 protons/cm2, with displacement damage being the primary degradation mechanism. Charged defect centers introduced by proton radiation in the active device layers degrade carrier mobility and sheet carrier density. Proton radiation alters the barrier height at the Schottky gate and increases the resistance of the thin film structure. [ABSTRACT FROM AUTHOR]

We examine the limits of performing single-event simulations using pre-averaged radiation events. Geant4 simulations show the necessity, for future devices, to supplement current methods with ensemble averaging of device-level responses to physically realistic radiation events. Initial Monte Carlo simulations have generated a significant number of extremal events in local energy deposition. These simulations strongly suggest that proton strikes of sufficient energy, even those that initiate purely electronic interactions, can initiate device response capable in principle of producing single event upset or microdose damage in highly scaled devices. [ABSTRACT FROM AUTHOR]

Presents a study that examined the enhanced low-dose-rate sensitivity phenomenon with the use of rate equations for electrons, holes, protons and Poisson's equation. Investigation of the radiation-induced degradation of several bipolar transistors; Analysis of space-charge effects; Assessment of interface-trap formation.