21 results on '"Xing, Charles"'
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2. Study on Effects of Slurry Key Factors on Advanced Oxide CMP Performance
3. Novel Approach for W Loss Defect Prevention on WCMP Re-Clean Process
4. The Influence of The SIN Cap Process on The Voltage Breakdown and Electromigration Performance of Dual Damascene Cu Interconnects
5. Study on the Ring Type Crater Defect Reduction in Cu CMP Process
6. A Robust Shallow Trench Isolation High Density Plasma Chemical Vapor Deposition Void Free Process for 0.13μm CMOS Technology
7. Fab Environment Effect on Crescent Pits Defect in Cu Metallization Process
8. Effective Approach for Hillock Defect Reduction in Cu Metallization Process
9. Study on Al-Ge Bonding and Quality Improvement in CMEMS Process
10. WCVD Seam Hole Improvement to Prevent BEOL Copper Diffusion
11. Investigation of Mechanical Effects on Advanced Copper CMP
12. Mechanism and Solution of Isb Failure on Deep Trench DRAM
13. Fab Environment Effect on Crescent Pits Defect in Cu Metallization Process
14. Study on Al-Ge Bonding and Quality Improvement in CMEMS Process
15. Effective Approach for Hillock Defect Reduction in Cu Metallization Process
16. A Robust Shallow Trench Isolation High Density Plasma Chemical Vapor Deposition Void Free Process for 0.13?m CMOS Technology
17. Study on the Ring Type Crater Defect Reduction in Cu CMP Process
18. The Influence of The SIN Cap Process on The Voltage Breakdown and Electromigration Performance of Dual Damascene Cu Interconnects
19. Novel Approach for W Loss Defect Prevention on WCMP Re-Clean Process
20. Study on Effects of Slurry Key Factors on Advanced Oxide CMP Performance
21. Studies of Wafer Backside Micro-arcing Prevention In Encore Ta Process
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