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Your search keyword '"Packaging Density"' showing total 7 results
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7 results on '"Packaging Density"'

1. A system design perspective on optical interconnection technology

Author

Nordin, Ronald A. and Levi, Anthony F.J.

Subjects
Chip Packaging, Circuit Printing, New Technique, Circuit Design, Research and Development, Packaging Density, American Telephone and Telegraph Co. -- Research, Integrated circuits -- Design and construction, Printed circuits -- Innovations
Published
1993

2. The technology of molded multichip modules

Author

Zimmerman, Michael A.

Subjects
Chip Packaging, Packaging Density, Multichip Module, New Technique, Circuit Design, Research and Development, American Telephone and Telegraph Co. -- Research, Integrated circuits -- Design and construction, Integrated circuit fabrication -- Innovations, Packaging density (Electronics) -- Research
Published
1993

3. Developing a soft X-ray projection lithography tool

Author

Stulen, Richard H. and Freeman, Richard R.

Subjects
X-Rays, Photolithography, Circuit Design, Packaging Density, Research and Development, New Technique, Chip Packaging, Laser, Integrated Circuit Fabrication, Sandia Laboratories, Lucent Technologies Inc. Bell Laboratories -- Research, United States. Sandia National Laboratories -- Research
Published
1991

4. Challenges in lithographic materials and processes

Author

Reichmanis, Elsa and Thompson, Larry F.

Subjects
Technology, Photolithography, New Technique, Research and Development, Very-Large-Scale Integration, Integrated Circuit Fabrication, X-Rays, Packaging Density, Future Technologies
Published
1990

5. Polymers in electronics packaging

Author

Manzione, Louis T. and Lando, David J.

Subjects
Integrated Circuit Fabrication, Technology, Microelectronics, Chip Packaging, Packaging Density, New Technique, Research and Development, Manufacturers, User Need, Miniaturization, Performance Improvement, AT&T Corp. AT&T Microelectronics Div. -- Research
Published
1990

6. Materials and processing: core competencies and strategic resources

Author

Patel, C. Kumar, N.

Subjects
Computer-Aided Manufacturing, Materials Handling, Automation, Process Control, Research and Development, New Technique, Business Planning, Strategic Planning, Integrated Circuit Fabrication, Semiconductor Preparation, Technology, Packaging Density
Published
1990

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