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The article talks about the hybrid no-flow underfill for flip chip process. The author cites the obstacles in conventional no-flow underfill processes, such as the voiding and subsequent failure of parts due to solder extrusion into voids. Moreover, the experiment which aims to develop and measure the reliability of a hybrid no-flow underfill assembly process is presented. It uses a capillary flow dynamic with an edge patterned dispense of no-flow fluxing underfill materials.

Introduces new products for use in the electronic industries. Functionality of Hysol FP4548FC underfill, developed and manufactured by Henkel Corp.; Features of the Micron-class high-accuracy mass imaging platform, developed by DEK International GmbH; Uniqueness of the Sidewinder copper interconnection technology from SiliconPipe Inc.

Discusses the benefits of the flip chip bump connection technology for the production of integrated circuits. Reduction of interconnect length; Suitability of bump connections for higher-frequency applications; Elimination of solder packaging solutions.

This article presents information on several new electronic products. Wave Solder Flux 3592-35 is developed for lead-free wave soldering of mixed-technology and through-hole electronic assemblies. It is a no-clean, halide-free material that provides enhanced heat stability for the higher temperatures required in lead-free wave soldering processes. The 8800 FC Quantum platform enables high throughput in a single machine for various flip chip applications. AQUANOX A4520 cleans reflowed no-clean and lead-free flux residues.

Focuses on the flip chip bonding and flexible substrates. Use of conductive and nonconductive adhesives; Measurement of contact resistance; Design of polyimide test dice.

Discusses the processing and reliability of corner-bonded chip scale packages (CSP). Application of underfill close to the edge of a flip chip or CSP; Increased CSP reliability with corner-bonding underfill materials; Use of an in-house designed test board and selected packages.

Discusses how a newly discovered azeotrope-like mixture with improved performance can be a viable process alternative in flip chip cleaning with vapor phase solvents. Two mechanisms comprising solvent cleaning; Good wetting characteristics and extremely low solvent viscosity and surface tension provided by vapor phase solvent.

Focuses on the employment of flip chip technology in electronics packaging. Increase in the number of electronic packages using flip chip technology; Flip chip packages for a range of products; Development of substrate technology for organic materials; Inherent advantages of flip chip technology; Types of flip chip package; Flip chip assembly process.

The article offers information about the use of the process of flip chip probing in electronic packaging. It has traditionally been used to clean the probe card. It is stated that the strategy of cleaning the wafers can reduce the operational cost, improve the throughput and also increase known good die (KGD) without the use of ineffective plasma tools.

The article discusses the development of high-density interconnection package called the flip chip system-in-package (FCSiP). This has become essential in fast-growing electronic industries such as server, network, and telecommunication applications. With this, a design of experiments analysis was used to carry out finite element analysis and predict optimized FCSiP construction and assembly material sets.

The article focuses on the issues and technical problems surrounding the flip chip assembly as the market demands cost-effective and lead-free electronics. It presents the various innovations of electronic firms in meeting these demands. According to Prismark Partner's Semiconductor & Packaging Report, within five years the eletroplated solder and electroplated gold bumped wafers will drop its total production while the trasfer-bumped and copper-bumped wafers are expected to grow.

The article focuses on the advantages of using nanobump flip chips for micro-packaging applications on nano-transistors. Such method has successfully been tested by Fujitsu Ltd. and Fujitsu Laboratories Ltd. through assembling a flip chip high-power amplifier (HPA) with carbon nanotube (CNT) bumps. According to such test, it has proved to double the power handling capability of high-frequency amplifiers for mobile and satellite communications.

The article focuses on the flip chip technology as the method-of-choice for various low-pin-count applications. It explains that the flip chip technology is the defacto interconnection method for high-performance packages such as personal computers, high-speed memory, microprocessors and high-end application IC. Although high-performance packages represent a portion of activity in revenue, it is the low-performance versions that fuel volume growth.

The article offers information on the use of a laser-assisted system for flip chip assembly. The system produces lower thermal stress on the chip and substrate, reduces time required to make bonds and allows for the use of newer, low-cost materials. Typical applications are in the manufacturing of flexible circuits on smart cards and smart labels. Some of the benefits are compatibility with soldering and adhesive joining for flip chip attach, shorter soldering and adhesive curing times, compatibility with flip chip and resistor/capacitor attach and indifference to substrate selection.

The article focuses on the development of power light-emitting diodes (LEDs). There are three critical problems that must be solved for power LEDs to achieve growth in high-volume consumer markets. One of the problems is to get more power out of less space. Another is to eliminate lead in packaging and maintain competitive pricing. Testing and initial production indicate that the assembly of gold stud-bump flip chip with thermosonic gold-to-gold interconnects may be the solution for power LEDs.

The article discusses possible solutions for component designers who want to employ wafer-level packaging (WLP) but are frustrated with the inability of current-volume flip chip processes to accommodate 150-µm pitch used in high-volume wire bonding. Work is in progress on micro-post WLPs. Advanced bumping methodologies have been successful where other technologies were not.

In the future, the material sets, substrate construction, and process will continue to evolve. Vendors will continue to improve substrate technology, routing densities, layer structure, and other factors — all of which affect performance. Using the criteria of electrical performance, thermal performance, substrate connectivity, and package assembly considerations can provide a high-speed solution in a wire bond package. These technical improvements enhance the continued acceptance of wire bond packaging, while customers will continue to require cost-effective packaging solutions that do not sacrifice performance. It is clear that standard wire bond technology is still a choice solution for many wireless, networking, and communications applications in which performance and compactness are critical considerations. [ABSTRACT FROM AUTHOR]

Discusses the enhancement of flip-chip-in-package reliability. Challenges created by the disruptive influences for underfills, fluxes and flux residues; Changes in underfill technology; Implications of the transition to lead-free packaging for flux technology; Benefits of flip chip packages to semiconductor industry.

Examines the evolution of organic flip chip packaging. Improvements in areas such as co-design, substrate design and technology, and assembly technology; Role of signal integrity engineers and silicon designers; Development of heat spreader designs in flip chip packages.

This article reports that flip chip on flex is becoming an attractive method to mount small to moderate-size analog and digital die, reducing the packaging cost and providing benefits in electrical performance. High-density flex circuit technology developed for chip scale packages, based on flexible substrates, will make its way to the general flex substrate marketplace. This high-density routing capability, coupled with an extremely light weight and mechanical flexibility, will make the flex circuit a formidable player in the electronics marketplace.

Discusses the advantages of solder bump and adhesive flip chip technologies over traditional wire bonding methods. Factors responsible for the projected greater demand for flip chip solder bump technology; Role of dual bonding system in increasing throughput; Need to develop flip chip bonder with integrated dispenser.

Focuses on electrical models for bump arrays for radio frequency applications. Use of the flip chip interconnects to illustrate the modeling methodology for bump arrays; Effect of neglection of the electromagnetic coupling and consideration of the symmetrical arrangement of bumps in an array on the number of electrical parameters to be extracted; Parameters needed to characterized a bump array.

Discusses a study on the assembly of solder flip chip devices. Background on the flip chip assembly process; Methods of applying flux for the flip chip investigated; Placement accuracy of a traditional SMT pick-and-place system; Results of the reliability testing.

The article presents information on the use of flip chip technology in modern electronic packaging. It is mentioned that the technology provides shorter and more efficient interconnections, lower inductance, better noise control, and higher operating frequencies. It is stated that to reduce thermo-mechanical stresses on the solder joints, underfill systems are used. The article also discusses the capillary flow underfill systems for flip chips.

The article offers information on how companies responded to the challenges in flip chip assembly. According to Amkor, the growing technical demands is forcing flip chip packagers to reduce bump pitches. According to Endicott Interconnect, taming thin substrates requires maintaining flatness through every step of assembly. Stats ChipPac presents that bump-on-lead (BOL) is an alternative path to fine-pitch high input/output (I/O) flip chip assembly.

The article reports on the effort of Freescale Semiconductor Inc. to develop a technology to compete with ball grid arrays (BGA) and flip chips for packaging. The company's creation of the redistributed chip packaging (RCP) technology has been sought to deliver 30 percent smaller packages as compared to the traditional BGAs. The new technology has been said to be integrated in the industrial, transportation, and networking devices in 2008.

Discusses the special requirements necessary for wire bond and flip chip interconnections used in packaging semiconductor devices for extreme high- and low-temperature environments. Wire bond interconnections; Flip chip interconnections; Susceptibility to corrosion; Use of high-temperature polymers considered in future extreme environments.

Reports on the growth of the flip chip package shipments of Amkor Technology Inc. in 2003. Technology development efforts; Rise in the demand for flip chip technology.

Reports on the launch of flip chip technology services and operations by the Billerica, Massachusetts-based Polymer Assembly Technology. Development of low-temperature processing through the use of polymer conductive adhesives; Profile on the company's founder and owner; Provision of alternative solutions to flip chip assembly; Operations in prototype development and low-volume assembly of high-density compound semiconductor devices.

The article tackles the fusion of flip chip and wire bond which is fan-in PoP (FiPop) for three-dimensional packaging. FiPop incorporates a wire bonded interposer within package-in-package (PiP) structure. The development of the flip chip PiP has capabilities to augment packaging engineers' system-in-package technology. Package-on-package (PoP) is another approach for joining memory and baseband functions.

The article comments on the state of flip chip markets worldwide. There is an indication of positive growth in packaging applications. Sales increase for personal computers, chipsets and central processing units. The demand for flip chip substrates is also increasing. There will be a need for a less-expensive way to make flip chips, as the flip chip area grows.

The article provides information on the joint meeting and presentation by the members of SMTA in Boston, Massachusetts and IMAPS in New England, held at the Holiday Inn in Boxborough, Massachusetts on March 21, 2006. A presentation by Daniel Baldwin titled "Flip Chip Technology: What, Why and How?" was one of the highlights of the event. The flip chip process, the different bumping methods and the thermal expansion difference between the chip and the substrate were discussed by Baldwin.

The article focuses on the challenges faced by the integrated circuits industry in the U.S. Its objective is to reach the market with a reliable product that meets and exceeds customers' expectations. Chip planning begins by selecting the process to be used and evaluating its compatibility once all aspects of the customers' requirements are understood. The industry must be cost-effective and performance-efficient and plan for a certain amount of slippage in order for the industry to prosper.

The article reports on a study to assess copper wire-bumped flip chip connections. Copper bumps were made on daisy-chained test chips under optimized, ultrasonic control. To enhance the reliability of the copper stud bump flip chip, a flip chip compression bonding process was also studied for the lead free SnAgCu test vehicles. Results revealed that copper studs offer an acceptable solder connection with the SnPb alloy and the lead-free SnAgCu alloy.

The article features Amkor Technology's Flip-Stack CSP which is specifically designed for devices that employ advanced IC fabrication processes. It combines a proprietary flip chip procedure with conventional wire-bond technology to provide a cost-effective, high-performance three-dimensional electronic packaging system.

The article reports that the "Advanced Packaging" magazine is pleased to welcome George A. Riley to its editorial team as contributing editor. Aside from providing features on innovations in flip chip technology, Riley will also contribute "Packaging Trends" columns and provide technical expertise. Riley, founder of FlipChips Dot Com, a Web site providing free micropackaging technical information, is a consultant for flip chip development and serves on the magazine's Editorial Advisory Board.

The article looks at the strengths and weaknesses of contending lead-free solder bumping processes. It describes evaporated bumps, electroplating, stencil printing, solder transfer bumping, sphere deposition, and C4NP system. A chart predicts the 5-year year forecast of solder-bumped flip chip wafer production worldwide, including both market and captive sources, for the three major contenders.

Explores the importance of material compatibility for next-generation electronic packaging in the United States. Approach to distributing stress in flip chip packages; Advances in power control at the silicon level; Need for design and integration of materials solutions with specific electrical, mechanical, thermal, manufacturability and environmental performance; Challenges facing the packaging industry.

Discusses the influence of design decisions on package yields and substrate design particularly for flip chip devices in the packaging industry in the U.S. Potential of no-flow chip process to displace conventional flip chip processes for consumer electronics and mobile applications; Factors that influence void formation in no-flow underfill processing; Need to consider substrate design features during package design to minimize package assembly defects and maximize assembly yield.

Discusses the search for lead solder alternatives and its importance on isotropic conductive adhesive assembly for flip chip interconnection in the packaging industry in the U.S. Process of indium bump bonding also known as hybridization; Emerging trend towards a gold-bump/adhesive system; Assertion that gold bump conductive adhesive may become the only practical, economical choice for low temperature flip chip assembly.

This article states that the electronics industry, recently, has seen improvements in both manufacturing technology and capabilities, as well as a reduction in the cost of flip chip substrates and materials. This combined with the ever increasing need for performance, are driving the continued adoption of this technology into more applications. The impetus of these improvements has been the advanced packaging foundry sector, where improvements in both technical capabilities and manufacturing costs have led to double digit growth in wafer-level processing technologies.

This article reports that FlipChip International LLC has opened a Reliability and Design Center for wafer-level packaging and flip chip bumping technologies within its Phoenix, Arizona facility. The Reliability and Design Center is equipped to support accelerated tests and analytical analysis of devices and packages. The new Reliability and Design Center's accelerated test equipment includes state-of- the-art electromigration testing, temperature cycling and autoclave chambers. Its analytical analysis capabilities include FTIR, DSC, UV-VIS for material characterization, wet lab, cross sectioning, X-ray and optical inspection and state-of-the-art SEM/EDX.

Looks at the trends in the flip chip technology in the United States. Growth in the industry; Improvement in performance; Decrease in size; Flip chip developments; Applications of flip chips.

Editorial. Offers insights on the flip chip technology from a panel for the Global Business Council of International Microelectronics and Packaging Society. Mid-year forecast for the semiconductor's market; Factors contributing to the performance of flip chip; Developments in flip chip technology.

Lists events of interest to electronic packaging professionals/businesses as of June 2004. 2004 Taiwan Semiconductor Fair; SMT/Hybrid/Packaging 2004 in Nuremburg, Germany; Flip Chip Technologies in Austin, Texas; Technology Innovation Showcase in San Francisco, California; SEMICON West 2004 in California; Others.

Reports on the selling of the flip chip business of Kulicke & Soffa Industries Inc. to FlipChip International LLC in Pennsylvania. Details on the slow demand for the flip chip business; Impact of the Kulicke acquisition on FlipChip financials; Discussion of the intellectual property of FlipChip.

Reports that ASAT Holdings Ltd. and ASAT Inc. are providing flip chip land grid array technology to Shanghai Fudan Microelectronics Co. Ltd. for multimedia applications; Fudan's commitment to expand flip chip capability; ASAT achievement of ISO/TS 16949:2002 certification at its Hong Kong facilities.