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The Expanding Role of Wafer-level Processing.

Authors :
Stephen Kay
Source :
Advanced Packaging. Nov2004, Vol. 13 Issue 11, p60-60. 1p.
Publication Year :
2004

Abstract

This article states that the electronics industry, recently, has seen improvements in both manufacturing technology and capabilities, as well as a reduction in the cost of flip chip substrates and materials. This combined with the ever increasing need for performance, are driving the continued adoption of this technology into more applications. The impetus of these improvements has been the advanced packaging foundry sector, where improvements in both technical capabilities and manufacturing costs have led to double digit growth in wafer-level processing technologies.

Details

Language :
English
ISSN :
10650555
Volume :
13
Issue :
11
Database :
Academic Search Index
Journal :
Advanced Packaging
Publication Type :
Periodical
Accession number :
15116785