Back to Search
Start Over
Assembly Processes for Flip Chips on Substrates.
- Source :
-
Advanced Packaging . Nov2003, Vol. 12 Issue 11, p37-39. 3p. - Publication Year :
- 2003
-
Abstract
- Discusses a study on the assembly of solder flip chip devices. Background on the flip chip assembly process; Methods of applying flux for the flip chip investigated; Placement accuracy of a traditional SMT pick-and-place system; Results of the reliability testing.
- Subjects :
- *FLIP chip technology
*SOLDER & soldering
*MICROELECTRONICS
Subjects
Details
- Language :
- English
- ISSN :
- 10650555
- Volume :
- 12
- Issue :
- 11
- Database :
- Academic Search Index
- Journal :
- Advanced Packaging
- Publication Type :
- Periodical
- Accession number :
- 11436891