Flux and Underfill Compatibility in a Lead-free Environment.

The article presents information on the use of flip chip technology in modern electronic packaging. It is mentioned that the technology provides shorter and more efficient interconnections, lower inductance, better noise control, and higher operating frequencies. It is stated that to reduce thermo-mechanical stresses on the solder joints, underfill systems are used. The article also discusses the capillary flow underfill systems for flip chips.