Flux and Underfill Compatibility in a Lead-free Environment.

MLA

Zhao, Renzhe, et al. “Flux and Underfill Compatibility in a Lead-Free Environment.” Advanced Packaging, vol. 16, no. 6, Aug. 2007, pp. 33–34. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=asx&AN=26884830&authtype=sso&custid=ns315887.

APA

Zhao, R., Qing Ji, Carson, G., Todd, M., & Shi, G. (2007). Flux and Underfill Compatibility in a Lead-free Environment. Advanced Packaging, 16(6), 33–34.

Chicago

Zhao, Renzhe, Qing Ji, George Carson, Michael Todd, and Gary Shi. 2007. “Flux and Underfill Compatibility in a Lead-Free Environment.” Advanced Packaging 16 (6): 33–34. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=asx&AN=26884830&authtype=sso&custid=ns315887.