69 results on '"Shang, Shumay"'
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2. An integrated verification flow for curvilinear mask
3. Principal components and optimal feature vectors of EUVL stochastic variability: applications of Karhunen-Loève expansion to efficient estimation of stochastic failure probabilities and stochastic metrics
4. Machine learning assisted effective OPC verification hotspot capture
5. Principal components and optimal feature vectors of EUVL stochastic variability: applications of Karhunen-Loève expansion to efficient estimation of stochastic failure probabilities and stochastic metrics
6. EUV SRAFs printing modeling and verification in 2D hole array
7. Machine learning assisted effective OPC verification hotspot capture
8. EUV SRAFs printing modeling with bright field mask
9. Machine learning based error classification for curvilinear designs
10. Gaussian random field EUV stochastic models, their generalizations and lithographically meaningful stochastic metrics
11. MRC for curvilinear mask shapes
12. Real-time full-wafer design-based inter-layer virtual metrology
13. Stochastic model prediction of pattern-failure
14. Machine learning based error classification for curvilinear designs
15. Process window-based feature and die failure rate prediction
16. Machine learning assisted effective OPC verification hotspot capture.
17. Towards efficient and accurate cost functions for EUVL stochastic-aware OPC correction and verification: via failure probability versus image and process variation band metrics
18. Combinational optical rule check on hotspot detection
19. Impact of aberrations in EUV lithography: metal to via edge placement control
20. Determining printable defects with MEEF-based mask inspection
21. MRC for curvilinear mask shapes
22. Stochastic model prediction of pattern-failure
23. Impact of Aberrations in EUV Lithography: Metal to Via Edge Placement Control.
24. EUV SRAFs printing modeling and verification in 2D hole array.
25. Process window-based feature and die failure rate prediction
26. Characterization and mitigation of relative edge placement errors (rEPE) in full-chip computational lithography
27. Full chip two-layer CD and overlay process window analysis
28. Combinational optical rule check on hotspot detection
29. Impact of aberrations in EUV lithography: metal to via edge placement control
30. Model-based stitching and inter-mask bridge prevention for double patterning lithography
31. EUV SRAFs printing modeling and verification in 2D hole array
32. Etch proximity correction by integrated model-based retargeting and OPC flow
33. Optimizing gate layer OPC correction and SRAF placement for maximum design manufacturability
34. Minimizing yield-loss risks through post-OPC verification
35. On objectives and algorithms of inverse methods in microlithography
36. Model based insertion of assist features using pixel inversion method: implementation in 65nm node
37. The influence of calibration pattern coverage for lumped parameter resist models on OPC convergence
38. Model-based insertion and optimization of assist features with application to contact layers
39. Lithography process related OPC development and verification demonstration on a sub-90nm poly layer
40. High accuracy 65nm OPC verification: full process window model vs. critical failure ORC
41. Lithography yield enhancement through optical rule checking
42. MEEF-based mask inspection
43. Critical failure ORC: application to the 90-nm and 65-nm nodes
44. Failure prediction across process window for robust OPC
45. Machine learning based error classification for curvilinear designs.
46. Optimizing gate layer OPC correction and SRAF placement for maximum design manufacturability.
47. Etch proximity correction by integrated model-based retargeting and OPC flow.
48. Model based insertion of assist features using pixel inversion method: implementation in 65nm node.
49. Minimizing yield-loss risks through post-OPC verification.
50. The influence of calibration pattern coverage for lumped parameter resist models on OPC convergence.
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