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The ability to achieve highly resistive beta-phase gallium oxide (β-Ga2O3) layers and substrates is critical for β-Ga2O3 high voltage and RF devices. To date, the most common approach involves doping with iron (Fe), which generates a moderately deep acceptor-like defect state located at EC-0.8 eV in the β-Ga2O3 bandgap. Recently, there has been growing interest in alternative acceptors, such as magnesium (Mg) and nitrogen (N), due to their predicted deeper energy levels, which could avoid inadvertent charge modulation during device operation. In this work, a systematic study that makes direct correlations between the introduction of N using ion implantation and the observation of a newly observed deep level at EC-2.9 eV detected by deep-level optical spectroscopy (DLOS) is presented. The concentration of this state displayed a monotonic dependence with N concentration over a range of implant conditions, as confirmed by secondary ion mass spectrometry (SIMS). With a near 1:1 match in absolute N and EC-2.9 eV trap concentrations from SIMS and DLOS, respectively, which also matched the measured removal of free electrons from capacitance-voltage studies, this indicates that N contributes a very efficiently incorporated compensating defect. Density functional theory calculations confirm the assignment of this state to be an N (0/−1) acceptor with a configuration of N occupying the oxygen site III [NO(III)]. The near ideal efficiency for this state to compensate free electrons and its location toward the midgap region of the β-Ga2O3 bandgap demonstrates the potential of N doping as a promising approach for producing semi-insulating β-Ga2O3.

This study provides a comprehensive analysis of the dominant deep acceptor level in nitrogen-doped beta-phase gallium oxide (β-Ga2O3), elucidating and reconciling the hole emission features observed in deep-level optical spectroscopy (DLOS). The unique behavior of this defect, coupled with its small optical cross section, complicates trap concentration analysis using DLOS, which is essential for defect characterization in β-Ga2O3. A complex feature arises in DLOS results due to simultaneous electron emission to the conduction band and hole emission to the valence band from the same defect state, indicating the formation of two distinct atomic configurations and suggesting metastable defect characteristics. This study discusses the implications of this behavior on DLOS analysis and employs advanced spectroscopy techniques such as double-beam DLOS and optical isothermal measurements to address these complications. The double-beam DLOS method reveals a distinct hole emission process at EV+1.3 eV previously obscured in conventional DLOS. Optical isothermal measurements further characterize this energy level, appearing only in N-doped β-Ga2O3. This enables an estimate of the β-Ga2O3 hole effective mass by analyzing temperature-dependent carrier emission rates. This work highlights the impact of partial trap-filling behavior on DLOS analysis and identifies the presence of hole trapping and emission in β-Ga2O3. Although N-doping is ideal for creating semi-insulating material through the efficient compensation of free electrons, this study also reveals a significant hole emission and migration process within the weak electric fields of the Schottky diode depletion region. [ABSTRACT FROM AUTHOR]

The impact of 1.8 MeV proton irradiation on metalorganic chemical vapor deposition grown (010) β -Ga2O3 Schottky diodes is presented. It is found that after a 10.8 × 10 13 cm − 2 proton fluence the Schottky barrier height of (1.40 ± 0.05 eV) and the ideality factor of (1.05 ± 0.05) are unaffected. Capacitance–voltage extracted net ionized doping curves indicate a carrier removal rate of 268 ± 10 cm − 1 . The defect states responsible for the observed carrier removal are studied through a combination of deep level transient and optical spectroscopies (DLTS/DLOS) as well as lighted capacitance–voltage (LCV) measurements. The dominating effect on the defect spectrum is due to the EC - 2.0 eV defect state observed in DLOS and LCV. This state accounts for ∼ 75 % of the total trap introduction rate and is the primary source of carrier removal from proton irradiation. Of the DLTS detected states, the EC - 0.72 eV state dominated but had a comparably smaller contribution to the trap introduction. These two traps have previously been correlated with acceptor-like gallium vacancy-related defects. Several other trap states at E C -0.36, E C -0.63, and E C -1.09 eV were newly detected after proton irradiation, and two pre-existing states at E C -1.2 and E C -4.4 eV showed a slight increase in concentration after irradiation, together accounting for the remainder of trap introduction. However, a pre-existing trap at EC - 0.40 eV was found to be insensitive to proton irradiation and, therefore, is likely of extrinsic origin. The comprehensive defect characterization of 1.8 MeV proton irradiation damage can aid the modeling and design for a range of radiation tolerant devices. [ABSTRACT FROM AUTHOR]

The impact of 1.8 MeV proton irradiation on metalorganic chemical vapor deposition grown (010) β -Ga2O3 Schottky diodes is presented. It is found that after a 10.8 × 10 13 cm − 2 proton fluence the Schottky barrier height of (1.40 ± 0.05 eV) and the ideality factor of (1.05 ± 0.05) are unaffected. Capacitance–voltage extracted net ionized doping curves indicate a carrier removal rate of 268 ± 10 cm − 1 . The defect states responsible for the observed carrier removal are studied through a combination of deep level transient and optical spectroscopies (DLTS/DLOS) as well as lighted capacitance–voltage (LCV) measurements. The dominating effect on the defect spectrum is due to the EC - 2.0 eV defect state observed in DLOS and LCV. This state accounts for ∼ 75 % of the total trap introduction rate and is the primary source of carrier removal from proton irradiation. Of the DLTS detected states, the EC - 0.72 eV state dominated but had a comparably smaller contribution to the trap introduction. These two traps have previously been correlated with acceptor-like gallium vacancy-related defects. Several other trap states at E C -0.36, E C -0.63, and E C -1.09 eV were newly detected after proton irradiation, and two pre-existing states at E C -1.2 and E C -4.4 eV showed a slight increase in concentration after irradiation, together accounting for the remainder of trap introduction. However, a pre-existing trap at EC - 0.40 eV was found to be insensitive to proton irradiation and, therefore, is likely of extrinsic origin. The comprehensive defect characterization of 1.8 MeV proton irradiation damage can aid the modeling and design for a range of radiation tolerant devices. [ABSTRACT FROM AUTHOR]

In this study, the impact of varying the thickness of the Al2O3 interlayer dielectric on the electrical characteristics of BaTiO3/III‐nitride transistors is investigated. In the findings, it is revealed that a minimum thickness of 8 nm for the Al2O3 layer is crucial to maintain high device performance and protect against sputtering‐induced damage during BaTiO3 deposition. The fabricated BaTiO3/Al2O3/AlGaN/GaN high electron mobility transistors exhibit exceptional electrical properties, including a maximum current density of 700 mA mm−1, an on‐resistance of 5 Ω mm, an ION/IOFF ratio of 107, a subthreshold slope of 119 mV dec−1, and significantly reduced gate leakage current. The devices with the optimal 8 nm Al2O3 thickness demonstrates excellent agreement between theoretical and experimental values for effective mobility, achieving a value of 1188 cm2 V−1·s at a 2D electron gas density of 1013 cm−2. Furthermore, in the study, it is confirmed that increasing the Al2O3 thickness also improves the quality of interface charge density, as evidenced by the results obtained from capacitance–voltage measurements. In these findings, the critical role of controlling the Al2O3 thickness in optimizing the electrical characteristics and overall performance of BaTiO3/III‐nitride transistors are highlighted. [ABSTRACT FROM AUTHOR]

This report discusses the design and demonstration of β -(Al0.17Ga0.83)2O3/Ga2O3 modulation doped heterostructures to achieve high sheet charge density. The use of a thin spacer layer between the Si delta-doping and the heterojunction interface was investigated in a β -(AlGa)2O3/Ga2O3 modulation doped structure. It is shown that this strategy enables a higher two-dimensional electron gas (2DEG) sheet charge density up to 4.7 × 1012 cm−2 with an effective mobility of 150 cm2/V s. The presence of a degenerate 2DEG channel was confirmed by the measurement of a low temperature effective mobility of 375 cm2/V s and the lack of carrier freeze out from low temperature capacitance voltage measurements. The electron density of 4.7 × 1012 cm−2 is the highest reported 2DEG density obtained without parallel conducting channels in a β -(AlxGa(1−x))2O3/Ga2O3 heterostructure system. [ABSTRACT FROM AUTHOR]

The ability to achieve highly resistive beta-phase gallium oxide (β-Ga2O3) layers and substrates is critical for β-Ga2O3 high voltage and RF devices. To date, the most common approach involves doping with iron (Fe), which generates a moderately deep acceptor-like defect state located at EC-0.8 eV in the β-Ga2O3 bandgap. Recently, there has been growing interest in alternative acceptors, such as magnesium (Mg) and nitrogen (N), due to their predicted deeper energy levels, which could avoid inadvertent charge modulation during device operation. In this work, a systematic study that makes direct correlations between the introduction of N using ion implantation and the observation of a newly observed deep level at EC-2.9 eV detected by deep-level optical spectroscopy (DLOS) is presented. The concentration of this state displayed a monotonic dependence with N concentration over a range of implant conditions, as confirmed by secondary ion mass spectrometry (SIMS). With a near 1:1 match in absolute N and EC-2.9 eV trap concentrations from SIMS and DLOS, respectively, which also matched the measured removal of free electrons from capacitance-voltage studies, this indicates that N contributes a very efficiently incorporated compensating defect. Density functional theory calculations confirm the assignment of this state to be an N (0/-1) acceptor with a configuration of Noccupying the oxygen site III [NO(III)]. The near ideal efficiency for this state to compensate free electrons and its location toward the midgap region of the β-Ga2O3 bandgap demonstrates the potential of N doping as a promising approach for producing semi-insulating β-Ga2O3. [ABSTRACT FROM AUTHOR]

In this work, we have investigated plasma-assisted deposition of Al2O3 on HVPE (001) β-Ga2O3 and evaluated the dielectric quality from electrical measurements on fabricated metal-oxide-semiconductor (MOS) capacitors. The interface structure and crystallinity of the films were investigated as a function of the growth temperature. The dielectric/semiconductor interfaces were found to have reverse breakdown electric fields up to 5.3 MV/cm in the β-Ga2O3, with relatively low hysteresis in capacitance–voltage and low leakage current. We determined a negative fixed interface charge density at the interface from analysis of thickness-dependent capacitance voltage data. This study shows the advantage of using plasma-assisted deposition to achieve high breakdown strength Al2O3/β-Ga2O3 MOS structures for device application purposes. [ABSTRACT FROM AUTHOR]

We report on the design and fabrication of β -Ga2O3 self-aligned lateral MOSFETs by utilizing a heavily doped β -Ga2O3 cap layer. The fabrication of the self-aligned device used a combination of in situ Ga etching for damage free gate recess, in situ growth of Al2O3 for gate dielectric, and atomic layer deposited Al2O3 based sidewall spacers to form highly scaled (<100 nm) source–gate and gate–drain access regions. The fabricated device showed a record high DC drain current density of 560 mA/mm at a drain bias of 5 V. The DC current density was found to be limited by excessive self-heating resulting in premature current saturation in the device. Pulsed I–V measurements of the device showed a record high current density of 895 mA/mm and a high transconductance of 43 mS/mm, thanks to reduced self-heating in the device. The high current densities obtained in this work are promising for the development of high power density devices based on β -Ga2O3. [ABSTRACT FROM AUTHOR]

This study provides the full-bandgap evaluation of defect state distributions in beta phase gallium oxide (β-Ga2O3) grown by low-pressure chemical vapor deposition (LPCVD) on (010) β-Ga2O3 substrates at high growth of up to 20 µm/h. Deep-level optical spectroscopy and deep-level transient spectroscopy measurements applied to Ni/β-Ga2O3 Schottky diodes revealed the presence of a previously unreported defect state at EC-3.6 eV, which dominated the overall trap distribution in LPCVD grown material. However, states at EC-0.8 eV, EC-2.0 eV, and EC-4.4. eV were also detected, similar to prior studies on β-Ga2O3 grown by other methods, with similar or lower concentrations for the LPCVD samples. The EC-0.8 eV and EC-2.0 eV states were previously connected to residual Fe impurities and gallium vacancies, respectively. The total concentration of traps in the LPCVD material was on par with or lower than the state-of-the-art metal–organic chemical vapor deposition-grown materials despite the much higher growth rate, and the distribution of states showed negligible dependence on SiCl4 flow rate and doping concentration. These results demonstrate that the high growth rate of LPCVD-grown β-Ga2O3 is very promising for achieving thick, low defect density, and high-quality layers needed for multi-kV device applications. [ABSTRACT FROM AUTHOR]

In this work, we develop in situ Mg doping techniques in plasma-assisted molecular beam epitaxy (PAMBE) of β -Ga2O3 to compensate Si dopants at the substrate epilayer growth interface and eliminate parasitic leakage paths. Both abrupt and uniform Mg doping profiles over a wide range of concentrations were achieved in β -Ga2O3 epilayers grown by PAMBE. Capacitance–voltage characteristics of Si and Mg co-doped samples confirmed the compensating effect of the Mg dopants. Mg delta-doping was then integrated into a β-Ga2O3 metal-semiconductor field effect transistor structure and shown to be effective in eliminating source leakage. The results presented here show that Mg doping is a promising way to engineer insulating buffer layers for β-Ga2O3 lateral devices grown by PAMBE. [ABSTRACT FROM AUTHOR]

A new record‐high room‐temperature electron Hall mobility (μRT = 194 cm2 V−1 s−1 at n ≈ 8 × 1015 cm−3) for β‐Ga2O3 is demonstrated in the unintentionally doped thin film grown on (010) semi‐insulating substrate via metal‐organic chemical vapor deposition (MOCVD). A peak electron mobility of ≈9500 cm2 V−1 s−1 is achieved at 45 K. Further investigation on the transport properties indicates the existence of sheet charges near the epilayer/substrate interface. Si is identified as the primary contributor to the background carrier in both the epilayer and the interface, originating from both surface contamination and growth environment. The pregrowth hydrofluoric acid cleaning of the substrate leads to an obvious decrease in Si impurity both at the interface and in the epilayer. In addition, the effect of the MOCVD growth condition, particularly the chamber pressure, on the Si impurity incorporation is studied. A positive correlation between the background charge concentration and the MOCVD growth pressure is confirmed. It is noteworthy that in a β‐Ga2O3 film with very low bulk charge concentration, even a reduced sheet charge density plays an important role in the charge transport properties. [ABSTRACT FROM AUTHOR]

Two buffer traps at EC-0.7 eV and EC-0.8 eV have been individually identified as causing threshold voltage and on-resistance instabilities in β-Ga2O3 Si ∂ -doped transistors grown by plasma-assisted molecular beam epitaxy (PAMBE) on semi-insulating Fe doped β-Ga2O3 substrates. The instabilities are characterized using double-pulsed current-voltage and isothermal constant drain current deep level transient spectroscopy. The defect spectra are compared between transistors grown using two different unintentionally doped buffer layer thicknesses of 100 nm and 600 nm. The EC-0.8 eV trap was not seen using the thicker buffer and is shown to correlate with the presence of residual Fe in thePAMBE buffer layer. The EC-0.7 eV trap was unchanged in concentration and is revealed as the dominating source of the threshold voltage instability. This trap is consistent with the characteristics of a previously reported intrinsic point defect [Ingebrigtsen et al., APL Mater. 7, 022510 (2019)]. The EC-0.7 eV trap is responsible for ∼70% of the total threshold voltage shift in the 100 nm thick buffer transistor and 100% in the 600 nm thick buffer transistor, which indicates growth optimization is needed to improve β-Ga2O3 transistor stability. [ABSTRACT FROM AUTHOR]

Threshold voltage instability was observed on $\beta $ -Ga2O3 transistors using double-pulsed current–voltage and constant drain current deep level transient spectroscopy (DLTS) measurements. A total instability of 0.78 V was attributed to two distinct trap levels, at ${E}_{C}$ -0.70 and ${E}_{C}$ -0.77 eV, which need to be mitigated for future applications. The traps are likely located near the gate–drain edge and below the delta-doped layer, which is determined through the DLTS technique and an understanding of the fill and empty biasing conditions. The trap modulation was consistent with a gate leakage-based trap filling mechanism, which was demonstrated. It is likely that Fe is playing a role in the observed dispersion due to the close proximity of the Fe substrate. [ABSTRACT FROM AUTHOR]

In this work, we have investigated plasma-assisted deposition of Al2O3 on HVPE (001) β-Ga2O3 and evaluated the dielectric quality from electrical measurements on fabricated metal-oxide-semiconductor (MOS) capacitors. The interface structure and crystallinity of the films were investigated as a function of the growth temperature. The dielectric/semiconductor interfaces were found to have reverse breakdown electric fields up to 5.3 MV/cm in the β-Ga2O3, with relatively low hysteresis in capacitance–voltage and low leakage current. We determined a negative fixed interface charge density at the interface from analysis of thickness-dependent capacitance voltage data. This study shows the advantage of using plasma-assisted deposition to achieve high breakdown strength Al2O3/β-Ga2O3 MOS structures for device application purposes. [ABSTRACT FROM AUTHOR]

A new record‐high room‐temperature electron Hall mobility (μRT = 194 cm2 V−1 s−1 at n ≈ 8 × 1015 cm−3) for β‐Ga2O3 is demonstrated in the unintentionally doped thin film grown on (010) semi‐insulating substrate via metal‐organic chemical vapor deposition (MOCVD). A peak electron mobility of ≈9500 cm2 V−1 s−1 is achieved at 45 K. Further investigation on the transport properties indicates the existence of sheet charges near the epilayer/substrate interface. Si is identified as the primary contributor to the background carrier in both the epilayer and the interface, originating from both surface contamination and growth environment. The pregrowth hydrofluoric acid cleaning of the substrate leads to an obvious decrease in Si impurity both at the interface and in the epilayer. In addition, the effect of the MOCVD growth condition, particularly the chamber pressure, on the Si impurity incorporation is studied. A positive correlation between the background charge concentration and the MOCVD growth pressure is confirmed. It is noteworthy that in a β‐Ga2O3 film with very low bulk charge concentration, even a reduced sheet charge density plays an important role in the charge transport properties. [ABSTRACT FROM AUTHOR]