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11. Data preparation for digital scanner

28. Absorber topography dependence of phase edge effects

30. High transmission mask technology for 45nm node imaging

35. Applications of CPL mask technology for sub-65nm gate imaging

36. High transmission mask technology for 45nm node imaging

37. CPL reticle technology for advanced device applications

39. The impact of MEEF through pitch for 120-nm contact holes

40. Application of CPL reticle technology for the 65- and 50-nm node

41. Process, design and optical proximity correction requirements for the 65nm device generation

50. Defect printability in CPL mask technology.

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