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210 results on '"H. Hashiguchi"'

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1. Statistical assessment of a Doppler radar model of TKE dissipation rate for low Richardson numbers

2. Turbulence kinetic energy dissipation rate: assessment of radar models from comparisons between 1.3 GHz wind profiler radar (WPR) and DataHawk UAV measurements

4. On the estimation of vertical air velocity and detection of atmospheric turbulence from the ascent rate of balloon soundings

5. Application of parametric speakers to radio acoustic sounding system

6. Comparisons between high-resolution profiles of squared refractive index gradient M2 measured by the Middle and Upper Atmosphere Radar and unmanned aerial vehicles (UAVs) during the Shigaraki UAV-Radar Experiment 2015 campaign

7. Regional variability of raindrop size distribution over Indonesia

8. On the effect of moisture on the detection of tropospheric turbulence from in situ measurements

9. Characteristics of gravity waves generated in a convective and a non-convective environment revealed from hourly radiosonde observation under CPEA-II campaign

10. Imaging observations of nighttime mid-latitude F-region field-aligned irregularities by an MU radar ultra-multi-channel system

11. Observational evidence of coupling between quasi-periodic echoes and medium scale traveling ionospheric disturbances

12. Convective activities associated with intraseasonal variation over Sumatera, Indonesia, observed with the equatorial atmosphere radar

13. Secondary circulation within a tropical cyclone observed with L-band wind profilers

14. Combined wind profiler-weather radar observations of orographic rainband around Kyushu, Japan in the Baiu season

15. Typhoon 9707 observations with the MU radar and L-band boundary layer radar

16. Precipitating clouds observed by 1.3-GHz boundary layer radars in equatorial Indonesia

18. High-Thermoresistant Temporary Bonding Technology for Multichip-to-Wafer 3-D Integration With Via-Last TSVs

20. Impacts of Misalignment on 1μm Pitch Cu-Cu Hybrid Bonding

21. Self-Assembly and Electrostatic Carrier Technology for Via-Last TSV Formation Using Transfer Stacking-Based Chip-to-Wafer 3-D Integration

22. Discontinuously reinforced aluminum MMC extrusions

23. Ethnicity as a Factor Influencing Sustainable Forest Resource Management: A Case Study of a Village in Taunggyi District in Myanmar’s Shan State

24. Characteristics of gravity waves generated in a convective and a non-convective environment revealed from hourly radiosonde observation under CPEA-II campaign

27. Mechanically alloyed aluminum metal matrix composites

29. Reconfigured-Wafer-to-Wafer 3-D Integration Using Parallel Self-Assembly of Chips With Cu–SnAg Microbumps and a Nonconductive Film

30. Strain measurement of a channel between Si/Ge stressors in a tri-gate field effect transistor utilizing moiré fringes in scanning transmission microscope images

31. Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration

32. Transfer and Non-transfer 3D Stacking Technologies Based on Multichip-to-Wafer Self-Assembly and Direct Bonding

34. Beryllium and Aluminum-Beryllium Alloys

36. New decade of shaped beryllium blanks

37. Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers

38. Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding

39. Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC

40. Plasma assisted multichip-to-wafer direct bonding technology for self-assembly based 3D integration

41. Impact of deep-via plasma etching process on transistor performance in 3D-IC with via-last backside TSV

44. Highly thermoresistant temporary bonding/debonding system without organic adhesives for 3D integration

45. Minimization of Keep-Out-Zone (KOZ) in 3D IC by local bending stress suppression with low temperature curing adhesive

46. Temporary spin-on glass bonding technologies for via-last/backside-via 3D integration using multichip self-assembly

47. A new temporary bonding technology with spin-on glass and hydrogenated amorphous Si for 3D LSIs

48. Niobium-tin persistent-current switch for the superconducting magnet of Maglev

49. 3D Integration technologies using self-assembly and electrostatic temporary multichip bonding

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