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1. Approche économique de l'exploration des stockages souterrains de gaz en nappe aquifère Economic Approach to Exploration for Underground Gas Storage Facilities in Aquifers

2. CONSTRUÇÃO DE POLÍTICAS ESTADUAIS DE AGROECOLOGIA E PRODUÇÃO ORGÂNICA NO BRASIL: avanços, obstáculos e efeitos das dinâmicas subnacionais

4. Experimental characterization of porosified silicon micropillars for wick performance enhancement

12. H2020 European project STREAMS: general overview

13. Shaping circuit environment to face the thermal challenge Innovative technologies from low to high power electronics

14. Bipolar pulsed excitation of erbium-doped nanosilicon light emitting diodes.

19. Characterization of a high conductivity heat spreading solution for hot spots in compact packages

21. Heat spreading packaging solutions for hybrid bonded 3D-ICs

25. New challenges and opportunities for 3D integrations

26. Impact of the national prevention policy and scrum law changes on the incidence of rugby-related catastrophic cervical spine injuries in French Rugby Union.

30. Investigation of the role of H-related defects in Al2O3 blocking layer on charge-trap memory retention by atomistic simulations and device physical modelling

31. Investigation of the impact of H-related defects in Al2O3 blocking layer of charge-trap memories by atomistic simulations and device physical modeling

32. A stacked SONOS technology, up to 4 levels and 6nm crystalline nanowires, with gate-all-around or independent gates (Φ-Flash), suitable for full 3D integration

33. 15nm-diameter 3D Stacked Nanowires with optional Independent Gates operation (?FET)

34. Intrinsic fixed charge and trapping properties of HfAlO interpoly dielectric layers

35. NH 3 treatments of Hf-based layers for application as NVM active dielectrics

37. In-depth Investigation of Hf-based High-k Dielectrics as Storage Layer of Charge-Trap

40. Thermal correlation between measurements and FEM simulations in 3D ICs

44. Towards efficient and reliable 300mm 3D technology for wide I/O interconnects

46. Physical Understanding of Program Injection and Consumption in Ultra-Scaled SiN Split-Gate Memories

47. Performance and Modeling of Si-Nanocrystal Double-Layer Memory Devices With High- $k$ Control Dielectrics

49. Effect of the annealing treatments on the electroluminescence efficiency of SiO2 layers doped with Si and Er

50. 3D integration demonstration of a wireless product with design partitioning

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