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1. Pushing the boundaries of random logic metal patterning with low-n EUV single exposure

2. Mask innovations on the eve of High NA EUV lithography

6. Overview of stitching for high NA: imaging and overlay experimental and simulation results

10. Stitching for High NA: new insights and path forward

12. Tone reversal patterning for advanced technology nodes

13. Overview of stitching for high NA: imaging and overlay experimental and simulation results

16. Carbon nanotube pellicles: imaging results of the first full-field extreme ultraviolet exposures

19. CNT pellicles: Imaging results of the first full-field EUV exposures

20. Metal layer single EUV expose at pitch 28: how bright field and NTD resist advantages align

28. Impact of local variability on defect-aware process windows

32. Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers

33. Single Exposure EUV of 32nm pitch logic structures: Patterning performance on BF and DF masks

34. EUV vote-taking lithography: crazy... or not?

39. Design Strategy for Integrating DSA Via Patterning in sub-7 nm Interconnects

41. Design and pitch scaling for affordable node transition and EUV insertion scenario

42. Compact 2D OPC modeling of a metal oxide EUV resist for a 7nm node BEOL layer

43. SAQP and EUV block patterning of BEOL metal layers on IMEC's iN7 platform

44. Co-optimization of lithographic and patterning processes for improved EPE performance

46. Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers.

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