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We developed a beam telescope system comprising five layers of 300-$\mu$m-thick INTPIX4NA monolithic pixel sensors with each pixel size of 17 $\mu$m square. The sensors were fabricated using silicon-on-insulator (SOI) technology. The signal-to-noise ratio of 140--230 is realized at a bias voltage of 20~V. The tracker system was tested using a positron beam of 200--822 MeV/c, and various tracking methods are examined to optimize spatial precision achievable at these energies. The best tracking precision including the precision of the sensor under test itself is 11.04 $\pm$ 0.10 $\mu$m for 822-MeV/c positrons for an equidistant sensor spacing of 32 mm. The achieved precision results combined with the intrinsic spatial resolution value obtained for a similar system using 120 GeV protons are used to estimate the tracking performance of electrons in the GeV energy range; a tracking precision of 2.22 $\mu$m is evaluated for 5-GeV electrons. The method to estimate the tracking performance is verified using a Geant4-based simulation. The developed high precision tracker system enables to map the detailed performance of the sensors with pixel sizes of $\mathcal{O}$(10 $\mu$m), therefore will be a powerful system for development of devices targeting precision position resolutions., Comment: 13 figures and 4 tables

In this multi-messenger astronomy era, all the observational probes are improving their sensitivities and overall performance. The Focusing on Relativistic universe and Cosmic Evolution (FORCE) mission, the product of a JAXA/NASA collaboration, will reach a 10 times higher sensitivity in the hard X-ray band ($E >$ 10~keV) in comparison with any previous hard X-ray missions, and provide simultaneous soft X-ray coverage. FORCE aims to be launched in the early 2030s, providing a perfect hard X-ray complement to the ESA flagship mission Athena. FORCE will be the most powerful X-ray probe for discovering obscured/hidden black holes and studying high energy particle acceleration in our Universe and will address how relativistic processes in the universe are realized and how these affect cosmic evolution. FORCE, which will operate over 1--79 keV, is equipped with two identical pairs of supermirrors and wideband X-ray imagers. The mirror and imager are connected by a high mechanical stiffness extensible optical bench with alignment monitor systems with a focal length of 12~m. A light-weight silicon mirror with multi-layer coating realizes a high angular resolution of $, 12 pages, 8 figures. Proceedings of SPIE Astronomical Telescopes and Instrumentation 2022

We have been developing the monolithic active pixel detector "XRPIX" onboard the future X-ray astronomical satellite "FORCE". XRPIX is composed of CMOS pixel circuits, SiO2 insulator, and Si sensor by utilizing the silicon-on-insulator (SOI) technology. When the semiconductor detector is operated in orbit, it suffers from radiation damage due to X-rays emitted from the celestial objects as well as cosmic rays. From previous studies, positive charges trapped in the SiO2 insulator are known to cause the degradation of the detector performance. To improve the radiation hardness, we developed XRPIX equipped with Double-SOI (D-SOI) structure, introducing an additional silicon layer in the SiO2 insulator. This structure is aimed at compensating for the effect of the trapped positive charges. Although the radiation hardness to cosmic rays of the D-SOI detectors has been evaluated, the radiation effect due to the X-ray irradiation has not been evaluated. Then, we conduct an X-ray irradiation experiment using an X-ray generator with a total dose of 10 krad at the SiO2 insulator, equivalent to 7 years in orbit. As a result of this experiment, the energy resolution in full-width half maximum for the 5.9 keV X-ray degrades by 17.8 $\pm$ 2.8% and the dark current increases by 89 $\pm$ 13%. We also investigate the physical mechanism of the increase in the dark current due to X-ray irradiation using TCAD simulation. It is found that the increase in the dark current can be explained by the increase in the interface state density at the Si/SiO2 interface., 15 pages, 12 figures, accepted for publication in Journal of Astronomical Telescopes, Instruments, and Systems

X-ray SOI pixel sensors, "XRPIX", are being developed for the next-generation X-ray astronomical satellite, "FORCE". The XRPIX are fabricated with the SOI technology, which makes it possible to integrate a high-resistivity Si sensor and a low-resistivity Si CMOS circuit. The CMOS circuit in each pixel is equipped with a trigger function, allowing us to read out outputs only from the pixels with X-ray signals at the timing of X-ray detection. This function thus realizes high throughput and high time resolution, which enables to employ anti-coincidence technique for background rejection. A new series of XRPIX named XRPIX6E developed with a pinned depleted diode (PDD) structure improves spectral performance by suppressing the interference between the sensor and circuit layers. When semiconductor X-ray sensors are used in space, their spectral performance is generally degraded owing to the radiation damage caused by high-energy protons. Therefore, before using an XRPIX in space, it is necessary to evaluate the extent of degradation of its spectral performance by radiation damage. Thus, we performed a proton irradiation experiment for XRPIX6E for the first time at HIMAC in the NIRS. We irradiated XRPIX6E with high-energy protons with a total dose of up to 40 krad, equivalent to 400 years of irradiation in orbit. The 40-krad irradiation degraded the energy resolution of XRPIX6E by 25 $\pm$ 3%, yielding an energy resolution of 260.1 $\pm$ 5.6 eV at the full width half maximum for 5.9 keV X-rays. However, the value satisfies the requirement for FORCE, 300 eV at 6 keV, even after the irradiation. It was also found that the PDD XRPIX has enhanced radiation hardness compared to previous XRPIX devices. In addition, we investigated the degradation of the energy resolution; it was shown that the degradation would be due to increasing energy-independent components, e.g., readout noise., 15 pages, 16 figures, accepted for publication in JATIS

We report on total ionizing dose effects on the X-ray SOI pixel sensor, XRPIX. XRPIX has been developed as an imaging spectrometer for X-ray astronomical use in space. Front- and back-illuminated (FI and BI) devices were irradiated with hard X-rays from an X-ray tube operated at 30 kV with a Molybdenum target. We found that the degradation rate of the readout noise of the BI device was approximately three times slower than that of the FI device as a function of radiation exposure. Those of both type of devices, however, were virtually identical when the readout noise was evaluated as a function of the absorbed dose at the buried oxide layer, D BOX . The pedestal and analog-to-digital conversion gain also displayed similar tendencies. These results demonstrate that BI type devices have a higher radiation tolerance as a focal plane sensor of an X-ray mirror and the radiation tolerance of XRPIX devices is governed by D BOX . The readout noise was stable up to about 1 krad in D BOX , increased by about 10% at 10 krad in D BOX , and continued to increase under further irradiation. If we employ an X-ray mirror with a half-power diameter of 10 arcsec and a focal length of 10 m, 10 krad in D BOX , a reasonable threshold of radiation tolerance in this experiment, is equivalent to more than three years in orbit, typically required of space-borne sensors.

We have been developing event-driven SOI Pixel Detectors, named `XRPIX' (X-Ray soiPIXel) based on the silicon-on-insulator (SOI) pixel technology, for the future X-ray astronomical satellite with wide band coverage from 0.5 keV to 40 keV. XRPIX has event trigger output function at each pixel to acquire a good time resolution of a few $\mu \rm s$ and has Correlated Double Sampling function to reduce electric noises. The good time resolution enables the XRPIX to reduce Non X-ray Background in the high energy band above 10\,keV drastically by using anti-coincidence technique with active shield counters surrounding XRPIX. In order to increase the soft X-ray sensitivity, it is necessary to make the dead layer on the X-ray incident surface as thin as possible. Since XRPIX1b, which is a device at the initial stage of development, is a front-illuminated (FI) type of XRPIX, low energy X-ray photons are absorbed in the 8 $\rm \mu$m thick circuit layer, lowering the sensitivity in the soft X-ray band. Therefore, we developed a back-illuminated (BI) device XRPIX2b, and confirmed high detection efficiency down to 2.6 keV, below which the efficiency is affected by the readout noise. In order to further improve the detection efficiency in the soft X-ray band, we developed a back-illuminated device XRPIX3b with lower readout noise. In this work, we irradiated 2--5 keV X-ray beam collimated to 4 $\rm \mu m \phi$ to the sensor layer side of the XRPIX3b at 6 $\rm \mu m$ pitch. In this paper, we reported the uniformity of the relative detection efficiency, gain and energy resolution in the subpixel level for the first time. We also confirmed that the variation in the relative detection efficiency at the subpixel level reported by Matsumura et al. has improved., Comment: 7 pages, 11 figures, 1 table, accepted for Nuclear Instruments and Methods in Physics Research Section A (NIMA)

An application of a modern noble pixel detector, XRPIX series, for solar KSVZ axion search experiment is being developed. A low radioactive background is necessary in the detector volume for the axion search. We surveyed the radioactivity of all peripheral components mounted on the detector using an HPGe detector. The results are used as an input for a GEANT4 Monte Carlo simulation to study the background in the experiment. This paper describes the expected background and the simulated sensitivity of stacked XRPIX detector currently under development.

We are developing an X-ray SOI pixel detector “XRPIX” for the next generation X-ray astronomical satellite “FORCE”. XRPIX is the detector using SOI (Silicon-On-Insulator) technology which makes it possible to integrate a high-resistivity Si sensor part and a low-resistivity Si CMOS circuit part. The CMOS circuit is equipped with the trigger function, which can read out only the output signal of the pixel where the X-ray is incident. This function realizes high throughput and high time resolution, enabling the background rejection with anticoincidence technique. A new series of XRPIX named XRPIX6E, we developed, with a Pinned Depleted Diode (PDD) structure improves the spectral performance by suppressing the interference between the sensor layer and the circuit layer. When semiconductor X-ray detectors are used in space, it is known that their spectral performance is degraded due to radiation damage caused by high-energy protons. Therefore, before using XRPIX in space, it is necessary to evaluate how much the spectral performance will be degraded by radiation damage. Then we performed proton irradiation experiment for XRPIX6E for the first time at HIMAC in National Institute of Radiological Sciences. We irradiated XRPIX with high-energy protons up to a total dose of 40 krad, equivalent to 400 years irradiation in orbit. As a result, the energy resolution in full width half maximum at the 5:9 keV degrades by 25 ± 3%, however, is better than the required performance of FORCE, 300 eV at 6 keV. It was also found that the PDD structure XRPIX has better radiation hardness than the previous XRPIX series. In addition, We investigated about the degradation of the energy resolution; it was found that the degradation would be due to increasing energy independent components, for example, readout noise.

We present the concept of a future Japan-lead X-ray mission, FORCE (Focusing On Relativistic universe and Cosmic Evolution). FORCE is characterized by broadband (1-80 keV) X-ray imaging spectroscopy with high angular resolution (

FORCE is a Japan-US space-based astronomy mission for an X-ray imaging spectroscopy in an energy range of 1--80 keV. The Wideband Hybrid X-ray Imager (WHXI), which is the main focal plane detector, will use a hybrid semiconductor imager stack composed of silicon and cadmium telluride (CdTe). The silicon imager will be a certain type of the silicon-on-insulator (SOI) pixel sensor, named the X-ray pixel (XRPIX) series. Since the sensor has a small pixel size (30--36 $\mu$m) and a thick sensitive region (300--500 $\mu$m), understanding the detector response is not trivial and is important in order to optimize the camera design and to evaluate the scientific capabilities. We have developed a framework to simulate observations of celestial sources with semiconductor sensors. Our simulation framework was tested and validated by comparing our simulation results to laboratory measurements using the XRPIX 6H sensor. The simulator well reproduced the measurement results with reasonable physical parameters of the sensor including an electric field structure, a Coulomb repulsion effect on the carrier diffusion, and arrangement of the degraded regions. This framework is also applicable to future XRPIX updates including the one which will be part of the WHXI, as well as various types of semiconductor sensors., Comment: 7 pages, 5 figures, proceedings of the "12th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors (HSTD12)", accepted for publication in Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

The X-ray SOI pixel sensor onboard the FORCE satellite will be placed in the low earth orbit and will consequently suffer from the radiation effects mainly caused by geomagnetically trapped cosmic-ray protons. Based on previous studies on the effects of radiation on SOI pixel sensors, the positive charges trapped in the oxide layer significantly affect the performance of the sensor. To improve the radiation hardness of the SOI pixel sensors, we introduced a double-SOI (D-SOI) structure containing an additional middle Si layer in the oxide layer. The negative potential applied on the middle Si layer compensates for the radiation effects, due to the trapped positive charges. Although the radiation hardness of the D-SOI pixel sensors for applications in high-energy accelerators has been evaluated, radiation effects for astronomical application in the D-SOI sensors has not been evaluated thus far. To evaluate the radiation effects of the D-SOI sensor, we perform an irradiation experiment using a 6-MeV proton beam with a total dose of ~ 5 krad, corresponding to a few tens of years of in-orbit operation. This experiment indicates an improvement in the radiation hardness of the X- ray D-SOI devices. On using an irradiation of 5 krad on the D-SOI device, the energy resolution in the full-width half maximum for the 5.9-keV X-ray increases by 7 $\pm$ 2%, and the chip output gain decreases by 0.35 $\pm$ 0.09%. The physical mechanism of the gain degradation is also investigated; it is found that the gain degradation is caused by an increase in the parasitic capacitance due to the enlarged buried n-well., Comment: 7 pages, 7 figures, accepted for publication in NIM A

We have been developing a monolithic active pixel sensor, ``XRPIX``, for the Japan led future X-ray astronomy mission ``FORCE`` observing the X-ray sky in the energy band of 1-80 keV with angular resolution of better than 15``. XRPIX is an upper part of a stack of two sensors of an imager system onboard FORCE, and covers the X-ray energy band lower than 20 keV. The XRPIX device consists of a fully depleted high-resistivity silicon sensor layer for X-ray detection, a low resistivity silicon layer for CMOS readout circuit, and a buried oxide layer in between, which is fabricated with 0.2 $\mu$ m CMOS silicon-on-insulator (SOI) technology. Each pixel has a trigger circuit with which we can achieve a 10 $\mu$ s time resolution, a few orders of magnitude higher than that with X-ray astronomy CCDs. We recently introduced a new type of a device structure, a pinned depleted diode (PDD), in the XRPIX device, and succeeded in improving the spectral performance, especially in a readout mode using the trigger function. In this paper, we apply a mesh experiment to the XRPIX devices for the first time in order to study the spectral response of the PDD device at the subpixel resolution. We confirmed that the PDD structure solves the significant degradation of the charge collection efficiency at the pixel boundaries and in the region under the pixel circuits, which is found in the single SOI structure, the conventional type of the device structure. On the other hand, the spectral line profiles are skewed with low energy tails and the line peaks slightly shift near the pixel boundaries, which contribute to a degradation of the energy resolution., Comment: 10 pages, 7 figures, , Conference proceedings for PIXEL2018

We have been developing monolithic active pixel sensors for X-rays based on the silicon-on-insulator technology. Our device consists of a low-resistivity Si layer for readout CMOS electronics, a high-resistivity Si sensor layer, and a SiO$_2$ layer between them. This configuration allows us both high-speed readout circuits and a thick (on the order of $100~\mu{\rm m}$) depletion layer in a monolithic device. Each pixel circuit contains a trigger output function, with which we can achieve a time resolution of $\lesssim 10~\mu{\rm s}$. One of our key development items is improvement of the energy resolution. We recently fabricated a device named XRPIX6E, to which we introduced a pinned depleted diode (PDD) structure. The structure reduces the capacitance coupling between the sensing area in the sensor layer and the pixel circuit, which degrades the spectral performance. With XRPIX6E, we achieve an energy resolution of $\sim 150$~eV in full width at half maximum for 6.4-keV X-rays. In addition to the good energy resolution, a large imaging area is required for practical use. We developed and tested XRPIX5b, which has an imaging area size of $21.9~{\rm mm} \times 13.8~{\rm mm}$ and is the largest device that we ever fabricated. We successfully obtain X-ray data from almost all the $608 \times 384$ pixels with high uniformity., Comment: 5 pages, 9 figures, submitted to Conference Record of IEEE NSS-MIC 2018

We have been developing a new type of X-ray pixel sensors, "XRPIX", allowing us to perform imaging spectroscopy in the wide energy band of 1-20 keV for the future Japanese X-ray satellite "FORCE". The XRPIX devices are fabricated with complementary metal-oxide-semiconductor silicon-on-insulator technology, and have the "Event-Driven readout mode", in which only a hit event is read out by using hit information from a trigger output function equipped with each pixel. This paper reports on the low-energy X-ray performance of the "XRPIX6E" device with a Pinned Depleted Diode (PDD) structure. The PDD structure especially reduces the readout noise, and hence is expected to largely improve the quantum efficiencies for low-energy X-rays. While F-K X-rays at 0.68 keV and Al-K X-rays at 1.5 keV are successfully detected in the "Frame readout mode", in which all pixels are read out serially without using the trigger output function, the device is able to detect Al-K X-rays, but not F-K X-rays in the Event-Driven readout mode. Non-uniformity is observed in the counts maps of Al-K X-rays in the Event-Driven readout mode, which is due to region-to-region variation of the pedestal voltages at the input to the comparator circuit. The lowest available threshold energy is 1.1 keV for a small region in the device where the non-uniformity is minimized. The noise of the charge sensitive amplifier at the sense node and the noise related to the trigger output function are ~$18~e^-$ (rms) and ~$13~e^-$ (rms), respectively., Comment: 8 pages, 10 figures, accepted for publication in NIMA, proceedings of the 12th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detector (HSTD12)

This paper reports on the development of on-chip pattern processing in the event-driven silicon-on-insulator pixel detector for X-ray astronomy with background rejection purpose. X-ray charge-coupled device (CCD) detectors, well-established pixel detectors used in this field, has proven that classification of detected events considering their spatial pattern is effective for particle background rejection. Based on the current architecture of our device and from the CCD images obtained in space, we first established a design concept and algorithm of the pattern processor to be implemented. Then, we developed a new device, including a prototype pattern-processing circuit. Experiments using X-ray and beta-ray radioisotopes demonstrated that the pattern processor properly works as expected, and the particle background rejection is realized in an on-chip fashion. This function is useful, especially in a limited-resource system such as the CubeSat.

This paper reports the spectroscopic performance improvement of the silicon-on-insulator (SOI) pixel detector for X-ray astronomy, by introducing a double-SOI (D-SOI) structure. For applications in X-ray astronomical observatories, we have been developing a series of monolithic active pixel sensors, named as "XRPIXs," based on SOI pixel technology. The D-SOI structure has an advantage that it can suppress a parasitic capacitance between the sensing node and the circuit layer, due to which the closed-loop gain cannot be increased in our conventional XRPIXs with a single-SOI (S-SOI) structure. Compared to the S-SOI XRPIX, the closed-loop gain is doubled in the D-SOI XRPIX. The readout noise is effectively lowered to 33% (16 e− (rms)), and the energy resolution at 6.4 keV is improved by a factor of 1.7 (290 eV in FWHM). The suppression of the parasitic capacitance is also quantitatively evaluated based on the results of capacitance extraction simulation from the layout. This evaluation provides design guidelines for further reduction of the readout noise.

International audience; Belle II detector upgrade is being discussed aiming to collect five times larger integrated luminosity of 250 ab−1. The beam background level is expected five times higher than current design, thus a new pixel vertex detector with faster readout should be developed. We have invented a new pixel detector concept DuTiP for the Belle II upgrade which can be also used for the International Linear Collider (ILC) with small modifications. To realize the DuTiP concept, an SOI technology is chosen as a baseline with a pixel size of 35μm×35μm. The DuTiP concept and its application to a monolithic pixel detector in an SOI technology are explained.

Compton imaging is a promising method of sub MeV to a few MeV gamma-rays and expected to use in various application field, such as medical imaging, environmental monitoring and astrophysics. Several types of Compton camera has beed developed using different materials. One of the drawbacks in conventional Compton imaging is relatively low signal to background ratio caused by its projected Compton cones. Recoil electron tracking is one straight-forward way to improve the signal-to-background ratio, however, it is only realized in gaseous detectors. The realization of electron tracking in solid detectors is under investigation because of its short track in scatter materials. We demonstrated the capability of electron tracking in silicon-on-insulator (SOI) pixel detector with 30 μm pixels size. The extraction of ejected direction of recoil electrons in Compton scattering is an important problem. In this work, we investigated the use of deep learning for estimating the angle in plane and depth using Geant 4 Monte Carlo simulation. The effect of pixel size to the estimation accuracy and SPD is characterized for the application of actual silicon-on-insulator based SOI detectors. The imaging capability is also characterized using predicted recoil electron direction.

In the fields of astrophysics and nuclear medicine diagnostics, the use of a 511-keV line gamma rays probe is indispensable. Compton-imaging techniques are suitable for measuring 511-keV line gamma rays because of the high probability of Compton scattering at this energy level. However, a reconstructed image obtained by a traditional Compton camera has false spots because this camera reconstructs an image with smeared rings. On the other hand, an advanced Compton camera can enhance the angular resolution and reduce the background by detecting recoil electron tracks. We focus on a silicon-on-insulator (SOI) pixel sensor with 30 m cells because of its small pixel pitch and high-energy resolution. In this study, we developed a prototype of an advanced Compton camera using an SOI sensor and evaluated its performance for detecting the recoil electron tracks of 511-keV gamma rays.

We have been developing event driven X-ray Silicon-On-Insulator (SOI) pixel sensors, called "XRPIX", for the next generation of X-ray astronomy satellites. XRPIX is a monolithic active pixel sensor, fabricated using the SOI CMOS technology, and is equipped with the so-called "Event-Driven readout", which allows reading out only hit pixels by using the trigger circuit implemented in each pixel. The current version of XRPIX has lower spectral performance in the Event-Driven readout mode than in the Frame readout mode, which is due to the interference between the sensor layer and the circuit layer. The interference also lowers the gain. In order to suppress the interference, we developed a new device, "XRPIX6E" equipped with the Pinned Depleted Diode structure. A sufficiently highly-doped buried p-well is formed at the interface between the buried oxide layer and the sensor layer, and acts as a shield layer. XRPIX6E exhibits improved spectral performances both in the Event-Driven readout mode and in the Frame readout mode in comparison to previous devices. The energy resolutions in full width at half maximum at 6.4 keV are 236 $\pm$ 1 eV and 335 $\pm$ 4 eV in the Frame and Event-Driven readout modes, respectively. There are differences between the readout noise and the spectral performance in the two modes, which suggests that some mechanism still degrades the performance in the Event-Driven readout mode., 13 pages, 5 figures, 1 table, accepted for publication in NIMA on September 27, 2018

We have developed SOIPIXs based on the CMOS SOI technology for the future X-ray astronomical satellite. SOIPIXs has the event trigger output function implemented in each pixel offers microsecond time resolution and its event trigger function enables to separate celestial X-rays and non-X-ray background by combining the anticoincidence system and to reduce the non-X-ray background that dominates the high X-ray energy band above 5-10 keV. A fully depleted SOIPIXs with a 300-500 um thick depletion layer and back illumination offers wide band coverage of 0.3-40 keV. In order to use XRPIXs in space environment, to investigate the radiation hardness of XRPIXs is important because semiconductor detectors such as XRPIXs and CCDs are damaged by interacting with many cosmic rays which are composed primarily energy protons in orbit. The damage causes the increase of dark current and the degradation of the performance such as the energy resolution of XRPIXs. To evaluate the radiation hardness of XRPIXs, we have carried out the radiation damage test at the heavy ion medical accelerator (HIMAC) in Japan. For this experiment, we used the XRPIX2b-FZ (Takeda et al, 2015) which was the front illuminated XRPIX with 300um thick depletion layer. XRPIX2b-FZ has 144 x 144 pixels and the pixel size is 30um x 30 um. We installed XRPIX2b-FZ in the vacuum chamber and cooled it around -80 C degree. The proton beam flux was much strong for our purpose of this experiment, we set the 3 um thick Au film as a scatterers in the cubic flange in front of vacuum chamber in order to reduce the beam flux. We introduced the scattered proton beam to the two direction of the downstream of the beam line, and one was irradiated to XRPIX2b-FZ in the vacuum chamber and the other was irradiated to the faraday cup connected to the cubic flange to monitor the scattered beam flux. We also obtained the total doze of proton beam using the faraday cup. We irradiated the proton beam to XRPIX2b-FZ until the total irradiation dose reached 10 krad while increasing the irradiation dose and evaluated the performance such as leak current, gain and energy resolution using X-ray from 109 Cd after the proton irradiation of 1 rad, 400 rad, 1 k rad, 4 k rad, and 10 krad. From above experimental results, we found that the gain and the energy resolution was degraded by 0.2 % and 10 % respectively with 400 rad whose equivalent time in orbit was 3.5 years, and the gain and energy resolution became worse by 0.8 % and 32 % respectively after irradiation of 4k rad. We investigated the reason of the degradation of the energy resolution and found the degradation was mainly caused by the increasing the read out noise. We also found the number of bad pixels clearly increased by about 10 times after the irradiation of 10 krad.

X-ray Astronomy Recovery Mission (XARM) scheduled to be launched in early 2020’s carries two soft X-ray telescopes. One is Resolve consisting of a soft X-ray mirror and a micro calorimeter array, and the other is Soft X-ray Imaging Telescope (Xtend), a combination of an X-ray mirror assembly (XMA) and an X-ray CCD camera (SXI). Xtend covers a field of view (FOV) of 38′ × 38′ , much larger than that of Resolve (3′ × 3 ′ ) with moderate energy resolution in the energy band from 0.4 keV to 13 keV, which is similar to that of Resolve (from 0.3 keV to 12 keV). Simultaneous observations of both telescopes provide complimentary data of X-ray sources in their FOV. In particular, monitoring X-ray sources outside the Resolve FOV but inside the Xtend FOV is important to enhance the reliability of super high resolution spectra obtained with Resolve. Xtend is also expected to be one of the best instruments for low surface brightness X-ray emissions with its low non X-ray background level, which is comparable to that of Suzaku XIS. The design of Xtend is almost identical to those of Soft X-ray Telescope (SXT) and Soft X-ray Imager (SXI) both on board the Hitomi satellite. However, several mandatory updates are included. Updates for the CCD chips are verified with experiment using test CCD chips before finalizing the design of the flight model CCD. Fabrication of the foils for XMA has started, and flight model production of the SXI is almost ready.

In this paper, we report on the development of a monolithic active pixel sensor for X-ray imaging using 0.2 &micro, m fully depleted silicon-on-insulator (SOI)-based technology to support next generation astronomical satellite missions. Detail regarding low-noise dual-gain SOI based pixels with a charge sensitive amplifier and pinned depleted diode sensor structure is presented. The proposed multi-well sensor structure underneath the fully-depleted SOI allows the design of a detector with low node capacitance and high charge collection efficiency. Configurations for achieving very high charge-to-voltage conversion gain of 52 &micro, V/e&minus, and 187 &micro, are demonstrated. Furthermore, in-pixel dual gain selection is used for low-noise and wide dynamic range X-ray energy detection. A technique to improve the noise performance by removing correlated system noise leads to an improvement in the spectroscopic performance of the measured X-ray energy. Taken together, the implemented chip has low dark current (44.8 pA/cm2 at &minus, 30 &deg, C), improved noise performance (8.5 e&minus, rms for high gain and 11.7 e&minus, rms for low gain), and better energy resolution of 2.89% (171 eV FWHM) at 5.9 keV using 55Fe and 1.67% (234 eV FWHM) at 13.95 keV using 241Am.

We have been developing monolithic active pixel sensors, X-ray Astronomy SOI pixel sensors, XRPIXs, based on a Silicon-On-Insulator (SOI) CMOS technology as soft X-ray sensors for a future Japanese mission, FORCE (Focusing On Relativistic universe and Cosmic Evolution). The mission is characterized by broadband (1-80 keV) X-ray imaging spectroscopy with high angular resolution ($, Comment: 11 pages, 10 figures, Proceedings Volume 10709, High Energy, Optical, and Infrared Detectors for Astronomy VIII

In this paper, we describe the development of monolithic pixel detectors using silicon-on-insulator (SOI) technology for a rapid X-ray residual stress measurement system. Conventional two-dimensional X-ray detectors are not suitable for rapid X-ray residual stress measurement because of their large pixel size and slow readout. For this reason, we developed highly sensitive SOI monolithic pixel detectors that are made up of smaller pixels and can provide a more rapid X-ray residual stress measurement readout. The detectors are fabricated using a 0. 2 μ m CMOS fully-depleted SOI process (Lapis Semiconductor Co., Ltd). The SOI wafer is made by directly bonding a thick, high-resistivity Si wafer and a low-resistivity Si CMOS wafer. The process does not make use of mechanical bump bonding. We developed an integration-type SOI pixel detector, INTPIX4, for a rapid X-ray residual stress measurement system; it uses a float zone (FZ) or Czochralski (Cz) silicon wafer. Cz SOI detectors have been in use since 2005. After 2011, FZ SOI detectors were successfully fabricated. In this paper, we state recent progresses and test results of the SOI monolithic pixel detector using a FZ silicon and compare them with the results obtained using the Cz detector.

This paper presents a novel full-depletion Si X-ray detector based on silicon-on-insulator pixel (SOIPIX) technology using a pinned depleted diode structure, named the SOIPIX-PDD. The SOIPIX-PDD greatly reduces stray capacitance at the charge sensing node, the dark current of the detector, and capacitive coupling between the sensing node and SOI circuits. These features of the SOIPIX-PDD lead to low read noise, resulting high X-ray energy resolution and stable operation of the pixel. The back-gate surface pinning structure using neutralized p-well at the back-gate surface and depleted n-well underneath the p-well for all the pixel area other than the charge sensing node is also essential for preventing hole injection from the p-well by making the potential barrier to hole, reducing dark current from the Si-SiO₂ interface and creating lateral drift field to gather signal electrons in the pixel area into the small charge sensing node. A prototype chip using 0.2 μm SOI technology shows very low readout noise of 11.0 e-rms, low dark current density of 56 pA/cm² at -35 °C and the energy resolution of 200 eV(FWHM) at 5.9 keV and 280 eV (FWHM) at 13.95 keV.

著者人数: 14名, Accepted: 2015-05-08, 資料番号: SA1150113000

Quasi-monochromatic X-rays with high brightness have a broad range of applications in fields such as life sciences, bio-, medical applications, and microlithography. One method for generating such X-rays is via inverse Compton scattering (ICS). X-ray generation experiments using ICS were carried out at the superconducting RF test facility (STF) accelerator at KEK. A new beam line, newly developed four-mirror optical cavity system, and new X-ray detector system were prepared for experiments downstream section of the STF electron accelerator. Amplified pulsed photons were accumulated into a four-mirror optical cavity and collided with an incoming 40 MeV electron beam. The generated X-rays were detected using a microchannel plate (MCP) detector for X-ray yield measurements and a new silicon-on-insulator (SOI) detector system for energy measurements. The detected X-ray yield by the MCP detector was 1756.8±272.2 photons/(244 electron bunches). To extrapolate this result to 1 ms train length under 5 Hz operations, 4.60×10 5 photons/1%-bandwidth were obtained. The peak X-ray energy, which was confirmed by the SOI detector, was 29 keV, and this is consistent with ICS X-rays.

We are developing a monolithic active pixel sensor referred to as XRPIX for X-ray astronomy on the basis of silicon-on-insulator CMOS technology. A crucial issue in our recent development is the impact of incomplete charge collection on the spectroscopic performance. In this paper, we report the spectral responses of several devices having different intra-pixel structures or produced from different wafers. We found that an emission line spectrum exhibits large low-energy tails when the size of the buried p-well, which acts as the charge-collection node, is small. Moreover, in charge sharing events, the peak channels of the emission lines shift toward channels lower than those without charge sharing. This peak shift is more pronounced as the distance between the pixel center and the position of incident photon increases. This suggests that the charge-collection efficiency is degraded at the pixel boundary. We also found that the charge-collection efficiency depends on the strength of the electric field at the interface of the depletion and insulator layers.

We have been developing the X-ray silicon-on-insulator (SOI) pixel sensor called XRPIX for future astrophysical satellites. XRPIX is a monolithic active pixel sensor consisting of a high-resistivity Si sensor, thin SiO$_2$ insulator, and CMOS pixel circuits that utilize SOI technology. Since XRPIX is capable of event-driven readouts, it can achieve high timing resolution greater than $\sim 10{\rm ~\mu s}$, which enables low background observation by adopting the anti-coincidence technique. One of the major issues in the development of XRPIX is the electrical interference between the sensor layer and circuit layer, which causes nonuniform detection efficiency at the pixel boundaries. In order to reduce the interference, we introduce a Double-SOI (D-SOI) structure, in which a thin Si layer (middle Si) is added to the insulator layer of the SOI structure. In this structure, the middle Si layer works as an electrical shield to decouple the sensor layer and circuit layer. We measured the detector response of the XRPIX with D-SOI structure at KEK. We irradiated the X-ray beam collimated with $4{\rm ~\mu m\phi}$ pinhole, and scanned the device with $6{\rm ~\mu m}$ pitch, which is 1/6 of the pixel size. In this paper, we present the improvement in the uniformity of the detection efficiency in D-SOI sensors, and discuss the detailed X-ray response and its physical origins., Comment: 12 pages, 9 figures, accepted for publication in Journal of Instrumentation

Truly monolithic pixel detectors were fabricated with 0.2 μ m SOI pixel process technology by collaborating with LAPIS Semiconductor Co., Ltd. for particle tracking experiment, X-ray imaging and medical applications. CMOS circuits were fabricated on a thin SOI layer and connected to diodes formed in the silicon handle wafer through the buried oxide layer. We can choose the handle wafer and therefore high-resistivity silicon is also available. Double SOI (D-SOI) wafers fabricated from Czochralski (CZ)-SOI wafers were newly obtained and successfully processed in 2012. The top SOI layers are used as electric circuits and the middle SOI layers used as a shield layer against the back-gate effect and cross-talk between sensors and CMOS circuits, and as an electrode to compensate for the total ionizing dose (TID) effect. In 2012, we developed two SOI detectors, INTPIX5 and INTPIX3g. A spatial resolution study was done with INTPIX5 and it showed excellent performance. The TID effect study with D-SOI INTPIX3g detectors was done and we confirmed improvement of TID tolerance in D-SOI sensors.

We have been developing active pixel sensors based on silicon-on-insulator technology for future X-ray astronomy missions. Recently we fabricated the new prototype named “XRPIX2”, and investigated its spectroscopic performance. For comparison and evaluation of different chip designs, XRPIX2 consists of 3 pixel types: Small Pixel, Large Pixel 1, and Large Pixel 2. In Small Pixel, we found that the gains of the 68% pixels are within 1.4% of the mean value, and the energy resolution is 656 eV (FWHM) for 8 keV X-rays, which is the best spectroscopic performance in our development. The pixel pitch of Large Pixel 1 and Large Pixel 2 is twice as large as that of Small Pixel. Charge sharing events are successfully reduced for Large Pixel 1. Moreover Large Pixel 2 has multiple nodes for charge collection in a pixel. We confirmed that the multi-nodes structure is effective to increase charge collection efficiency.

We have been developing a monolithic active pixel sensor with the silicon-on-insulator (SOI) CMOS technology for use in future X-ray astronomical satellite missions. This sensor is called XRPIX. Our objective is to replace the X-ray CCD, which is currently the standard detector in the field, with the developed XRPIX, which offers high coincidence time resolution (~ 50 ns), superior hit-position readout time (~ 10 μs), and wide bandpass (0.5-40 keV), in addition to having comparable performance in terms of imaging spectroscopy. In our previous study, we built a prototype sensor called XRPIX1 and confirmed its basic X-ray imaging spectroscopy performance in a mode that read out the entire area (all pixels). The next step is to realize a high-speed, intelligent readout for X-ray detection. XRPIX1 comprises a trigger circuit for each pixel, so as to detect an X-ray photon injection; this system is capable of direct access to selected pixels to read out the signal amplitude. We describe the design of the trigger circuitry system and report on the first resolved X-ray spectra obtained in the trigger-driven readout mode.

We have been developing monolithic active pixel sensors with 0.2 μm Silicon-On-Insulator (SOI) CMOS technology, called SOIPIX, for high-speed wide-band X-ray imaging spectroscopy on future astronomical satellites. In this work, we investigate a revised chip (XRPIX1b) for soft X-rays used in frontside illumination. The Al Kα line at 1.5 keV is successfully detected and energy resolution of 188 eV (FWHM) is achieved from a single pixel at this energy. The responsivity is improved to 6 μV/electron and the readout noise is 18 electrons rms. Data from 3 ×3 pixels irradiated with 6.4 keV (Fe Kα) X-rays demonstrates that the circuitry crosstalk between adjacent pixels is less than 0.5%.

We have been developing an active pixel sensor for X-ray astronomy. In this paper, we report on the design and the characterizationof the recently-developed device named XRPIX1-FZ.We applied the high-resistivitySiwafer(∼7 kΩ cm) to the sensor layer for a thick depletion layer. The chemical-mechanical polishing, which we applied to smooth the rough backside of the Si wafer, successfully reduced the dark current. We used the single-pixel readout mode and achievedthe energy resolution of 260eVinFWHMat8keV.Moreover, we developed the 3 × 3pixel readout mode for the evaluation of split events and confirmed the full depletion of 250 μm thick at thereverse-biasvoltageof30 V

We are developing truly monolithic pixel detectors with a 0.2 μm silicon-on-insulator (SOI) CMOS technology, which is intended to be utilized in various research fields, such as high-energy physics, X-ray material analysis, astrophysics and medical sciences. In the development project, KEK has organized several Multi Project Wafer (MPW) runs and the process has been incrementally improved. Czochralski (CZ-) and Float-Zone (FZ-) silicon has been used as a starting material for the detector fabrication. Using FZ-SOI wafers, the detectors worked at full depletion below the breakdown voltage. The up-to-date integration-type pixel detector with 14 μm pixel size has excellent spatial resolution.

We have been developing a monolithic active pixel sensor with the 0.2 μm Silicon-On-Insulator (SOI) CMOS technology, called SOIPIX, for the wide-band X-ray imaging spectroscopy on future astronomical satellites. SOIPIX includes a thin CMOS-readout-array layer and a thick high-resistivity Si-sensor layer stacked vertically on a single chip. This arrangement allows for fast and intelligent readout circuitries on-chip, providing advantages over the charge-coupled device (CCD). We have designed and built a new SOIPIX prototype XRPIX1 for X-ray detection. XRPIX1 implements a correlated double sampling (CDS) readout circuit in each pixel to suppress the reset noise. We obtained an energy resolution of full width at half maximum of 1.2 keV (5.4%) at 22 keV with a chip having a 147 μm sensor depletion at a back bias of 100 V cooled to -50°C. Moreover, XRPIX1 offers intra-pixel hit trigger (timing) and two-dimensional hit-pattern (position) outputs. We also confirmed the trigger capability by irradiating a single pixel with laser light.

This paper presents a low-noise wide-dynamic-range pixel design for a high-energy particle detector in astronomical applications. A silicon on insulator (SOI) based detector is used for the detection of wide energy range of high energy particles (mainly for X-ray). The sensor has a thin layer of SOI CMOS readout circuitry and a thick layer of high-resistivity detector vertically stacked in a single chip. Pixel circuits are divided into two parts; signal sensing circuit and event detection circuit. The event detection circuit consisting of a comparator and logic circuits which detect the incidence of high energy particle categorizes the incident photon it into two energy groups using an appropriate energy threshold and generate a two-bit code for an event and energy level. The code for energy level is then used for selection of the gain of the in-pixel amplifier for the detected signal, providing a function of high-dynamic-range signal measurement. The two-bit code for the event and energy level is scanned in the event scanning block and the signals from the hit pixels only are read out. The variable-gain in-pixel amplifier uses a continuous integrator and integration-time control for the variable gain. The proposed design allows the small signal detection and wide dynamic range due to the adaptive gain technique and capability of correlated double sampling (CDS) technique of kTC noise canceling of the charge detector.

Ayaki Takeda∗a, Takeshi Go Tsurua, Takaaki Tanakaa, Hideaki Matsumuraa, Yasuo Araib, Koji Moric, Yusuke Nishiokac, Ryota Takenakac, Takayoshi Kohmurad , Shinya Nakashimae, Shoji Kawahito f , Keiichiro Kagawa f , Keita Yasutomi f , Hiroki Kamehama f and Sumeet Shrestha f aDepartment of Physics, Faculty of Science, Kyoto University bInstitute of Particle and Nuclear Studies (IPNS), High Energy Accelerator Research Organization (KEK) cDepartment of Applied Physics, Faculty of Engineering, University of Miyazaki dDepartment of Physics, School of Science and Technology, Tokyo University of Science eJapan Aerospace Exploration Agency (JAXA) fResearch Institute of Electronics, Shizuoka University

Compton imaging is a useful method to localize gamma sources without using mechanical collimators. In conventional Compton imaging, the incident directions of gamma rays are estimated in a cone for each event by analyzing the sequence of interactions of each gamma ray followed by Compton kinematics. Since the information of the ejection directions of the recoil electrons is lost, many artifacts in the shape of cone traces are generated, which reduces signal-to-noise ratio (SNR) and angular resolution. We have developed an advanced Compton imaging system with the capability of tracking recoil electrons by using a combination of a trigger-mode silicon-on-insulator (SOI) pixel detector and a GAGG detector. This system covers the 660–1330 keV energy range for localization of contamination nuclides such as 137Cs and 134Cs inside the Fukushima Daiichi Nuclear Power Plant in Japan. The ejection directions of recoil electrons caused by Compton scattering are detected on the micro-pixelated SOI detector, which can theoretically be used to determine the incident directions of the gamma rays in a line for each event and can reduce the appearance of artifacts. We obtained 2-D reconstructed images from the first iteration of the proposed system for 137Cs, and the SNR and angular resolution were enhanced compared with those of conventional Compton imaging systems.

A bandgap voltage reference together with absolute temperature sensor (PTAT) designed in 200 nm SOI technology is presented in this paper. Three slightly different versions were designed to verify the diode models available in the SOI process. For more extensive SOI process study the chip was fabricated on three different substrates. The bandgap reference circuit generates Vref = 1.27 V with 10 mV chip to chip spread. The best bandgap version has temperature coefficient −35 μV/K. Circuit design, simulations and comparison with measured performance are presented.

A digital library designed in 200 nm fully depleted silicon on insulator (FD-SOI) technology is presented in this paper. For the purpose of a new technology the digital library containing 93 elements was designed. Created library allows automatic synthesis of digital blocks based on their description in hardware description languages (HDL). To preserve area occupied by each library element, height of 7.68 μm was chosen for all layout cells. The paper presents designed digital library., compares its performance with digital library made in Austria Mikro Systeme (AMS) 0.35 μm and shows test structures' measurements results.

We have been developing monolithic active pixel sensors, known as Kyoto's X-ray SOIPIXs, based on the CMOS SOI (silicon-on-insulator) technology for next-generation X-ray astronomy satellites. The event trigger output function implemented in each pixel offers microsecond time resolution and enables reduction of the non-X-ray background that dominates the high X-ray energy band above 5--10 keV. A fully depleted SOI with a thick depletion layer and back illumination offers wide band coverage of 0.3--40 keV. Here, we report recent progress in the X-ray SOIPIX development. In this study, we achieved an energy resolution of 300~eV (FWHM) at 6~keV and a read-out noise of 33~e- (rms) in the frame readout mode, which allows us to clearly resolve Mn-K$\alpha$ and K$\beta$. Moreover, we produced a fully depleted layer with a thickness of $500~{\rm \mu m}$. The event-driven readout mode has already been successfully demonstrated., Comment: 7pages, 12figures, SPIE Astronomical Telescopes and Instrumentation 2014, Montreal, Quebec, Canada. appears as Proc. SPIE 9147, Space Telescopes and Instrumentation 2014: Ultraviolet to Gamma Ray