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251 results on '"Packaging Density"'

101. MCMs deployed for use in military DSPs

Author

Leopold, George

Subjects
Multichip Module, New Technique, Chip Packaging, Packaging Density, Performance Improvement, Shared Memory, Military, Integrated circuit fabrication, Digital Signal Processor, LORAL/ROLM Mil-Spec Corp. -- Innovations, MicroModule Systems Inc. -- Innovations, Integrated circuit fabrication -- Innovations, Signal processing -- Equipment and supplies
Published
1994

102. Thin IC packages may be anorexic

Author

Marcoux, Phil P.

Subjects
Chip Packaging, Packaging Density, New Technique, Industry Analysis, Integrated circuit fabrication, Surface-mount technology, Semiconductor preparation, Integrated circuit fabrication -- Methods, Surface-mount technology -- Innovations, Semiconductor preparation -- Innovations
Published
1994

103. Thomson 3-D modules ready for prime time

Author

Woolnough, ROger

Subjects
Research and Development, Consortium, DRAM, Multichip Module, Chip Packaging, Packaging Density, New Technique, Thales S.A. -- Innovations, Dynamic random access memory -- Innovations, Semiconductor industry -- Research, Packaging density (Electronics) -- Innovations
Published
1994

104. DTAB mounts speed and power threat

Author

Karnezos, Marcos

Subjects
New Technique, Circuit Printing, Chip Packaging, Packaging Density, Performance Improvement, Integrated circuit fabrication, Surface-mount technology, Printed circuits -- Design and construction, Integrated circuit fabrication -- Innovations, Surface-mount technology -- Usage
Published
1994

105. Making a case for the proper socket

Author

Grabbe, Dimitry

Subjects
Circuit Printing, Circuit Design, Chip Packaging, Packaging Density, I/O Management, Multichip Module, Technology, Integrated circuit fabrication, Printed circuits -- Design and construction, Integrated circuit fabrication -- Methods
Published
1994

106. Design tools go the grid-array way

Author

LeBrun, Jim

Subjects
Chip Packaging, Packaging Density, Circuit Design, Circuit Printing, New Technique, Layout, Electronic design automation, Computer-aided design, Integrated circuit fabrication, Integrated circuits -- Design and construction, Printed circuits -- Design and construction, Electronic design automation -- Innovations, Computer-aided design, Integrated circuit fabrication -- Innovations
Published
1994

107. Turning down the heat

Author

Marcoux, Phil

Subjects
Chip Packaging, Heat Transfer, Processor Speed, Circuit Design, Packaging Density
Published
1994

108. Microprocessors Join Peripheral functions On-Chip

Author

Michaels, I.

Subjects
Microprocessor, 4-Bit, 32-Bit, Integrated Circuits, Computer Design, Circuitry, Chip Packaging, Packaging Density, Microelectronics, Standard Cells, Boards/Cards
Published
1985

109. PCB CAD Systems Tackle Surface Mount

Author

Goering, R.

Subjects
Circuit Design, Computer-Aided Design, Routing, Circuit Quality, New Product, Technology, Comparison, Packaging Density, Software Selection, Software Packages
Published
1985

111. Packaging of SAW Devices

Author

Erikson Jr, C.A.

Subjects
Acoustic Devices, Technology, Design, Packaging, Chip Packaging, Packaging Density, Integrated Circuits, Hybrid Circuits, Miniaturization, Reliability, Applications, Size, Frequency, Microelectronics, Automation, Wave Propagation, Thick Films
Published
1984

114. Tab Bonding a 200 Lead Die

Author

Scharr, T.A.

Subjects
Packaging Density, Substrates, Bonds, Integrated Circuits, Design, Technology, Soldering, Chip Packaging, Integrated Circuit Fabrication, VLSI
Published
1983

120. Automated Assembly of Hybrids Using High Density Chip Carriers

Author

Miles, R. S.

Subjects
Semiconductor Preparation, Hybrid Circuits, Automation, Assembly Line, Integrated Circuits, Chip Carriers, Microelectronics, Semiconductor Device, Chip Packaging, Testing, Integrated Circuit Fabrication, Packaging Density, Manufacturing, Chip Yield
Published
1983

121. A Miniature Chip Carrier for Microcircuit Applications

Author

Brown, R.L.

Subjects
Applications, Chip Carriers, Chip Packaging, Design, Hybrid Circuits, Assembly Line, Automation, Manufacturing, Microelectronics, Miniaturization, Size, Circuit Design, Arrays, Packaging Density, Integrated Circuits, Thick-Film Circuits
Published
1983

123. BGA: the package of choice

Author

Bindra, Ashok

Subjects
Chip Packaging, Packaging Density, New Technique, Application-Specific Integrated Circuit, Circuit Design, Programmable Logic Devices, Manufacturers, Marketing Strategy, Review of Past Year, Industry Analysis, International Business Machines Corp. IBM Microelectronics Div. -- Marketing, Motorola Inc. -- Marketing
Published
1993

124. Integration picks up momentum

Author

Derman, Glenda

Subjects
Integrated Circuits, Circuit Design, Capacitors, Resistor, Industry Analysis, Review of Past Year, Hardware Vendors, Manufacturers, Relays, Chip Packaging, Packaging Density
Published
1993

125. Packaging paths diverge

Author

Costlow, Terry

Subjects
Massive Parallelism, Packaging Density, RISC, Price Cutting, Integrated Circuit Fabrication, Parallel Processing
Published
1993

126. Plastic leads IEDM talks

Author

Costlow, Terry

Subjects
Semiconductor Device, Chip Packaging, Packaging Density, Heat Transfer, Multichip Module, Chip Carriers, Conferences and Meetings, Trends
Published
1993

127. One brainy chip

Subjects
Neural Network, Integrated Circuits, Circuit Design, Packaging Density, New Technique, Product Development, Cooperative Agreements, Multiprocessing, Intel Corp. -- Product development, Nestor Inc. -- Product development
Published
1993

128. MMS will try diamond as MCM substrate

Author

Costlow, Terry

Subjects
Multichip Module, Government Contracts, Substrates, Product Development, Packaging Density, MicroModule Systems Inc. -- Contracts, Norton Diamond Film -- Contracts
Published
1993

129. Big applications need multiprocessing

Author

Fisher, Lee

Subjects
Multiprocessing, Embedded Systems, Circuit Design, Methods, Heat Transfer, Performance Improvement, Packaging Density
Published
1993

130. IBM moves to array packages, fine lines

Author

Costlow, Terry

Subjects
Packaging Density, Production Control, Semiconductor Device, Laptop/Portable Computer, Computer Design, International Business Machines Corp. -- Product enhancement
Published
1992

131. MCMs help lower costs

Author

Mowatt, Larry and Beene, Gary L.

Subjects
Circuit Design, Multichip Module, Packaging Density, Chip Packaging, Military, Weapons Industry, High Technology, Cost
Published
1991

132. Actel pushes FPGAs with 4k-gate A1240

Author

Baker, Stan

Subjects
Product Introduction, Gate Arrays, Packaging Density, Increase, Chip Packaging, Actel Corp. -- Product introduction, Actel A1240 (Programmable logic array) -- Product introduction
Published
1991

134. Pursuing 3-D packages

Author

Suer, Myles F.

Subjects
Chip Packaging, Packaging Density, New Technique, Technology, Product Development, Research and Development, Texas Instruments Inc. -- Product development, Irvine Sensors Corp. -- Product development, Thales S.A. -- Product development
Published
1991

135. A dynamic move to catch SRAM

Author

Manners, David

Subjects
DRAM, SRAM, Solid State, Semiconductor Industry, Performance Improvement, International Solid State Circuits Conference, Technology, Conferences and Meetings, Packaging Density, International Solid State Circuits Conference -- 1991 AD
Published
1991

136. The main event

Author

Watson, George

Subjects
Product Development, Research and Development, Semiconductor Industry, DRAM, Packaging Density, New Technique, Chip Packaging, Semiconductor Preparation, Hitachi Ltd. -- Research
Published
1991

137. Venture to help designers test chips; $100 million partnership at Los Alamos lab will develop advanced software

Author

Smith, Rebecca

Subjects
United States. Department of Energy, Semiconductor Industry Association, Los Alamos National Laboratory, Computer-Aided Design, Integrated Circuit Fabrication, Packaging Density, Semiconductor Preparation, Simulation, Government Funding, Research and Development, United States. Department of Energy -- Research, United States. Los Alamos National Laboratory -- Research, Semiconductor Industry Association -- Research
Published
1994

138. Future memories of wafer-scale integration

Author

Cavill, Peter

Subjects
Future Technologies, Future of Computing, Outlook, Storage Capacity, Integrated Circuits, DRAM, Enhancements, Packaging Density, Semiconductor Memory
Published
1990

139. Inside Texas Instruments' 386SX notebook computer

Author

Doherty, Richard

Subjects
Notebook Computer, Computer Design, Product Development, Miniaturization, Packaging Density, LCD Display, New Technique, Texas Instruments Inc. -- Product development, Texas Instruments TravelMate 3000 (Notebook computer) -- Product development
Published
1990

140. Processor cores allow more ASIC-based systems integration

Author

White, John and Morris, Bob

Subjects
Application-Specific Integrated Circuit, Computer-Aided Design, Packaging Density, Embedded Systems, Circuit Design, Software Design, Integrated Systems, New Technique, Simulation, Hardware Description Language, Computer Systems Integration, Technology
Published
1990

141. Design tools must keep pace with ASIC fab technology

Author

Tauke, John

Subjects
Application-Specific Integrated Circuit, Computer-Aided Design, Software Packages, Circuit Design, Automation, Gate Arrays, User Need, Packaging Density, Increase
Published
1990

142. PLDs quicken time-to-market

Author

Schulze, Bill

Subjects
Application-Specific Integrated Circuit, Gate Arrays, Packaging Density, Increase, Turnaround Time, Product Life Cycle, Logic Circuitry, Market Share, Market Analysis, Outlook, Circuit Design
Published
1990

143. Programmable logic is in!

Author

Laws, David A.

Subjects
Gate Arrays, Application-Specific Integrated Circuit, Packaging Density, Market Analysis, Outlook, Logic Circuitry, Circuit Design, Market Segmentation, Computer-Aided Engineering
Published
1990

144. AMCC claims fastest BiCMOS arrays

Author

Baker, Stan

Subjects
Product Introduction, Gate Arrays, Bipolar Integrated Circuits, CMOS, Packaging Density, Increase, Enhancements, Applied Micro Circuits Corp. -- Product introduction, Applied Micro Circuits Q24000 (Programmable logic array) -- Product introduction
Published
1990

145. Darpa seeks foundry for multichip modules

Author

Robinson, Brian

Subjects
Chip Packaging, New Technique, Packaging Density, Research and Development, Government Funding, National Government, Government Agency, Military, Integrated Circuit Fabrication, Semiconductor Preparation, Request for Proposals, United States. Defense Advanced Research Projects Agency, United States. Defense Advanced Research Projects Agency -- Research
Published
1990

146. Giant leap for chips? Apollo-like push sought for semiconductors

Author

Rice, Valerie

Subjects
Packaging Density, Miniaturization, Integrated Circuits, Supercomputer, SRAM, Conferences and Meetings, United States. National Advisory Committee on Semiconductors, United States. Office of Science and Technology Policy, Micro Tech 2000, Strategic Planning, Japanese Competition, Semiconductor Industry, United States. National Advisory Committee on Semiconductors -- Conferences, meetings and seminars, United States. Office of Science and Technology Policy -- Conferences, meetings and seminars
Published
1991

147. Managing the VLSI Explosion with Silicon Compilation

Author

Collett, R.

Subjects
Integrated Circuits, Microelectronics, Technology, Packaging Density, Semicustom Integrated Circuits, Integrated Circuit Fabrication, VLSI, Computer-Aided Design, Hardware Review, Comparison, CAD/CAM, Genesil -- Evaluation, Concorde I -- Evaluation
Published
1985

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