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Low-Cost, High-Density Memory Packaging: A 64K X 9 DRAM SIP Module

Authors :
Clayton, J.E.
Source :
International Journal for Hybrid Microelectronics. Oct, 1983, Vol. v6 Issue n1, pp494-496
Publication Year :
1983

Subjects

Subjects :
Substrates
Chip Packaging
RAM
Dynamic Cell
Memory
Packaging
Packaging Density
Technology
Future Technologies
Masking
Thick Films
Dual Inline Packages
Modules
Chip Carriers

Details

ISSN :
02778270
Volume :
v6
Issue :
n1
Database :
Gale General OneFile
Journal :
International Journal for Hybrid Microelectronics
Publication Type :
Academic Journal
Accession number :
edsgcl.558374

Tools

Authors Abstract Subjects Details