1. Ion-bombardment characteristics during deposition of TiN films using a grid-assisted magnetron system with enhanced plasma potential
- Author
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Min J. Jung, Jaroslav Vlček, Yong M. Kim, J. Houska, Jeon G. Han, and P. Kudláček
- Subjects
Materials science ,Analytical chemistry ,chemistry.chemical_element ,Substrate (electronics) ,Sputter deposition ,Condensed Matter Physics ,Kinetic energy ,Surfaces, Coatings and Films ,Anode ,Ion ,chemistry ,Sputtering ,Cavity magnetron ,Tin ,Instrumentation - Abstract
Energy-resolved mass spectroscopy was used to investigate differences in ion-bombardment characteristics during conventional reactive magnetron sputtering of TiN films and their deposition using a grid-assisted magnetron system with anode at a high potential (up to 350 V relative to grounded chamber walls). Narrow ion energy distributions with a maximum corresponding to the ion energy close to 100 eV were obtained for the conventional magnetron deposition on a biased substrate ( V b =−100 V) in an 80%Ar+20%N 2 gas mixture at a pressure of 0.5 Pa. On the contrary, the energy distributions of ions bombarding a grounded substrate in the grid-assisted modified magnetron system with the grid potential V g =+100 V were broadened and extended to higher energies (up to 300 eV) under the same conditions. The change in the ion energy distributions is caused by increase in the plasma potential due to the high anode potential (approximately 320 V in this case). Simultaneously, the total ion flux to the substrate decreased 5.4 times compared with the conventional system. A combined effect of the enlarged kinetic energy of ions and their substantially reduced flux resulted in production of high-quality, densified TiN films with a smooth surface.
- Published
- 2007
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