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Your search keyword '"Ben-Je Lwo"' showing total 12 results

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12 results on '"Ben-Je Lwo"'

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1. Extracting Radio Frequency Properties of a Typical Through-Silicon Via Structure With a Self-Developed Deembedding Technique

2. Contact Resistance of Microbumps in a Typical Through-Silicon-Via Structure

3. Environmental Factors Affecting TSV Reliability

4. In Situ Stress and Reliability Monitoring on Plastic Packaging Through Piezoresistive Stress Sensor

5. A Study on Electrical Reliability Criterion on Through Silicon Via Packaging

6. The effects of oxygen partial pressure on the acoustic velocity in zirconia films studied by picosecond ultrasonics

7. Calibrate Piezoresistive Stress Sensors Through the Assembled Structure

8. In-Plane Packaging Stress Measurements Through Piezoresistive Sensors

9. On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging

10. Over-Temperature Forecasts on Electronic Packages Through a Transient R–C Model

11. Parameter Calibrations on MOSFET Stress Sensors

12. In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors

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