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The usual way for reduce outgassing of a large structure in vacuum is to bake the whole vacuum chamber containing the structure. However, this method needs a huge heater capacity and there are limits caused by the heat expansion of the chamber. The solution is to raise the temperature of the structure inside without heating the vacuum chamber. This is achieved by installing a heat source inside the chamber and by inserting the heat shield between the structure and the chamber walls to direct the heat to the structure. In the particle accelerator field, it is often required to reduce outgassing of structures inside vacuum chambers. One example is a kicker magnet, which is installed in a vacuum chamber and consists mainly of ferrite and aluminum alloy. As known from former experience the main outgassing component from ferrite is water. We applied the above mentioned method to the outgassing reduction of such a kicker. We are able to direct most of the heat flow toward the kicker magnet by inserting the heat shielding plates and thus outgassing was successfully reduced.

Facing targets sputter deposition provides defect-less quenched films, which do not sustain plasma damage so much. In order to improve its low efficiencies of target erosion and deposition rate, gradient facing targets system, V cathodes, is proposed. Through this improvement the sputtering voltage is reduced about 5%, the deposition rate is doubled and the film thickness becomes more uniform in comparison with those for conventional facing targets.