301. The path to affordable and available 640x480 uncooled FPAs (Invited Paper)
- Author
-
Francis P. Pantuso
- Subjects
Microelectromechanical systems ,Engineering ,Pixel ,business.industry ,Integrated circuit ,Automotive engineering ,law.invention ,Cost reduction ,Reduction (complexity) ,law ,Path (graph theory) ,Electronic engineering ,Wafer ,business ,Sensitivity (electronics) - Abstract
The cost of high sensitivity, high resolution, (640x480) Uncooled IR (UCIR) sensors is too high for the sensors to widely proliferate. To achieve cost reduction and production capacity goals, improvements are required in the following areas: the Read-out Integrated Circuit (ROIC), the pixel design, the Integrated Circuit Processing of MEMS structures, vacuum package design, batch assembly package processing and automated testing. The improvements result in increased yield at the wafer level, increased yield through packaging, lower labor assembly and testing costs and improved performance. A cost model will be presented to show the interrelationship of the various costs and how the reduction in cost may be achieved.
- Published
- 2005