12 results on '"Koji Nishi"'
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2. D2ELPHI Compact Thermal Model Development and Standardization for Transient Simulation
3. 3D semiconductor package model for precise thermal analysis
4. New Compact Thermal Model Development and Temperature Prediction for Microprocessor Packages
5. Research on Package Thermal Resistance of Power Semiconductor Devices
6. H112 Modeling of Transient Thermal Behavior at Microprocessor Hot Spot
7. D122 Transient Heat Conduction Simulation around Microprocessor Die Investigation of Variable Cooling Performance by Heatsink Fan
8. C114 Transient Heat Conduction Simulation around Multi-Core Processor Die
9. B132 Thermal Resistance Evaluation of Electronic Equipment by Iterative Calculation
10. J0310101 Investigation regarding Thermal Spreading Resistance Where Heat Flow Is Split
11. J012032 Transient Thermal Analysis for Electronic Equipment Utilizing One-Dimensional Thermal Network Modeling of Transient Thermal Resistance Behavior
12. J061014 Investigation of Microprocessor Power Estimation Equation for Transient Heat Transfer Simulation
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