J012032 Transient Thermal Analysis for Electronic Equipment Utilizing One-Dimensional Thermal Network Modeling of Transient Thermal Resistance Behavior

Authors :: Masaru Ishizuka
Tomoyuki Hatakeyama
Koji Nishi
Source :: The Proceedings of Mechanical Engineering Congress, Japan. 2013:J012032-1
Publication Year :: 2013
Publisher :: Japan Society of Mechanical Engineers, 2013.

Subjects :: Materials science
Thermal network
Thermal resistance
Nuclear engineering
Transient (oscillation)
Thermal analysis
Electronic equipment

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