J012032 Transient Thermal Analysis for Electronic Equipment Utilizing One-Dimensional Thermal Network Modeling of Transient Thermal Resistance Behavior

MLA

Masaru Ishizuka, et al. “J012032 Transient Thermal Analysis for Electronic Equipment Utilizing One-Dimensional Thermal Network Modeling of Transient Thermal Resistance Behavior.” The Proceedings of Mechanical Engineering Congress, Japan, vol. 2013, Jan. 2013, pp. J012032-1. EBSCOhost, https://doi.org/10.1299/jsmemecj.2013._j012032-1.

APA

Masaru Ishizuka, Tomoyuki Hatakeyama, & Koji Nishi. (2013). J012032 Transient Thermal Analysis for Electronic Equipment Utilizing One-Dimensional Thermal Network Modeling of Transient Thermal Resistance Behavior. The Proceedings of Mechanical Engineering Congress, Japan, 2013, J012032-1. https://doi.org/10.1299/jsmemecj.2013._j012032-1

Chicago

Masaru Ishizuka, Tomoyuki Hatakeyama, and Koji Nishi. 2013. “J012032 Transient Thermal Analysis for Electronic Equipment Utilizing One-Dimensional Thermal Network Modeling of Transient Thermal Resistance Behavior.” The Proceedings of Mechanical Engineering Congress, Japan 2013 (January): J012032-1. doi:10.1299/jsmemecj.2013._j012032-1.