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New Compact Thermal Model Development and Temperature Prediction for Microprocessor Packages

Authors :
Koji Nishi
Source :
The Proceedings of the Thermal Engineering Conference. 2019:0030
Publication Year :
2019
Publisher :
Japan Society of Mechanical Engineers, 2019.

Subjects

Subjects :
Microprocessor
Development (topology)
Computer science
law
Thermal model
Automotive engineering
law.invention

Details

ISSN :
2424290X
Volume :
2019
Database :
OpenAIRE
Journal :
The Proceedings of the Thermal Engineering Conference
Accession number :
edsair.doi...........e12328e9f93d6bea3f69d9bcf1daf039
Full Text :
https://doi.org/10.1299/jsmeted.2019.0030
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