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The article focuses on the steps in creating a printed circuit board (PCB), the process of assembling it and the need of using sensors in conventional PCBs to measure various physical aspects. Other topics include flex boards, the thermal comparison between flex and rigid boards and the application of these PCBs in wearable technology.

The article features Electronic Technologies International Inc. (ETI), a provider of printed circuit board (PCB) assembly, wire harness assembly and box build services. It discusses the company's production strategy which is high-mix, low volume. Its assemblies made are for power generation and utility equipment, military and aerospace equipment, and medical devices.

The article discusses importance of cable, connector, and antenna selection for Internet of Things modules. It mentions choice of antenna depends upon various factors such as power requirement, directionality, and polarization. It also discusses need of understanding difference between gain chip or printed circuit board (pcb) antennas before selecting it for IoT modules.

The article focuses on how electronic designers address printed circuit board (PCB) space restrictions while improving electrical performance and reliability. Technology innovations are discussed such as the evolution of decoupling capacitors that freed up PCB space. Two strategies to reduce the equivalent series inductance (ESL) of a capacitor are explained along with the consequences of this evolution. The land-grid array capacitor is presented together with the low-inductance capacitor array, and the feed-thru array.

The article provides a global market outlook for the printed circuit board (PCB) industry for 2011. An accelerating growth in PCB market is predicted in early 2011 for all regions except China as well as a seasonal recovery early in the year. On the other hand, Custer Consulting Group's global PCB shipment model predicted a seasonal downturn in early 2011. A total of 620 million U.S. dollars is being invested by AT&S to expand PCB manufacturing capacity in China. Vision Engineering Manufacturing Services has been launched by Vision Engineering.

The article offers an outlook for the printed circuit board (PCB) market for 2011. Due to broad based but modest growth in electronic production, global PCB shipments are expected to increase by 6 percent in 2011. In China, total monthly production capacity of Plated-Through-Hole (PTH) boards is expected to reach 200 million square feet. The plan of Fuba Printed Circuits Tunisie to increase capacity by 40 percent is also cited.

The article reports on the status of the global electronic equipment shipment industry. The printed circuit board (PCB) industry of Korea has increased its revenue to 12 trillion Korean won. The income from global lithium ion battery materials is expected to increase to 652.1 billion yen in 2014 from 306.6 billion yen in 2009. The provider revenue for original design manufacturing (ODM) and electronic manufacturing services (EMS) is expected to increase to 280.8 billion U.S. dollars in 2010.

The article deals with the required features of printed circuit boards (PCBs) used in medical products, such as quality, repeatability, and reliability. These requirements are said to be practiced at the layout, fabrication, and assembly stages of PCBs. PCB compliance with ISO 13485 is said to complement the requirements and guarantee quality assurance, robustness, repeatability, traceability, and reliability.

The article presents an outlook for the overall performance of the global printed circuit board (PCB) industry in 2010. The authors state that the growth rates for PCB companies for the year are impressive. They also suggest that even if the firms have experienced a lot of challenges in 2009 they can still expect improvements in demands and sales for the year.

The article reports on the recovery of the electronics industry for 2009. It states that the U.S.'s domestic electronic equipment as well as communications equipment orders rose. It notes that the printed circuit board industry in Southeast Asia are almost fully recovered. Meanwhile Japan's printed circuit board (PCB) fabrication sector posted an increase in revenue to 12.7%. In addition, 3M introduced the Medalist i3070 Series 5 in-circuit test platform.

The article discusses the status of the printed circuit boards (PCBs) sector during global economic recession in 2009. SE Asia is reported to be dominating world PCB production. However, PCB shipments is expected to experience a 25% global decline in 2009 compared to 2008. Also highlighted are updates on several electronics companies, including Bare Board Group which was named as Supplier of the Year award from National Instruments, Eurocircuits which opened a production plant in Aachen, Germany, and K&F Electronics which acquired Ultima Circuits.

The article focuses on developments and forecasts for sectors struggling to recover from the 2009 economic crisis. Southeast Asia will probably lead the recovery, followed by North America, Japan and Europe. It is stated that 2009 will be difficult for vendors of capital equipment and that part of the Asian upturn may just be inventory replacement. The capability of monitoring the market on a monthly basis is also indicated.

The article offers a look at the global electronics industry. According to the author, growth rates throughout the industry food chain reflect the timing and severity of the current world recession. A chart is presented which shows the business cycle for electronic equipment, chips and printed circuit boards (PCBs) as of February 2009.

The article discusses the role of pitch surface mount (SM) devices in subassemblies in printed circuit board (PCB) manufacturing. It highlights several considerations for creating a pad stack for a fine pitch design. According to the author, fine pitch devices require extremely tight tolerance control for the correct level of etching.

The article focuses on competitiveness in the printed circuit board (PCB) industry. It mentions the three major trends in the electronics industry that add complexity of the product development and delivery process namely globalization, competition and consolidation. It also discusses several advanced PCB technologies that are available to the electronics company including HDI/microvia fabrication and systems-in-package.

This section offers news briefs on the printed circuit board (PCB) industry. The 2008 International Printed Circuit and Electronics Assembly Fair has opened. The Fremont, California operation of Isola Group will be closed effective February 18, 2009. The review of the Restriction of Hazardous Substances (RoHS) Directive has been released by the European Union Commission.

This section offers news briefs related to the printed circuits industry as of December 2008. Institute for Printed Circuits' (IPC) North American Printed Circuits Board (PCB) Statistical Program shows that the PCB shipments dropped to 3.8% and bookings were at 16.4%. Plexus had a record revenue of $476 million. DuPont's electronic and communication technologies sales increased to 13% to $1.1 billion.

The article provides information on the design rules and guidelines for computer-aided manufacturing and computer-aided design (CAM/CAD) which are used in the printed circuits board (PCB) industry. Accordingly, the increasing signal speed as well as the use of fine pitch components are among the challenges that the industry faces in relation to the design and fabrication. It is mentioned that layout design is the prime focus of CAM/CAD guidelines.

This section offers news briefs on the printed circuit board (PCB) industry as of 2008. The North American semiconductor industry has reported a U.S.$905 million in orders and a book-to-bill ratio of 0.83 for July. Clark Scharett and Justin Weiler were both appointed as manufacturing process engineers at Indium Corp. MacDermid has established a new photovoltaic business unit in order to coordinate its global efforts with the PCB industry.

This section offers electronics industry news briefs. Rohm and Haas Electronic Materials has increased its investments at its manufacturing facility in Taiwan. Mania Belgium has announced the continuity of Printed Circuit Board (PCB) Plotter and software sales and support in Europe. Endicott president and chief executive officer (CEO) James McNamara has received the Entrepreneur of the Year Award.

A directory of electronics and related suppliers for the printed circuit board (PCB) industry is presented.

The article presents an outlook for the electronics industry. It cites the performance of electronic equipment production in Southeast Asia and Japan, and the challenges to China's low-cost manufacturing position. For the U.S., it describes the growth of end-market demand and the performance of the North American printed circuit board (PCB) market. An upturn in the PCB market is predicted for July or August 2008. Also discussed are PCB fabrication, materials and process equipment, and electronic manufacturing services and related assembly activity.

This section offers news briefs on the printed circuit industry as of August 2008. Calumet Electronics has installed FASTechnologies' SmartParts drill automation software. SEMI has reported that worldwide semiconductor manufacturing equipment billings have reached US$10.56 billion in Q1 FY08. The Dow Chemical Co. has raised prices by 25% in July to offset rising cost of energy and hydrocarbon feedstocks.

The article presents a market outlook for the electronics industry as of July 2008. North American semiconductor and printed circuit board sales may experience a downward pattern. Printed circuit board (PCB) manufacturers in Taiwan reportedly plan to raise prices in third quarter to compensate for rising input prices. Isto Hantila Aspocomp chief executive officer (CEO) recognizes a risk of a liquidity crisis.

The article discusses the technology, business and geographical drivers that shaped the printed circuit industry. It is suggested that original equipment manufacturers (OEM) initiated the efforts for outsourcing to Asian countries for printed board manufacturing market. IPC-D-350 standard also has enhanced the intelligent data transfer and manufacturability. Printed board fabrication needs that have been identified are also enumerated.

This article offers guide to testing high-density interconnect (HDI) boards. Although it is being considered as the fastest-growing segment of the printed circuit board (PCB) industry, HDI also presents challenges. One example is the limited access testability due to the emergence of new components. Some of the solutions advised to address the challenges associated with the use of HDI boards include boundary scan, in-circuit cluster test (ICCT), analog boundary scan, powered cluster tests, padless bead test and flying probe.

This article focuses on the lead-free hot air solder leveling (HASL) system. It also describes the use of a tin-copper-nickel proprietary alloy known in the industry as SN100C. This type of alloy is being used in both wave, selective and hand soldering in electronic assembly. The HASL version of SN100C is SN100CL, and it is widely adopted within the printed-circuit board (PCB) industry as the de facto standard for LF HASL. The pros and cons for using lead-free alloy are listed. One of which is that some alloys are cost prohibitive.

This article offers an outlook on the global electronics market. In October and November 2007, domestic electronic equipment orders declined due to the weakened communication and military demands in the U.S. market. The demand for North American printed circuit is waning despite the increase of bookings in November 2007. The total market share of the electronic chemicals industry was U.S.$35 billion in 2007.

The article presents a market outlook for the printed circuit industry. Issues of less liquidity and buying confidence have arisen following the sub-prime mortgage/housing/financial crisis announcements in August 2007. The U.S. ISM has decreased in August and September 2007 while growth in the electronic equipment industry has flattened since only the communication sector expanded. Electronic equipment shipment shipments increased by 35% in Taiwan/China but dropped by 2% in Japan.

The article discusses the changes in the printed wiring board (PWB) industry for the past 20 years. Screen printing have improved throughput and resolution, with robots working at the screen printing lines. In 1987, large, innovative board shops were owned by original equipment manufacturers (OEMs) that are vertically integrated, including IBM, Alcatel and Siemens.

The article presents a market outlook for the printed circuits industry. In North America, rigid printed circuit board (PCB) orders and shipments are both down about 12 percent on a three-month growth basis compared to 2006. Globally, electronic equipment production growth is up 27 percent in Southeast Asia. Semiconductor shipments to North America also experienced a downturn in the first half of 2007.

The article deals with the improvement in the growth prospects for the global electronics industry for the second half of 2007. It is reported that Founder Technology will float new stocks in South Korea by year-end to support printed circuits board (PCB) manufacturing expansion. On the other hand, Fujikura created next-generation flexible circuits that feature optical fibers for high-speed applications. Gold Circuit Electronics is increasing its notebook PCB capacity.

The article reports on the efforts of engineers in the printed circuit board (PCB) industry, on designing and developing technologies to more effectively attach packages and silicon to the PCB. The author says that one of the major concerns of the industry is the coefficient of thermal expansion (CTE) mismatch between components and their interconnect or PCB. He states that there are different types of PCB materials available in the market that give a designer the ability to control the CTE.

The article discusses the outlook for 2007 in the printed circuit board (PCB) industry and semiconductor shipments. It reports that the world PCB industry behaved much less vibrantly in the beginning of 2007 with the PCB model showing a large post-holiday season drop. Meanwhile, the World Semiconductor Trade Statistics now forecasts only two percent global chip shipment growth in 2007.

The author reflects on the effects of environmental concerns and legislation on printed circuit board (PCB) production. He says that there is a growing awareness in the need for sustainable operations in the PCB industry to minimize the impacts on people and the environment. He points out that making the correct choices of materials and processes is important for environmental compliance. He argues that restrictions and legislation affect laminate suppliers and manufacturers.

The article discusses the advantages of material preselection for printed circuit board (PCB) design and production. It mentions that rigid and flexible circuit designers should consider end-product safety issues such as flammability, delamination and maximum operating temperatures. It cites polyimide films as the most commonly used material for manufacturing flexible PCBs. It stresses that preselection allows designers to determine the function of a component in the end-product use.

The article discusses the complexities of outsourcing to Asia, particularly in China, for printed circuit board (PCB) manufacturers. It mentions that China is able to offer lower prices compared in Europe or North America as well as cheap labor costs. It states that large international companies assess the expenditures to support Asian suppliers in the region of 20 to 35 percent of the total purchase volume. It cites the factors that PCB manufacturers should consider before outsourcing in Asia.

The article presents an update on the printed circuit board (PCB) industry as of May 2007. Aspocomp bought out its joint venture partner Chin Poon's share of ACP Electronics and plans to close its plant in Salo, Finland. Crane Aerospace & Electronics entered into a manufacturing agreement with Athena Technologies for circuit cards for unmanned aerial vehicle flight controls. Indiana Life Sciences has acquired Electronic Control.

The article focuses on the increasing number of high density interconnect (HDI) mass production manufacturers that are implementing laser direct imaging (LDI) technology as their imaging solution. The imaging requirements for HDI mass production include the ability of stable production of high accuracy jobs typical for HDI while achieving low defect rate and high yields. The advantages of the advances in LDI technology for the production of materials for printed circuits are discussed.

The article discusses the advances in image transfer in printed wiring board (PWB) fabrication. Semi-additive processes for PWB fabrication involves plating electroless copper into the unstructured build-up dielectric surface and the microvia hole walls. The article also discusses technologies used in PWB fabrication.

The article focuses on a study which examined the susceptibility of glass-reinforced epoxy laminates to conductive anodic filamentation (CAF), a sub-surface phenomenon seen in glass-reinforced epoxy laminates when used in the manufacture of printed circuit assemblies. The study discovered that CAF can be detected by measurement of changes in electrical resistance between through hole vial walls, or other failure sites within the test vehicle.

The article discusses various developments and challenges of printed-circuit board (PCB) mechanical drilling. It also provides information on the state-of-the-art concepts including new design methods of micro drill bits, micro drill bit material and coating techniques steel shank drill bits and new types of micro drill bits, as well as the challenges of mechanical drilling. It reveals that finite element analysis of micro bits is applied as the theoretical analysis tool to optimize drill bits parameters.

The article discusses the highlights of the 20th China Printed Circuit Association (CPCA) Show held at the New International Expo Centre in Pudong, Shanghai, China from March 16 to 18, 2010. The brand-new touchless transportation system (TTS) for its horizontal, conveyorized platers was featured by Atotech. Orbotech presented the Paragon-Xpress 9, a laser direct imaging tool that combines two exposure systems. Circuit Foil Luxembourg displayed its Doublethin copper foils which is now becoming popular in modified semi-additive process (MSAP).

An interview with consultant Dan Beaulieu is presented. When asked about his job, Beaulieu says he is a sort of catcher in the rye for board shops by helping them figure out a way to get more business. He says he focuses on a company's strategy and suggests that in order to succeed, a company has to define itself and develop its brand. He adds that he has been a manufacturing expert for 30 years and has been in consulting for half that time. He claims to have worked with more printed circuit board companies than anyone else in the industry's history.

The article offers several cost savings suggestions for circuit board retail shop operators. It discusses the need for an operator know where their money goes. Another suggestion is installing a security camera to control theft and checking on expenses by cutting back on unnecessary expenses. To summarize, the best thing one can do is to save, know to say No and use the available materials wisely.

The article discusses the experiences of BrigitFlex Inc. president Brigitte Lawrence and TRC Circuits president Melanie Bera in the printed circuit board (PCB) industry. Bera relates that with the prototypes business of TRC, the company see declines before others which make them experience growth sooner as well. Lawrence shares that as a small business owner, she has had to work on a limited budget and associate herself with suppliers to learn about new trends in the PCB market.

The article evaluates technical products including the Intermediate Data Format (IDF) Plug-In for PCB123™ from Sunstone Circuits, the flexible heaters design kit from Minco and the Open Access-based process design kit (PDK) from AWR and austriamicrosystems AG.

The article discusses the emerging market of photovoltaic cells which is seen as favorable to the printed circuit board (PCB) industry. The photovoltaic market stands at US$15 billion and is growing by 52% annually. It is predicted that there will be an oversupply of photovoltaic production until 2012 or 2016, but a permanent undersupply thereafter as growth takes off. While Germany and Japan are already in the photovoltaics sector, China and the Arab oil producers are reportedly entering the industry.

This article focuses on the condition of the printed circuit board industry in Europe during the past seven years and the role of distribution in the industry's future. Several changes occurred in the industry since 2000. These include delocalization, shrinkage and business instability. Several manufacturers have closed, consolidated and experienced low investments. Distribution will be critical for the success of the whole supply chain.

The article offers a look at the state of printed circuit board (PCB) manufacturing in China as of April 2008. The two companies known for high-reliability PCB are Shennan Circuits Co., Ltd. based in Shenzen and Dongguan Somacis Graphic PCB Co., Ltd. based in Guangdong. According to the author, both companies bring decades of experience in PCB manufacturing, specially for the high-technology and high-reliability markets.