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HASL and Flow: A Lead-Free Alternative.

Authors :
Scimeca, Tom
Sikorcin, Glenn
Lentz, Tony
Source :
CircuiTree; Feb2008, Vol. 21 Issue 2, p24-33, 5p
Publication Year :
2008

Abstract

This article focuses on the lead-free hot air solder leveling (HASL) system. It also describes the use of a tin-copper-nickel proprietary alloy known in the industry as SN100C. This type of alloy is being used in both wave, selective and hand soldering in electronic assembly. The HASL version of SN100C is SN100CL, and it is widely adopted within the printed-circuit board (PCB) industry as the de facto standard for LF HASL. The pros and cons for using lead-free alloy are listed. One of which is that some alloys are cost prohibitive.

Details

Language :
English
ISSN :
1059843X
Volume :
21
Issue :
2
Database :
Complementary Index
Journal :
CircuiTree
Publication Type :
Periodical
Accession number :
28812580