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HASL and Flow: A Lead-Free Alternative.
- Source :
- CircuiTree; Feb2008, Vol. 21 Issue 2, p24-33, 5p
- Publication Year :
- 2008
-
Abstract
- This article focuses on the lead-free hot air solder leveling (HASL) system. It also describes the use of a tin-copper-nickel proprietary alloy known in the industry as SN100C. This type of alloy is being used in both wave, selective and hand soldering in electronic assembly. The HASL version of SN100C is SN100CL, and it is widely adopted within the printed-circuit board (PCB) industry as the de facto standard for LF HASL. The pros and cons for using lead-free alloy are listed. One of which is that some alloys are cost prohibitive.
Details
- Language :
- English
- ISSN :
- 1059843X
- Volume :
- 21
- Issue :
- 2
- Database :
- Complementary Index
- Journal :
- CircuiTree
- Publication Type :
- Periodical
- Accession number :
- 28812580