47 results on '"Huang, J. H."'
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2. Enhanced Reactivity of Electroless Cu Interconnection by Surface Oxidation Pretreatment
3. Key steps from laboratory towards mass production: Optimization of electroless plating process through numerical simulation
4. A novel method of low temperature, pressureless interconnection for wafer level scale 3D packaging
5. Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating
6. Effects of Isothermal Heat Treatment on Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection Structure
7. Quasi-Monte Carlo simulation based economic dispatch with wind power integrated
8. Assessment of an integrated energy system embedded with power-to-gas plant
9. Application of a Damping Torque Analysis index for coordinated tuning of stabilisers in a large power grid
10. Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process
11. High temporal resolution electrochemical biosensor using nitrogen-incorporated nanodiamond ultra-microelectrode array
12. Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process.
13. Vacuum field emission integrated differential amplifier
14. Nanodiamond vacuum field emission integrated devices
15. Nanodiamond vacuum field emission triode signal amplifier
16. Applying multi-agent approach to mixed-model assembly line balancing
17. Structural design, process, and reliability of a wafer-level 3D integration scheme with Cu TSVs based on micro-bump/adhesive hybrid wafer bonding
18. Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies
19. Process integration and reliability test for 3D chip stacking with thin wafer handling technology
20. An instruction to high thermal conductive materials
21. Control of crystalline volume fraction of μC-Si thin film using 40.68 MHz PECVD system for solar cell application
22. AC performance of a novel carbon nanotube vacuum field emission differential amplifier IC
23. Development of Carbon Nanotubes Vacuum Field Emission Differential Amplifier Integrated Circuits
24. Carbon Nanotube Lateral Field Emitters with Metallic Anode
25. Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies.
26. A sensor based tracking system using witnesses.
27. Support for mobility and fault tolerance in Mykil.
28. Stochastic Magnetoresistance Behavior in Current-Perpendicular-to-Plane Submicron Spin Valve Pillars.
29. A high efficiency complementary GaAs power FET technology for single supply portable applications.
30. Design and implementation of multimedia conference system on broadcast networks.
31. P-HEMTs for low-voltage portable applications using filled gate fabrication process.
32. Characterization and CMRR Modeling of a Carbon-Nanotube Field-Emission Differential Amplifier.
33. Spin Transistor for Magnetic Recording.
34. VirtualTalker: an online multimedia system on token passing networks.
35. Anisotype-gate self-aligned p-channel heterostructure field-effect transistors.
36. Threshold voltage model for deep-submicrometer MOSFETs.
37. Nb Lateral Josephson Junction Induced by Inverse Proximity Effect With NiFe.
38. Effects of Annealing on Magnetic Properties of New Ferromagnetic Semiconductor (In, Al, Mn)As.
39. Direct-coupled FET logic circuits on InP.
40. Mykil: a highly scalable key distribution protocol for large group multicast.
41. Resource-allocation strategy in integrated voice/data CDMA communication networks.
42. A true enhancement mode single supply power HFET for portable applications.
43. AlGaAs/InGaAs power P-HEMTs for high-efficiency, low-voltage portable applications.
44. MHTP-a multimedia high-speed transport protocol.
45. A real-time scheduling policy for multimedia applications on broadcast networks.
46. Robust nonlinear control of robot manipulators.
47. Ultrasound Localization of Nitinol Wire of Sub-Wavelength Dimension.
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