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Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process.
- Source :
- 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials & Devices & Workshop on Piezoresponse Force Microscopy; 2014, p141-144, 4p
- Publication Year :
- 2014
Details
- Language :
- English
- ISBNs :
- 9781479938605
- Database :
- Complementary Index
- Journal :
- 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials & Devices & Workshop on Piezoresponse Force Microscopy
- Publication Type :
- Conference
- Accession number :
- 99488515
- Full Text :
- https://doi.org/10.1109/ISAF.2014.6917832