55 results on '"NEWMAN, K"'
Search Results
2. P30 Real-world tolerability study of nintedanib in patients with progressive fibrosing interstitial lung disease compared to patients with idiopathic pulmonary fibrosis
3. P23 Predictors of mortality in progressive fibrosing interstitial lung disease patients treated with Nintedanib: real-world data from a single ILD specialist centre
4. Interstitial lung disease with pulmonary hypertension and the potential for inhaled Treprostinil: A single centre perspective
5. P56 What happens to patients with idiopathic pulmonary fibrosis who are not eligible for antifibrotic treatment due to current NICE guidelines
6. Performance characterization of a phase-induced amplitude apodization complex focal plane mask
7. Defining Operational Limits of a Riser-less CT Intervention System
8. Advancements in Fatigue Testing and Analysis
9. Design and implementation of the NPOI database and website
10. Progress toward unprecedented imaging of stellar surfaces with the Navy precision optical interferometer
11. 6-station, 5-baseline fringe tracking with the new classic data acquisition system at the Navy Precision Optical Interferometer
12. Development and recent results from the Subaru coronagraphic extreme adaptive optics system
13. Dynamic Well Intervention Modeling
14. Status report on the Large Binocular Telescope's ARGOS ground-layer AO system
15. Lifetime estimation of wireless body area sensor network for patient health monitoring
16. Dynamic FEA Models for Snubbing Buckling and Riserless Subsea Wireline Intervention
17. A Partnership for Senior Design Projects in Biomedical and Mechanical Engineering
18. Modeling and Measuring Dynamic Well Intervention Stack Stress
19. Dynamic Excitation Tool: Developmental Testing and CTD Field Case Histories
20. Trust and reputation approach to smart grid security.
21. Frequency variations in hybrid renewable energy network with integrated storage.
22. Design and Evaluation of a Green Ambulance.
23. Material characterization of corner and edgebond epoxy adhesives for the improvement of board-level solder joint reliability.
24. Surface analysis of outgassing contamination from edgebond epoxy adhesives on ImAg pads.
25. Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysis.
26. Investigation of mixed SAC and SnPb solder balls under high speed ball shear and pull tests.
27. Board-level solder joint reliability of high performance computers under mechanical loading.
28. Improved Observation and Communication with a Distributed Compound Vision Surveillance System.
29. High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed.
30. Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls during High Speed Ball Shear and Cold Ball Pull Tests.
31. Effect of Thermal Aging on High Speed Ball Shear and Pull Tests of SnAgCu Lead-free Solder Balls.
32. Comparison of Joint Strength and Fracture Energy of Lead-free Solder Balls in High Speed Ball Shear/Pull Tests and their Correlation with Board Level Drop Test.
33. Development of a Stiff-String Forces Model for Coiled Tubing
34. Modified CT Limits Analysis for Practical Well Intervention Design
35. Mixed signal design and test education for high quality packaging development.
36. Development of electroless Ni/Au plated build-up flip chip package with highly reliable solder joints.
37. Board-level solder joint reliability comparison of five unique memory package constructions.
38. Intervention in Wells with Buckled Production Tubing
39. Quality assurance and in-house testing
40. The Feasibility of Using an Electric Downhole Motor to Drill with Coiled Tubing
41. Analysis of Coiled Tubing Welding Techniques
42. Developments in Coiled Tubing BOP Ram Design
43. Analysis of Slack-Off Force Transmitted Downhole in Coiled-Tubing Operations
44. Validation of Coiled-Tubing Penetration Predictions in Horizontal Wells
45. INFORMAL DISCUSSION. MATERIALS FOR PILES.
46. BGA brittle fracture - alternative solder joint integrity test methods
47. Development of electroless Ni/Au plated build-up flip chip package with highly reliable solder joints
48. Board-level solder joint reliability comparison of five unique memory package constructions
49. Solder Joint Integrity of Various Surface Finished Build-Up Flip Chip Packages by 4-point Monotonic Bending Test
50. BGA brittle fracture - alternative solder joint integrity test methods.
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.