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Board-level solder joint reliability of high performance computers under mechanical loading.
- Source :
- EuroSimE 2008 - International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Micro-Systems; 2008, p1-15, 15p
- Publication Year :
- 2008
Details
- Language :
- English
- ISBNs :
- 9781424421275
- Database :
- Complementary Index
- Journal :
- EuroSimE 2008 - International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Micro-Systems
- Publication Type :
- Conference
- Accession number :
- 81134619
- Full Text :
- https://doi.org/10.1109/ESIME.2008.4525109