Investigation of mixed SAC and SnPb solder balls under high speed ball shear and pull tests.

Details

Language :

English

ISBNs :

9781424441600

Database :

Complementary Index

Journal :

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems

Publication Type :

Conference

Accession number :

81134631

Full Text :

https://doi.org/10.1109/ESIME.2009.4938414