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Investigation of mixed SAC and SnPb solder balls under high speed ball shear and pull tests.
- Source :
- EuroSimE 2009 - 10th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems; 2009, p1-8, 8p
- Publication Year :
- 2009
Details
- Language :
- English
- ISBNs :
- 9781424441600
- Database :
- Complementary Index
- Journal :
- EuroSimE 2009 - 10th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems
- Publication Type :
- Conference
- Accession number :
- 81134631
- Full Text :
- https://doi.org/10.1109/ESIME.2009.4938414