Cite
Investigation of mixed SAC and SnPb solder balls under high speed ball shear and pull tests.
MLA
Fubin Song, et al. “Investigation of Mixed SAC and SnPb Solder Balls under High Speed Ball Shear and Pull Tests.” EuroSimE 2009 - 10th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems, Jan. 2009, pp. 1–8. EBSCOhost, https://doi.org/10.1109/ESIME.2009.4938414.
APA
Fubin Song, Tong Jiang, Lo, J. C. C., Lee, S. W. R., & Newman, K. (2009). Investigation of mixed SAC and SnPb solder balls under high speed ball shear and pull tests. EuroSimE 2009 - 10th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems, 1–8. https://doi.org/10.1109/ESIME.2009.4938414
Chicago
Fubin Song, Tong Jiang, J.C.C. Lo, S.W.R. Lee, and K. Newman. 2009. “Investigation of Mixed SAC and SnPb Solder Balls under High Speed Ball Shear and Pull Tests.” EuroSimE 2009 - 10th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems, January, 1–8. doi:10.1109/ESIME.2009.4938414.