122 results on '"Xu, Gaowei"'
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2. Data-driven optimization of repair schemes and inspection intervals for highway bridges
3. Sustainability-oriented maintenance management of highway bridge networks based on Q-learning
4. Experimental and Numerical Analysis of Straw Motion under the Action of an Anti-Blocking Mechanism for a No-Till Maize Planter.
5. An optimized through-via bottom-up method for simultaneous-filling TSVS of different aspect-ratios and its potential application on high-frequency passive interposer
6. A dynamic priority strategy for IoV data scheduling towards key data
7. Tensile strength of plain concrete under sustained load by PT machine
8. Effects of small-scale patchiness of alpine grassland on ecosystem carbon and nitrogen accumulation and estimation in northeastern Qinghai-Tibetan Plateau
9. Effects of microstructure of copper used in redistribution layer on wafer warpage evolution during the thermal process
10. Experimental identification of thermal induced warpage in polymer–metal composite films
11. The complete mitochondrial genome of Accipiter virgatus and evolutionary history of the pseudo-control regions in Falconiformes
12. A user behavior prediction model based on parallel neural network and k-nearest neighbor algorithms
13. High performance suspended spiral inductor and band-pass filter by wafer level packaging technology
14. Wafer level high-density trench capacitors by using a two-step trench-filling process
15. Design and fabrication of wafer level suspended high Q MIM capacitors for RF integrated passive devices
16. Stress evolution during thermal cycling of copper/polyimide layered structures
17. Sustainable Improvement of Planting Quality for a Planar 5R Parallel Transplanting Mechanism from the Perspective of Machine and Soil Interaction.
18. Novel combined through-wafer-groove fabrication approach and its application in wafer level packaging of GaAs CCD
19. Optimal design toward enhancement of thermomechanical reliability of polyimide layers in a flip-chip-on-lead-frame dual flat no-leads package with copper pillar bumps
20. Development of wafer level glass frit bonding by using barrier trench technology and precision screen printing
21. Chapter 15 - Dynamic bridge maintenance management in smart cities using routine inspection data and hazard modeling
22. Influence of the Viscoelastic Properties of the Polyimide Dielectric Coating on the Wafer Warpage
23. Performance Improvement of a Geared Five-Bar Transplanting Mechanism for Salvia miltiorrhiza by Orthogonal Design Based on an Interactive Human–Computer Auxiliary Interface.
24. Study of Mechanical-Chemical Synergistic Weeding on Characterization of Weed–Soil Complex and Weed Control Efficacy.
25. Optimal Design and Analysis of Cavitating Law for Well-Cellar Cavitating Mechanism Based on MBD-DEM Bidirectional Coupling Model.
26. Process development of a novel wafer level packaging with TSV applied in high-frequency range transmission
27. Heat-transfer characteristics and design optimization for a small-sized plate-fin heat sink array
28. Predicting the Remaining Useful Life of Corroding Bridge Girders Using Bayesian Updating.
29. Predicting Human Intention-Behavior Through EEG Signal Analysis Using Multi-Scale CNN.
30. Contributors
31. A Deep Segmentation Network of Multi-Scale Feature Fusion Based on Attention Mechanism for IVOCT Lumen Contour.
32. A One-Dimensional CNN-LSTM Model for Epileptic Seizure Recognition Using EEG Signal Analysis.
33. Copper/benzocyclotene thin film technique based microstrip bandpass filter featured by thick dielectric layer for low insertion loss.
34. Anomalous Trajectory Detection and Classification Based on Difference and Intersection Set Distance.
35. Online Fault Diagnosis Method Based on Transfer Convolutional Neural Networks.
36. Patient-Specific Coronary Artery 3D Printing Based on Intravascular Optical Coherence Tomography and Coronary Angiography.
37. Effects of microstructure of copper used in redistribution layer on wafer warpage evolution during the thermal process.
38. Train movement simulation by element increment method.
39. Design and fabrication of suspended high Q MIM capacitors by wafer level packaging technology.
40. Thermomechanical behavior of nanotwinned copper interconnection line in wafer level packaging and the influence on wafer warpage.
41. Explore of warpage origination in WLP and processing influence factors by experiment and theoretical modeling.
42. Influence of polyimide on thermal stress evolution in polyimide/Cu thick film composite.
43. Control of Eospalax baileyi (Plateau Zokor) with Arrow Traps in Western China.
44. A novel redistribution layer tailored by nanotwinned copper decreases warpage in wafer level packaging.
45. Experimental identification of warpage origination during the wafer level packaging process.
46. Superior thermal stability of redistribution layer tailored by nanotwinned copper and the influence on wafer warpage.
47. Warpage and stress optimization of wafer-level package of MEMS with glass frit bonding.
48. A new designed trench structure to reduce the wafer warpage in wafer level packaging process.
49. Low cost fabrication of TSV-based silicon interposer using wet chemical etching and its application in 3D packaging.
50. Community Dynamics of Rodents After the Earthquake in Yingxiu, Sichuan Province, China.
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