A new designed trench structure to reduce the wafer warpage in wafer level packaging process.

Details

Language :

English

ISBNs :

9781479947072

Database :

Complementary Index

Journal :

2014 15th International Conference on Electronic Packaging Technology

Publication Type :

Conference

Accession number :

99488252

Full Text :

https://doi.org/10.1109/ICEPT.2014.6922729