Warpage and stress optimization of wafer-level package of MEMS with glass frit bonding.

Details

Language :

English

ISBNs :

9781479947072

Database :

Complementary Index

Journal :

2014 15th International Conference on Electronic Packaging Technology

Publication Type :

Conference

Accession number :

99488355

Full Text :

https://doi.org/10.1109/ICEPT.2014.6922832