57 results on '"LINDNER, PAUL"'
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2. Wafer-level plasma activated bonding: new technology for MEMS fabrication
3. Investigating the use of spray-coating technology in MEMS applications
4. Aligned Low Temperature Wafer Bonding for MEMS Manufacturing: Challenges and Promises
5. 3D Process Integration – Wafer-to-Wafer and Chip-to-Wafer Bonding
6. Si/GaAs heterostructures fabricated by direct wafer bonding
7. Chapter 34 - Wafer-Bonding Equipment
8. List of contributors
9. Ultraviolet nanoimprint litography reduces pattern defect levels
10. Chapter Thirty Seven - Wafer-Bonding Equipment
11. Wafer edge defect study of temporary bonded and thin wafers in TSV process flow.
12. Influencing factors in high precision fusion wafer bonding for monolithic integration.
13. List of Contributors
14. Integrating MEMS devices using low-temperature wafer bonding
15. Taking nanotechnology to market: Solid State Technology asked industry experts to discuss how semiconductor companies can use what they already know to commercialize nanotechnology
16. Temporary bonding on the move towards high volume: A status update on cost-of-ownership.
17. Versatile thin wafer stacking technology for monolithic integration of temporary bonded thin wafers.
18. Recent progress in thin wafer processing.
19. Room temperature debonding — An enabling technology for TSV and 3D integration.
20. Low temperature packaging of BioMEMS and Lab-on-chip devices.
21. Advances in spray coating technologies for MEMS, 3DICs and additional applications.
22. Thin wafer processing - yield enhancement through integrated metrology.
23. Fabrication process of 3D-photonic crystals via UV-nanoimprint lithography.
24. Application of imprint technologies for creation of micro- and nanoscale pattern.
25. Thick resist alignment technology for MEMS and advanced packaging.
26. Adhesive wafer bonding for MEMS applications.
27. Beginning-to-end wafer bonding for advanced optical systems.
28. Gender Differences in Asthma Inhaler Compliance.
29. Paradigm changes in 3D-IC manufacturing.
30. A Gopher interface to relational databases.
31. Fabrication of 3D-photonic crystals via UV-nanoimprint lithography.
32. Mod_perl Developer's Cookbook
33. List of Contributors
34. Über 2-Amino-4-nitro-resorcin und 2-Nitro-4-amino-brenzcatechin.
35. Fusion bonding an enabling technology for "More Moore" scaling.
36. Monolithic IC integration key alignment aspects for high process yield.
37. 2009 Executive Outlook: Survival and Opportunities in 2009.
38. Aligned Wafer Bonding for 3-D Interconnect.
39. Technical forecast: 22nm devices.
40. New integration schemes for 2,5D interposer.
41. Temporary-bonding and LowTemp® debonding technology for various applications.
42. Acute nonlymphocytic leukemia in systemic mastocytosis with biclonal gammopathy
43. NGL may be the key to commercializing nanotechnology.
44. Wafer bonding for high performance MEMS, power devices, and RF components.
45. 3-D Integration of ICs.
46. 2015 outlook: Tech trends and drivers.
47. Fusion bonding for next-generation 3D-ICs.
48. Thin die stacking for wide I/O memory-on-logic.
49. Integration and 3D-ICs driving developments in wafer bonding.
50. 85 Analysis and clinical correlation of serum interleukin-4 levels in progressive systemic sclerosis
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