Wafer bonding for high performance MEMS, power devices, and RF components.

The article offers information on the wafer bonding use for microelectromechanical systems (MEMS) devices and technology. Topics discussed include the importance of sodium (Na) in anodic bonding use to combine complementary metal-oxide semiconductor (CMOS) and MEMS devices, the advantage of aluminium (Al)- aluminium (Al) thermo-compression wafer bonding process, and the significant effects of process temperature on the bonding process.