Search

Realizing the color graphics performance of the HP Deskjet 1200C printer required simultaneous optimization of many interacting parameters of the ink and the architecture to deliver significant improvements in print […]

The HP DeskWriter C and DeskJet 500C printers are based on advanced thermal inkjet technology in the form of a 300-dpi three-color inkjet print cartridge. The printers and software drivers […]

Printing on Plain Paper with a Thermal Inkjet Printer THE HP DESKJET PRINTER is the first low-cost inkjet printer to produce true letter-quality print on plain paper. Intended for office […]

Five print modes, each optimized for quality and throughput, HP Resolution Enhancement technology, heaters to dry the ink and the paper, and accurate print cartridge alignment and paper advance schemes […]

The techniques and algorithms presented in this paper are a result of six years' experience in researching, developing, and integrating Boolean equivalence verification into the HP Convex Division's ASIC design […]

This paper reviews current trends in the paging industry, describes typical pager designs, presents the test requirements of modern pagers, and discusses the contribution to pager testing of the HP […]

This paper describes microwave, laser, and fiber models that were used in the development of the HP LSC2500 2.488-Gbit/s laser diode module. Knowledge of the modeled behavior of the laser […]

This paper describes new uncooled strained quantum well lasers for SONET/ SDH systems. New Fabry-Perot lasers for short-haul and intermediate link applications are extremely reliable, have high ex-facet power, and […]

Advances in fiber-optic network technology within Hewlett-Packard are achieved by close cooperation between Hewlett-Packard Laboratories (HPL) and Hewlett-Packard's Communications Semiconductor Solutions Division (CSSD). This paper explores the interaction between HPL […]

The goals of the work presented in this paper were to estimate quantitatively the impact of interconnect technology parameters on the performance of high-end microprocessors and to use this information […]

One approach to pushing the limits of wire bonding pitch in IC packages is to use two rows of radially staggered bond pads. This paper discusses the design of pad […]

It has been extremely difficult to characterize the SONET/SDH standard receiver with tolerances of ± 0.3 dB. This paper describes a method for calibrating photoreceiver frequency response with the low […]

The subject of this paper is the evaluation of the wetting balance as a technique for studying the flux activity of newly developed low-temperature solder paste fluxes. The most effective […]

A mixture of low-level and high-level implementation languages is likely when old modules are reused. In a two-language system, some interfaces must be expressed in both languages. This paper describes […]

Telecommunications Industry Association standards specify various measurements designed to ensure the compatibility of North American CDMA (code division multiple access) cellular transmitters and receivers. This paper is a tutorial overview […]

The code inspection process from the software world has been applied to Verilog HDL (hardware description language) code. This paper explains the code inspection process and the roles and responsibilities […]

This paper briefly recounts the development and use of schematic capture in the design of a structured-custom ASIC (application-specific integrated circuit). The ASIC was developed through a partnership of two […]

State-of-the-art IC packaging, particularly with RISC architectures, demands performance at a high lead count. This paper presents some of the fundamental topics in IC packaging, formulates the principal criteria by […]

For planners and buyers in the manufacturing business environment, HP MRP Action Manager is an online, interactive tool that automates many of the traditional paper-intensive activities of material requirements planning. […]

This paper presents the processor, memory, graphics, multimedia, and built-in core I/O design of the new HP 9000 Models 705 and 710 entry-level, scalable, PA-RISC workstations. The use of a […]

This paper describes the proposed IEC standard and HP's implementation. IN ADDITION TO PROVIDING high-performance lightwave measurement hardware, HP is also involved in contributing to a worldwide solution of the […]

Ink and Media Development for the HP PaintJet Printer THE DESIGN OF INK, paper and overhead transparency film for the PaintJet Color Graphics Printer required substantial interaction between the ink, […]

Project Management Using Software Reliability Growth Models SIGNIFICANT IMPROVEMENT in software reliability calls for innovative methods for developing software, determining its readiness for release, and predicting field performance. This paper […]

This paper describes a thermal study of junction temperature variation across the surface of a large CPU resulting from nonuniform power generation. Results from Flotherm finite-difference thermal analysis software were […]

This paper studies errors in forecasting the demand for a component used by several products. Because data for the component demand (both actual demand and forecast demand) at the aggregate […]

The tester's features include a timing interval analyzer for statistical analysis of clock periods, synchronous generation of arbitrary waveforms with respect to master digital clocks, and a library of digital […]

To control reflections, the impedance of integrated circuit output pad drivers must be matched to the impedance of the transmission lines to which the pads are connected. HP's HSTL (high-speed […]

A simple closed-form model for calculating cross talk noise on signal lines in deep-submicrometer interconnect systems has accuracy comparable to SPICE for an arbitrary ramp input rate. Interconnect resistance, interconnect […]

To measure the beam parameters of intravascular ultrasound imaging transducers with operating center frequencies exceeding 20 MHz and beamwidths below 200 µm, a hydrophone with a spot diameter less than […]

The increasing use of 3D modeling for highly complex mechanical designs has led to a demand for systems that can provide smooth interactivity with 3D models containing millions or even […]

Increasing time-to-market pressures in recent years have resulted in a deterioration of the quality of software entering the system test phase. At HP's Kobe Instrument Division, the software quality assurance […]

As more data communications products, such as printers and laptop PCs, are released with infrared capability, support for a core set of IrDA standards has strong support from many manufacturers […]

To address the growing handset power amplifier needs for the emerging Personal Communications Services (PCS) markets, a 3-volt, single-supply, enhancement-mode pseudomorphic high-electron-mobility transistor (E-PHEMT) has been developed. The device exhibits […]

EDFAs can overcome losses in long fiber-optic links independent of the digital bit rate, and can amplify multiple signals in a wavelength-division multiplexed (WDM) system architecture. As more and more […]

Communications traffic in the world's fiber-optic backbone network is growing more than 10% per year and the growth rate is accelerating. The ever-increasing bandwidth demands are being met by an […]

Establishing a communications infrastructure to get information to, from, or around a residence is not a straightforward task today. However, in the future the equipment and wiring within a residence […]

The level of integration has been rapidly increasing with advances in semiconductor technology. Many HP design groups have capitalized on this capability to create highly integrated ASICs, or superchips. Superchips […]

The lid of an ASIC package can significantly increase the temperature of the die by impeding heat transfer. In flip-chip package the backside of a die can be exposed by […]

2D process and device simulators have been used to predict the performance of scaled MOSFETs spanning the 0.35-Μm to 0.07-Μm generations. Requirements for junction depth and channel doping are discussed. […]

Intelligent networks are an expanding area within the telecommunications industry. The adoption of intelligent network technology has been driven by its ability to allow telecommunications network operators to install and […]

The proliferation of electronic products in the home and office is putting increasing pressure on every product to reduce its electromagnetic interference (EMI). At HP's Integrated Circuit Business Division (ICBD), […]

Computer system performance has been improving recently at a rate of 40 to 60 percent per year. This growth rate has been fueled by several factors. Advancements in integrated circuit […]

The HP PA 8000 and PA 8200 PA-RISC CPUs are the first implementations of a new generation of microprocessors from Hewlett-Packard. The PA 8000[1-3] is among the world's most powerful […]

The design complexities of today's microprocesrors have grown significantly, with the number of transistors climbing to well over a million, silicon die sizes larger than 1.6 [cm.sup.2], clock speeds exceeding […]

The increasing demands for greater processor performance to remain competitive in today's computer market necessitate careful attention to the methods used in designing processors to achieve these performance goals. Processor […]

Testing safety-critical software differs from conventional testing in that the test design approach must consider the defined and implied safety of the software at a level as high as the […]

Microarchitecture design, with attention to optimizing specific areas of the CPU and memory and I/O subsystems, is key to meeting the cost and performance goals of a processor targeted for […]

Functional verification was divided into presilicon and postsilicon phases. Software models were used in the presilicon phase, and fabricated chips and real systems were used in the postsilicon phase. In […]

To minimize time to market and keep costs low, the PA 7300LC design was leveraged from a previous CPU, the chip area was reduced, cache RAM arrays with redundancy were […]

As the first Printing Performance Architecture printer, the HP DeskJet 820C needed a completely new digital controller ASIC design. The chip's architecture was optimized for the specific requirements of PPA. […]