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Improving heat transfer from a flip-chip package
- Source :
- Hewlett-Packard Journal. August, 1997, Vol. 48 Issue 4, p121, 5 p.
- Publication Year :
- 1997
-
Abstract
- The lid of an ASIC package can significantly increase the temperature of the die by impeding heat transfer. In flip-chip package the backside of a die can be exposed by […]
- Subjects :
- Standard IC
Custom IC
Application-specific integrated circuit
Hewlett-Packard Co. -- Product development
Custom integrated circuits -- Product development
Integrated circuits -- Product development
Semiconductor chips -- Product development
Application-specific integrated circuits -- Product development
Subjects
Details
- Language :
- English
- ISSN :
- 00181153
- Volume :
- 48
- Issue :
- 4
- Database :
- Gale General OneFile
- Journal :
- Hewlett-Packard Journal
- Publication Type :
- Periodical
- Accession number :
- edsgcl.19758450