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2. Low-cost plain-paper color inkjet printing
3. Printing on plain paper with a thermal inkjet printer
4. Where the Ink Hits the Paper..
5. Inkjet printer print quality enhancement techniques
6. Techniques for higher-performance Boolean equivalence verification
7. Pager testing with a specially equipped signal generator
8. Modeled optimization and experimental verification of a low-dispersion source for long-haul 2.488Gbit/s systems
9. 1300-nm strained quantum well lasers for fiber-optic communications
10. Developing leading-edge fiber-optic network link standards
11. Optimization of interconnect geometry for high-performance microprocessors
12. Implementation of pad circuitry for radially staggered bond pad arrangements
13. Frequency response measurement of digital communications analyzer plug-in modules
14. Assessment of low-temperature fluxes
15. Interface translation for reuse of assembly-language modules in a two-language environment
16. Overview of code-domain power, timing, and phase measurements
17. Applying the code inspection process to hardware descriptions
18. Development and use of electronic schematic capture in the specification and simulation of a structured-custom ASIC
19. Structured analysis and design in the redesign of a terminal and serial printer driver
20. Advances in integrated circuit packaging: demountable TAB
21. An interactive user interface for material requirements planning
22. High-performance designs for the low-cost PA-RISC desktop
23. Calibration of fiber optic power meters
24. Ink and media development for the HP PaintJet Printer
25. Project management using software reliability growth models
26. Comparison of Finite-Difference and SPICE Tools for Thermal Modeling of the Effects of Nonuniform Power Generation in High-Power CPUs
27. A theoretical derivation of relationships between forecast errors
28. Testing with the HP 9490 mixed-signal LSI tester
29. Theory and design of CLOS HSTL I/O pads
30. On-chip cross talk noise model for deep-submicrometer ULSI interconnect
31. A 150-MHz-bandwidth membrane hydrophone for acoustic field characterization
32. The DirectModel toolkit: meeting the 3D graphics needs of technical applications
33. Strengthening software quality assurance
34. The IrDA standards for high-speed infrared communications
35. An enhancement-mode PHEMT for single-supply power amplifiers
36. Testing erbium-doped fiber amplifiers
37. Optical networks: backbones for universal connectivity
38. Residential communications
39. Fully synthesizable microprocessor core via HDL porting
40. Improving heat transfer from a flip-chip package
41. MOSFET scaling into the future
42. Intelligent networks and the HP OpenCall technology
43. Frequency modulation of system clocks for EMI reduction
44. Functional verification of the HP PA 8000 processor
45. Four-way superscalar PA-RISC processors
46. Solving IC interconnect routing for the advanced PA-RISC processor
47. Design methodologies and circuit design trade-offs for the HP PA 8000 processor
48. Testing safety-critical software
49. Functional design of the HP PA 7300LC processor
50. Verifying the correctness of the PA 7300LC processor
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