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1. High-quality inkjet color graphics performance on plain paper

2. Low-cost plain-paper color inkjet printing

3. Printing on plain paper with a thermal inkjet printer

4. Where the Ink Hits the Paper..

5. Inkjet printer print quality enhancement techniques

6. Techniques for higher-performance Boolean equivalence verification

7. Pager testing with a specially equipped signal generator

9. 1300-nm strained quantum well lasers for fiber-optic communications

10. Developing leading-edge fiber-optic network link standards

11. Optimization of interconnect geometry for high-performance microprocessors

12. Implementation of pad circuitry for radially staggered bond pad arrangements

13. Frequency response measurement of digital communications analyzer plug-in modules

14. Assessment of low-temperature fluxes

15. Interface translation for reuse of assembly-language modules in a two-language environment

16. Overview of code-domain power, timing, and phase measurements

17. Applying the code inspection process to hardware descriptions

18. Development and use of electronic schematic capture in the specification and simulation of a structured-custom ASIC

19. Structured analysis and design in the redesign of a terminal and serial printer driver

20. Advances in integrated circuit packaging: demountable TAB

21. An interactive user interface for material requirements planning

22. High-performance designs for the low-cost PA-RISC desktop

23. Calibration of fiber optic power meters

24. Ink and media development for the HP PaintJet Printer

25. Project management using software reliability growth models

26. Comparison of Finite-Difference and SPICE Tools for Thermal Modeling of the Effects of Nonuniform Power Generation in High-Power CPUs

27. A theoretical derivation of relationships between forecast errors

28. Testing with the HP 9490 mixed-signal LSI tester

29. Theory and design of CLOS HSTL I/O pads

30. On-chip cross talk noise model for deep-submicrometer ULSI interconnect

31. A 150-MHz-bandwidth membrane hydrophone for acoustic field characterization

32. The DirectModel toolkit: meeting the 3D graphics needs of technical applications

33. Strengthening software quality assurance

34. The IrDA standards for high-speed infrared communications

35. An enhancement-mode PHEMT for single-supply power amplifiers

36. Testing erbium-doped fiber amplifiers

37. Optical networks: backbones for universal connectivity

38. Residential communications

39. Fully synthesizable microprocessor core via HDL porting

40. Improving heat transfer from a flip-chip package

41. MOSFET scaling into the future

42. Intelligent networks and the HP OpenCall technology

43. Frequency modulation of system clocks for EMI reduction

44. Functional verification of the HP PA 8000 processor

45. Four-way superscalar PA-RISC processors

46. Solving IC interconnect routing for the advanced PA-RISC processor

47. Design methodologies and circuit design trade-offs for the HP PA 8000 processor

48. Testing safety-critical software

49. Functional design of the HP PA 7300LC processor

50. Verifying the correctness of the PA 7300LC processor