Search

Laser and oven annealing effects on hydrogen concentration, hydrogen diffusion and material microstructure in hydrogenated amorphous silicon films deposited on crystalline silicon substrates are compared. For laser annealing, a 6 W green (532 nm) continuous wave laser with 100 µm focus diameter was applied and samples of about 1 cm2were scanned in ambient with a line distance of 50 µm and at a speed of 1 – 100 mm/s. Hydrogen content and microstructure were measured by infrared spectroscopy, and hydrogen diffusion was investigated by secondary ion mass spectroscopy (SIMS) measurements of depth profiles of deuterium and hydrogen in layered structures of deuterated and hydrogenated material. The results show that in both annealing experiments hydrogen diffuses predominantly in form of atoms although some formation of H2molecules cannot be excluded. By comparison of laser and oven treatment, an effective temperature describing the laser treated state can be defined. Furthermore, the temperature of the thin silicon film during laser treatment is estimated.

Periodic arrays of low-aspect ratio silicon nanopillars strongly reduce front surface reflection over a broad wavelength range. In this study, we numerically simulate the reflection of light for thick crystalline silicon substrates nanostructured through a combination of silica nanosphere lithography (SNL) and metal-assisted chemical etching (MaCE), producing ordered arrays of nanopillars with hexagonal periodicity. Using statistical methods, we show that the simulated measurements are in good agreement with the spectrophotometry measurements of the fabricated nanopillars.

Using our newly proposed interface conductance modal analysis (ICMA) formalism, we study the modal contributions to thermal interface conductance (G ) across the interface of crystalline silicon and crystalline germanium. We present the accumulation functions of G at different temperatures and predict G as a function of temperature after proper quantum-corrections have been applied. Different classes of vibration are identified across the interface, among which interfacial modes are determined to have the highest per mode contribution to G . The results demonstrate the ability of ICMA in not only calculating the spectral contributions to G but exactly pinpointing the shape of each vibrational eigen state.

We report effective passivation of silicon surfaces by heating single crystalline silicon substrates in liquid water at 110°C for 1 h. High values of photo-induced effective minority carrier lifetime τeff in the range from 1.9x10-4 to 1.8x10-3 s were obtained for the n-type samples with resistivity in the range from 1.7 to 18.1 Ωcm. τeff ranged from 8.3x10-4 to 3.1x10-3 s and from 1.2x10-4 to 6.0x10-4 s over the area of 4 inch sized 17.0 Ωcm n- and 15.0 Ωcm p-type samples, respectively. The heat treatment in liquid water at 110°C for 1 h resulted in low surface recombination velocities ranging from 7 to 34 cm/s and from 49 to 250 cm/s for those 4 inch sized n- and p-type samples, respectively. The thickness of the passivation layer was estimated to be approximate only 0.7 nm. Metal-insulator-semiconductor type solar cell was demonstrated with Al and Au metal formation on the passivated surface. Rectified current voltage and solar cell characteristics were observed. Open circuit voltage of 0.47 V was obtained under AM 1.5 light illumination at 100 mW/cm2.

In this paper, we report new phase of crystalline silicon, quasicrystalline silicon thin-film on glass substrate. The surface topography of these films reveal simultaneous existence of sixfold and fivefold symmetry. We found an array of quasi-unit cell in 2-D that formed quasicrystalline solid. This is first time demonstration of quasicrystalline for single element, silicon (Si). Raman spectra suggests that we found crystalline silicon structure on glass substrate that is not single-crystal silicon (c-Si) but very close to c-Si.

Rigorous finite element optical simulations have been used to examine the absorption of light in various crystalline silicon based, nanostructured solar cell architectures. The compared structures can all be produced on glass substrates using a periodically structured dielectric coating and a combination of electron-beam evaporation of silicon and subsequent solid phase crystallization. A required post-treatment by selective etching of non-compact silicon regions results in an absorber material loss. We show that by adequately tailoring the optical design around the processed silicon layer, the absorptance loss due to material removal can be completely overcome. The resulting silicon structure, which is an array of holes with non-vertical sidewalls, shows promising light path enhancement and features an even higher absorptance than the initial nanodome structure of the unetched absorber.

We propose an implementation of the PCD technique to minority carrier effective lifetime assessment in crystalline silicon at 77K. We focus here on (n)-type, FZ, polished wafers passivated by a-Si:H deposited by PECVD at 200°C. The samples were immersed into liquid N2 contained in a beaker placed on a Sinton lifetime tester. Prior to be converted into lifetimes, data were corrected for the height shift induced by the beaker. One issue lied in obtaining the sum of carrier mobilities at 77K. From dark conductance measurements performed on the lifetime tester, we extracted an electron mobility of 1.1x104 cm².V-1.s-1 at 77K, the doping density being independently calculated in order to account for the freezing effect of dopants. This way, we could obtain lifetime curves with respect to the carrier density. Effective lifetimes obtained at 77K proved to be significantly lower than at RT and not to depend upon the doping of the a-Si:H layers. We were also able to experimentally verify the expected rise in the implied Voc, which, on symmetrically passivated wafers, went up from 0.72V at RT to 1.04V at 77K under 1 sun equivalent illumination.

We report on the measurement of defect densities and minority carrier lifetimes in nanocrystalline Si samples contaminated with controlled amounts of oxygen. Two different measurement techniques, a capacitance-frequency (CF) and high temperature capacitance-voltage techniques were used. CF measurement is found to yield noisy defect profiles that could lead to inconclusive results. In this paper, we show an innovative technique to remove the noise and obtain clean data using wavelet transforms. This helps us discover that oxygen is creating both shallow and deep/midgap defect states in lieu with crystalline silicon. Minority carrier lifetime measured using reverse recovery techniques shows excellent inverse correlation between deep defects and minority carrier lifetimes through which hole capture cross section can be evaluated.

We have performed an analysis on three hydrogenated nanocrystalline silicon (nc-Si:H) based solar cells. In order to determine the impact that impurities play in shaping the material properties, the XRD and Raman spectra corresponding to all three samples were measured. The XRD results, which displayed a number of crystalline silicon-based peaks, were used in order to approximate the mean crystallite sizes through Scherrer's equation. Through a peak decomposition process, the Raman results were used to estimate the corresponding crystalline volume fraction. It was noted that small crystallite sizes appear to favor larger crystalline volume fractions. This dependence seems to be related to the oxygen impurity concentration level within the intrinsic nc-Si:H layers.

In this contribution, we show that the dominant electroluminescent emission of hydrogenated amorphous silicon (a-Si:H) thin-film solar cells follows a diode law, whose radiative ideality factor nr is larger than one. This is in contrast to crystalline silicon and Cu(In, Ga)Se2 solar cells for which nr equals one. As a consequence, the existing quantitative analysis for the extraction of the local junction voltage Vj(r) from luminescence images fails for a-Si:H solar cells. We expand the existing analysis method, and include the radiative ideality factor nr into the model. With this modification, we are able to determine the local junction voltage Vj(r) for a-Si:H solar cells and modules. We investigated the local junction voltage Vj(r) and the radiative ideality factor nr for both initial and stabilized a-Si:H solar modules. Furthermore, we show that the apparent radiative ideality factor is affected by the spectral sensitivity of the used camera system.

A new method to form high quality crystalline silicon thin films on cheap glass substrates is developed using a single pass of a line-focus cw diode laser in air. The laser process results in the formation of large high-quality crystals as they grow laterally in the scan direction – seeded by the previously crystallised region. Grains 10 μm in thickness, up to millimetres in length and hundreds of microns in width have been grown with virtually zero detectable intragrain defects. Another mode is found which results in much smaller crystals grown by partial melting. The dominant grain boundaries identified are Σ3 60° twins. Hall mobilities as high as 470 cm2/Vs have been recorded. A diffused emitter is used to create a p-n junction at the rear of the films which produces open-circuit voltages as high as 539 mV.

We summarize our research studies on the synthesis of silicon and germanium nanocrystals and their application to the growth of a variety of thin films, spanning the range from fully disordered amorphous up to fully ordered crystalline. All these films are deposited in a standard radio-frequency glow discharge system at low temperature (~200 °C). We show how the plasma synthesis of silicon nanocrystals, initially a side effect of powder formation, has become over the years an exciting field of research which has opened the way to new opportunities in the field of materials deposition and their application to optoelectronic devices. Our results suggest that epitaxy requires the melting/amorphization of the nanocrystals upon impact on the substrate, the subsequent epitaxial growth being favored on (100) c-Si substrates. As a consequence, the control of the impact energy is a critical aspect of the growth which will require new strategies such as the use of tailored voltage waveforms.

Effusion measurements of hydrogen and implanted helium are reported for (undoped) amorphous and crystalline Si:H and related materials. Effusion of helium observed at temperatures > 600°C is attributed to isolated voids present in the material from the preparation process. While rather high void densities are detected for amorphous silicon films prepared by such deposition techniques like vacuum evaporation or sputtering, much smaller densities are found for plasma grown hydrogenated amorphous silicon (a-Si:H). For device-grade a-Si:H, the density of cavities which can trap helium is estimated to be about 2x1018/cm3at most, suggesting that crystalline silicon type divacancies are not the major hydrogen incorporation site.

Change in the light-induced minority carrier effective lifetime τeff of crystalline silicon caused by rapid laser heating is reported. The top surface of n- and p-type silicon substrates with thicknesses of 520 μm coated with thermally grown SiO2 layers were heated by a 940 nm semiconductor laser for 4 ms. τeff was measured by a method of microwave absorption caused by carriers induced by 620 nm light illumination at 1.5 mW/cm2. τeff for light illumination of the top surfaces was decreased to 1.0x10-5 and 4.8x10-6 s by laser heating at 5.0x104 W/cm2 for n- and ptype 520-μm-thick silicon substrates, respectively. The decrease in τeff resulted from the generation of defect states associated with the carrier recombination velocity at the top surface region, Stop. Laser heating increased Stop to 6000 and 10000 cm/s for n- and p-type silicon samples, respectively. Heat treatment at 400oC for 4h markedly decreased Stop to 21 and 120 cm/s, respectively, for n- and p-type silicon samples heated at 5.0x104 W/cm2. Laser heating at 4.0x104 W/cm2 for 4 ms was also applied to samples treated with Ar plasma irradiation at 50 W for 60 s, which decreased τeff (top) to 2.0x10-5 s and 3.9x10-6 s for n- and p-type silicon samples, respectively. Laser heating successfully increased τeff (top) to 2.8x10-3 and 4.1x10-4 s for n- and p-type samples, respectively. Laser irradiation at 4x104 W/cm2played a role of curing recombination defect sites.

As an alternative to crystalline silicon or thin film solar cells on rigid glass substrates, we aim to fabricate amorphous silicon (a-Si)/nanocrystalline silicon (nc-Si) tandem thin film solar cells on cheap flexible substrates. We have chosen polycarbonate as the superstrate and adapted the a-Si and nc-Si deposition processes for deposition at a maximum temperature of 130°. Because a-Si deposited at low temperatures has a high band gap, we were able to fabricate very thin (sc of the complete cell is partly compensated by a higher Vocwhich results in an initial conversion efficiency of 9.5% for the low temperature tandem solar cells on glass.

P-type hydrogenated nanocrystalline cubic silicon carbide is a promising material for the emitter of n-type crystalline silicon heterojunction solar cell due to its lower light absorption and wider bandgap of 2.2 eV. The electrical properties of hydrogenated nanocrystalline cubic silicon carbide can be influenced by its crystallinity. In this study, we propose the use of conductive atomic force microscopy (Conductive-AFM) to evaluate the crystalline volume fraction (fc) of p-nc-3C-SiC:H thin films (20∼30 nm) as a new method instead of Raman scattering spectroscopy, X-ray diffraction, and spectroscopic ellipsometry.

The emission of crystalline silicon nanoparticles as well as nanowires can be tuned by varying their diameters. The diameter selection is achieved via a difficult chemical procedure that necessitates filtration which cannot be easily scaled up. Herein, we report a novel approach for producing and tuning the emission of freestanding colloidal of amorphous porous silicon nanoparticles (which should not be confused with bulk amorphous silicon nor with porous silicon) via a controlled oxidation without relying on size of nanoparticles. This oxidation increases local strain in the disordered network that causes orbital interactions which modifies the band-gap but a new hybridization.

The surface passivation of Si wafer by AlOx thin films grown by mist CVD in an open-air atmosphere was studied with a view to improving the effect of high-performance c-Si solar cells. In AlOx thin film grown at a temperature above 400°C by mist CVD, the OH bonding did not remain in the film and the breakdown field (EBD) was over 6 MV/cm. In Si wafers passivated by AlOx thin films grown by mist CVD at growth temperature above 400°C, the negative fixed charge density (Qf) at the interface was higher than 1012 cm-2 and the surface recombination velocity (Seff) was 44.4 cm/s. These results show that mist CVD, which is fundamentally an environmentally friendly technique, may be suitable for the fabrication of a passivation film on Si surfaces designed to improve the effect of high-performance c-Si solar cells.

Nano-scale surface textures have been developed as photon management schemes for crystalline silicon (c-Si) solar cells with very thin absorber layers to compensate for light absorption losses. This paper investigates the optical properties of periodic “nano-muffin” and inverted nano-pyramid surface textures, simulated using the Rigorous Coupled Wave Analysis (RCWA) method. Obtained results are compared against those of a planar silicon film with equal thickness. The simulation results demonstrate that “nano-muffin” and inverted nano-pyramid surface textures with a small aspect ratio are able to achieve substantial absorption enhancement over a broadband wavelength range. Further investigation indicates that “nano-muffin” surface textures could trap light by concentrating light within a volume close to the texture (micro-lensing effect). With such nano-scale textures, light trapping similar to that of much larger scale textures can be achieved.

We report photo induced minority carrier annihilation at the silicon surface in a metal–oxide–semiconductor (MOS) structure using 9.35 GHz microwave transmittance measurement. 7 Ωcm n-type 500-μm-thick crystalline silicon substrate coated with 100-nm-thick thermally grown SiO2 layers was used. 0.2-cm-long Al electrode bars were formed at the top and rear surfaces. 635 nm light illumination onto the top surface caused photo induced carriers to be in one side of the silicon region of the Al electrode. Microwave transmittance system detected photo induced carriers diffused from the light illuminated region via the MOS structured region. When the bias voltage was applied at +2.0 and -2.2 V to the electrode at the top surface, the surface recombination velocity increased from 44 (initial) to 83 and 86 cm/s, respectively because of depletion region formation at rear and top surface respectively. Those voltage applications caused change in the distribution of photo induced carriers in a 0.6-cm-wide region including light illuminated, MOS structured, microwave irradiated regions.

Crystalline silicon based photovoltaics continues to be the dominant technology for large scale deployment of solar energy. While impressive cost gains in silicon based PV have come with scale, there remains a strong push for increased efficiencies and further lowering of manufacturing costs to achieve true grid parity. So far, however, there has not been a production proven approach that reduces the cost while maintaining or increasing the efficiency. Attempts to reduce the amount of silicon used, for example, have led to development of various kerfless wafer manufacturing approaches. While some of these approaches have shown the potential for reduced costs, they also compromise the efficiency mainly due to the inferior quality of the material.Epitaxy based kerfless silicon wafers, on the other hand, has shown the potential to reverse this trend offering lower manufacturing costs while maintaining or even enhancing the efficiency due to the high quality of the n-type and p-type silicon epitaxial (Epi) wafers. In this work, we present key aspects of Crystal Solar’s patented high throughput production silicon epitaxial reactor and its use in the manufacture of standard thickness N and P wafers. Besides the advantage of having significantly reduced cost, these Epi wafers have high quality, better mechanical strength and resistance to light inducted degradation due to significantly reduced oxygen content.

Nanowire arrays have been proposed to enhance light trapping, increase efficiencies, and reduced material cost in photovoltaic solar cells. In this work we present a new crystalline silicon nanowire array structure, inspired by fractal geometry. The array structure is assumed to be an infinite 2D array in the x and y directions, and composed of vertically aligned SiNW suspended in air. Hexagonal fractal-like geometry is adapted in arranging cylindrical SiNW in these arrays. Full-wave finite element method 3D simulation is used to compute reflectance, transmittance and absorptance of the array for a normal incidence plane wave. The proposed fractal-like distribution of SiNW arrays yield broad absorption spectrum and enhanced efficiency while using less material. The efficiency of the proposed fractal-like SiNW arrays achieve ∼100% enhancement over that of the equivalent thickness flat c-Si film, and ∼18% enhancement over an equivalent height hexagonal array. The proposed optimized structures achieved a filling ratio ∼25%, which is ∼33% less than the corresponding hexagonal array.

We show in a theoretical density functional theory study that amorphous Si (a-Si) has more favorable energetics for Mg storage compared to crystalline Si (c-Si). Specifically, Mg and Li insertion is compared in a model a-Si simulation cell. Multiple sites for Mg insertion with a wide range of binding energies are identified. For many sites, Mg defect formation energies are negative, whereas they are positive in c-Si. Moreover, while clustering in c-Si destabilizes the insertion sites (by about 0.1/0.2 eV per atom for nearest-neighbor Li/Mg), it is found to stabilize some of the insertion sites for both Li (by up to 0.27 eV) and Mg (by up to 0.35 eV) in a-Si. This could have significant implications on the performance of Si anodes in Mg batteries.

Various nanostructures with high-aspect-ratio formed in a low-resistivity silicon wafer by the nano-processing using a carbon nanotube (CNT) probe of a scanning tunneling microscope (STM) have been investigated. The multi-wall CNT probes were obtained with our original pulling-method from CNT dispersion liquid. Nanostructures of point configurations (pit and mound) and line configurations were obtained at the constant tunneling current of 0.1 nA by controlling the bias voltages up to 10 V, processing times up to 300 s and scanning speeds of probe up to 480 nm/s for a line configuration. The aspect-ratio of the pit configuration fabricated at the bias voltage of 3 V increased about 6 times in proportion to the increase in processing time. Remarkable influence of the bias voltage on the configurations indicated that there exists a threshold bias voltage for the transition from the pit configuration to the mound one between 3 V and 5 V, and the aspect ratio of all nanostructures fabricated by the CNT probe were larger than those by a conventional tungsten probe. Finally, cross-sectional TEM observations were also applied to clarify the difference in the formation mechanisms between the pit configuration and the mound configuration. The TEM image of the pit configuration showed neither dislocations nor remarkable strains existed, but in the case of the mound shape TEM analysis indicated the existence of single crystalline silicon region solidified with atomic defects under the mound configuration. Therefore the drastic change of the configurations was attributed to the changes of the atomic-scale microstructures by applying the bias voltages.

Metal-assisted chemical etching is a simple and low-cost silicon nanowire fabrication method which allows control of nanowire diameter, length, shape and orientation. In this work, we fabricated well-ordered silicon nanowire array by patterning gold thin film by nanosphere lithography and etching single crystalline silicon wafer by metal-assisted chemical etching technique. We investigated relation between etched solution concentration and nanowire morphology, wafer crystal orientation, etching rate. This well-ordered silicon nanowires arrays have the potential applications in many fields but especially next generation energy related applications from solar cells to lithium-ion batteries.

Nitridation is the process in which, during the initial growth of a-SiNx:H layers on Si surfaces, nitrogen (N) is incorporated into Si lattice near its surface. We show that this nitridation process affects the density of interface states (Dit) and fixed charges (Qf) at the interface. These parameters determine the effective surface passivation quality of the layers. The nitridation can be tuned independently of the growth of a-SiNx:H layers by using a plasma treatment prior to actual a-SiNx:H layer deposition. It is shown that the Qf can be varied from 2·1012 to 15·1012 cm-2 without changing the a-SiNx:H deposition process. It is demonstrated that in our case and processing window, Qf is the determining factor in surface passivation quality in the range of 2·1012 to 8·1012 cm-2. For higher values of Qf, Dit has increased significantly and has become dominant thereby reducing the passivation quality. It is shown that the passivation can be controlled independently of the a-SiNx:H deposition process. On completed solar cells this variation in Qf due to nitridation results in a change in open-circuit voltage, Voc, of almost 20mV.

We present an investigation of the band offsets in amorphous/crystalline silicon heterojunctions (a-Si:H/c-Si) using low energy photoelectron spectroscopy, ellipsometry and surface photovoltage data. For a variation of deposition conditions that lead to changes in hydrogen content and the thereby the a-Si:H band gap by ∼180 meV, we find that mainly the conduction band offset ΔEV varies, while ΔEC stays constant within experimental error. This result can be understood in the framework of charge neutrality (CNL) band lineup theory.

We demonstrate series-connected tandem photovoltaic cells consisting of hydrogenated amorphous silicon (a-Si:H) solar cells and polymer-based organic photovoltaic (OPV) cells. One of the limiting factors of a-Si:H solar cells is their narrow absorption spectrum as compared with that of crystalline silicon solar cells. In order to overcome this limitation, we fabricated a hybrid tandem solar cell by employing a solution-processed OPV subcell based on a low bandgap semiconducting polymer onto the a-Si:H subcell. It was found that the interfacial property of the hole transporting intermediate layer between the subcells strongly affects the photovoltaic property of the tandem cells. By using MoO3 as an efficient hole transporting intermediate layer instead of the conventional conducting polymer, we obtained the power conversion efficiency of 1.84% and the open-circuit voltage (VOC) of 1.50 V which corresponds closely to the sum of the VOCs of the subcells.

Most of actual photonic devices being sensitive in the visible (VIS) spectrum are based on crystalline silicon (x-Si). The production of x-Si requires an expensive high temperature process. The color reproduction with x-Si diodes additionally requires an integration of color filters [1] to realize a shift in spectral sensitivity. This work presents an amorphous silicon (a-Si:H) photodiode with an intermediate contact for color separation without color filters. Such detectors can be produced in a low cost and low temperature PECVD process, which allows their direct deposition on a custom specific ASIC [2]. Another advantage of a-Si:H is the up to 10 times higher light absorption compared to that of x-Si in the VIS spectrum [3]. The device consists of a metal (Cr) cathode, an amorphous NIP diode structure and a TCO (Al doped ZnO) anode. The I-layer includes an interior TCO contact buried between two P-layers. The thickness of this TCO layer is about 200 nm; the P-layers have a thickness of about 10 nm. The chromium cathode is sputtered on a glass substrate in a PVD process. The amorphous layers are deposited in a multi-chamber PECVD line; the buried and top TCO contacts are sputtered in the same line continuously under high-vacuum conditions. In a first photolithography step the top anode is patterned while the buried anode is uncovered. Afterwards, the diode must be patterned again, resulting in a final Cr, NIP-a-Si:H, TCO, PIP-a-Si:H and TCO multi-layer stack.The spectral sensitivity of a common NIP diode can be shifted by external bias voltages. The spectral sensitivity at higher negative voltages overlays those of that at lower voltages and additionally shifts to longer wavelengths. The color reproduction is difficult; it can be improved by reducing the overlap of the spectral sensitivity [4]. The spectral response of the diodes presented in this work also can be shifted by the bias voltage. Furthermore, it can be split by substituting the disclosed anodes. The spectral response, using the cathode and top anode has a maximum at short wavelengths. If the diode between the interior anode and the cathode is used, the spectral sensitivity for longer wavelengths increases. Shorter wavelengths are blocked by the top part of the diode; it works like a filter. The presented device structure offers good prospects to improve color separation compared to currently existing detectors by using an additional intermediate contact.

A multi-pressure microwave plasma source is developed and is applied for the fast deposition of crystalline silicon films. In this paper, the plasma source is diagnosed firstly. Electron density, electron temperature and discharge gas temperature of the plasmas generated in ambient air are studied using optical emission spectroscopy (OES) method. By using the high density microwave plasma source, depositions of crystalline silicon films from SiH4+He mixture at reduced pressure conditions are investigated systematically. After optimizing the film deposition conditions, highly crystallized Si films are deposited at a rate higher than 700 nm/s. We also find that the deposited films are fully crystallized and crystalline structure of the deposited film evolves along the film growth direction, i.e. large grains in surface region while small grains in the bottom region of the film. Based on the observed results, a possible mechanism, the annealing-assisted plasma-enhanced chemical vapor deposition, is proposed to describe the film growth process.

In the present work, silicon nitride nanowires (SNNWs) have been synthesized via nitriding cryomilled nanocrystalline silicon powder. The silicon powder exhibits a fine polycrystalline structure after the cryomilling process, with an average grain size of 25 to 125 nm at various cryomilling times. The SNNWs that form after the nitridation of the cryomilled silicon powder exhibit single crystal structure and are 20 to 100 nm in diameter and ∼10 µm in length. The diameter of the nanowires is in agreement with the grain size of the cryomilled Si powder. Microstructural characterization reveals that the as-synthesized nanowires have a hexagonal structure and their primary growth direction is along the [0001] direction. The formation of the Si–N–Si bond during the cryomilling process, as investigated theoretically with density functional theory, promotes the subsequent synthesis of the α-Si3N4 nanowires. The mechanism for nanowire formation appears to be a vapor-solid (VS) reaction.

We have developed a thermodynamic model that predicts the heat distribution in a stack of PECVD SiO2 and a-Si:H on crystalline Si after laser irradiation. The model is based on solving the total enthalpy heat equation with a finite difference scheme. The laser used in the model is a frequency doubled Nd:YVO4 green laser with pulse duration in the nanosecond range. The modeling was done with the aim of getting a better understanding of our newly developed laser ablation process for making local contacts on back-junction silicon solar cells. Lasers with pulse duration within the nanosecond range are usually believed to induce too much thermal damage into the underlying silicon to make them suitable for high efficiency solar cells. In our case, insertion of a thin layer of a-Si:H between the SiO2 and the Si absorbs much of the laser irradiation both optically and thermally. This makes it possible to form local contacts to Si in a damage-free way. In addition, the residual a-Si:H serves as an excellent surface passivation layer for the Si substrate. We have also developed a simple static model to determine the onset of SiO2 ablation on a-Si:H layers of varying thickness. The models, both the static and the dynamic, are in good agreement with experimental data.

Tritiated amorphous and crystalline silicon is prepared by exposing silicon samples to tritium gas (T2) at various pressures and temperatures. Total tritium content and tritium concentration depth profiles in the tritiated samples are obtained using thermal effusion and Secondary Ion Mass Spectroscopy (SIMS) measurements. The results indicate that tritium incorporation is a function of the material microstructure rather than the tritium exposure condition. The highest tritium concentration attained in the amorphous silicon is about 20 at.% on average with a penetration depth of about 50 nm. In contrast, the tritium occluded in the c-Si is about 4 at.% with a penetration depth of about 10 nm. The tritium concentration observed in a-Si:H and c-Si is higher than reported results from post-hydrogenation experiments. The beta irradiation appears to catalyze the tritiation process and enhance the tritium dissolution in silicon material.

Solar electric (Photovoltaic) crystalline silicon (c-Si) product design and diversity has changed very little over three decades of development since the inception of the photovoltaic industry. The dominant module product comprising over 90% of cumulative installations, which exceed 15 GW worldwide, employs a ubiquitous planar laminate configuration. This paper reviews the history of development of this commodity product, and examines the scientific underpinnings of the materials base of the c-Si module platform, which has provided confidence for manufacturers to lengthen product performance warranties to the current 25 year standard. Recent trends in c-Si module design, materials and manufacturing methods will also be discussed.

Electronic systems that offer elastic mechanical responses to high strain deformations are of growing interest, due to their ability to enable new electrical, optical and biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This talk describes materials and mechanical design strategies for classes of electronic circuits that offer extremely high flexibility and stretchability over large area, enabling them to accommodate even demanding deformation modes, such as twisting and linear stretching to ‘rubber-band’ levels of strain over 100%. The use of printed single crystalline silicon nanomaterials for the semiconductor provides performance in flexible and stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators and differential amplifiers, suggest a valuable route to high performance stretchable electronics that can be integrated with nearly arbitrary substrates. We show examples ranging from plastic and rubber, to vinyl, leather and paper, with capability for large area coverage.

Hydrogenated amorphous silicon (a-Si:H) has been extensively investigated experimentally in the infrared spectral region via techniques such as Fourier Transform Infrared (FTIR) and Raman spectroscopy. Although spectroscopic ellipsometry has been proven to be an important tool for the determination of several parameters of a-Si:H films, including dielectric constant, surface roughness, doping concentration and layer thickness, the spectral range used in these studies has rarely covered the infrared region below 0.6 eV, and never over the complete spectral region of interest (0.04 – 0.3 eV). We have measured for the first time the dielectric function of a-Si:H films grown by the saddle field glow discharge technique by spectroscopic ellipsometry in the energy range from 0.04 eV to 6.5 eV, thus extending the analysis into the far infrared region. The a-Si:H films were deposited on germanium substrates for the ellipsometry studies, and on crystalline silicon substrates for the comparative FTIR analysis. Preparation parameters were chosen to obtain films with different hydrogen content. In this paper, we present the results of the ellipsometry analysis, evaluate different fitting techniques, and compare the results with the corresponding FTIR spectra. The similarities and differences between the spectra are discussed in terms of the a-Si:H properties.

In order to reduce the power-generating cost of silicon solar cells, it is necessary to achieve a high conversion efficiency using a thinner crystalline silicon (c-Si) substrate. The HIT (Heterojunction with Intrinsic Thin-layer) solar cell is an amorphous silicon (a-Si) / c-Si heterojunction solar cell that exhibits the potential to make this possible. Our recent R&D activities have achieved the world’s highest conversion efficiency of 23.0% with a practical sized (100.4 cm2) HIT solar cell, by improving the quality of the surface passivation, reducing the optical absorption loss and reducing the resistance loss. We have also developed a HIT solar cell with a thickness of only 98 mm, which has a very high conversion efficiency of 22.8%. This value is comparable to that of the conventional HIT solar cell, which has a thickness of more than 200 mm. Moreover, we have fabricated HIT solar cells using thinner c-Si substrates (96 to 58 μm), and found that the Voc increased with decreases in the substrate thickness, and reached an extremely high value of 0.745 V with a thickness of only 58 μm. This indicates that the surface recombination velocity of the HIT structure is extremely low due to the excellent passivation of the c-Si surface.

We applied the deactivation treatments to p-type single crystalline silicon solar cells for deactivating the recombination-active boron-oxygen complex. The methods we used include thermal annealing treatment, capacitively couple plasma (CCP) treatment, and plasma immersion ion implantation (PIII) treatment. The results showed that all the deactivation treatments were working and the energy transfer efficiency (Eff) was thereby increased by more than 1% absolute compared to the degraded state base on the increasing of the open-circular voltage (Voc) and short-current density (Jsc). The CCP deactivated treatment got better efficiencies than PIII treatment because the PIII treatment damaged the surface of solar cells. After the forming gas treatment, the samples could be improved to close to the PIII samples due to the surface damage repairing. However, the increased efficiency could not be kept and would be degraded again after illumination.

Hydrogen is commonly introduced into silicon solar cells to reduce the deleterious effects of defects and to increase cell efficiency. We have developed strategies by which hydrogen in silicon can be detected by IR spectroscopy with high sensitivity. The introduction of hydrogen into Si by the post-deposition annealing of a hydrogen-rich, SiNx coating has been investigated to determine hydrogen's concentration and penetration depth. Different hydrogenation processes were studied so that their effectiveness for the passivation of bulk defects could be compared. The best conditions investigated in our experiments yielded a hydrogen concentration near 1015 cm-3 and a diffusion depth consistent with the diffusivity of H found by Van Wieringen and Warmoltz.

This paper describes a new method to make surface textures for photovoltaic application. Using this method, we can make textures having various shapes. The first step is to make photo-resist (PR) molds using the polymer dispersed liquid crystal (PDLC) film. The second step is to transfer the PR molds to silicon by inductively coupled plasma etching process. The final step is a solar cell fabrication process. The structure of the solar cell is simple Al Grid/c-Si/Al back contact. The solar cells show the increase of the short circuit current (Jsc) comparing to the planar cells. By this texturing method, we can get solar cells having various textures which we want to make.

We have carried out fluorescence lifetime measurements using time correlated single photon counting (TCSPC) for a cyanine dye near the silicon surface. The measurements have been carried out for both (100) and (111) crystal orientations of the silicon surface, showing the dependence of energy transfer rate as a function of the separation between the dye monolayer and the silicon surface. Langmuir Blodgett fatty acid layers were used to create a multistep structure and a monolayer of a cyanine dye was deposited on top of the stepped structure. Spectroscopic ellipsometry has been used to measure the thickness of the fatty acid steps and provide an accurate estimate of the distance of the dye monolayer to the silicon surface. Time resolved emission spectra and fluorescence decay curves were measured with a single photon picosecond time correlated system. We find that the fluorescence lifetime of the dye monolayer is significantly shortened when present close to the silicon surface signifying efficient energy transfer. The dissipation of the excitation energy near silicon is explained using the classical theory developed for metals and a deviation is observed for distances close to the silicon surface (d

We present the realization of hybrid silicon core/silicon nitride shell nanodots by Low Pressure Chemical Vapor Deposition (LPCVD) and their application as floating gate in Non Volatile Memory (NVM) devices. The LPCVD process includes three steps: nucleation using SiH4, selective growth of the silicon nuclei using SiH2Cl2 and finally selective growth of silicon nitride using a mixture of SiH2Cl2 and NH3 around the silicon dot. The two first steps have already been described in literature. We will therefore focus on the selective growth of a nitride layer on silicon dots. Morphological characterization using Scanning Electron Microscopy (SEM) allows control over dots size – 5 to 10nm – and density – up to 1E12/cm2. High Resolution Transmission Electron Microscopy (HRTEM) shows a crystalline silicon core and an outer shell of amorphous silicon nitride. Energy Filtered TEM pictures confirm that the nitride layer is deposited only around the silicon dots and not on the oxide. Oxidation resistance of the silicon nitride shell is also investigated. A 2nm thick silicon nitride layer is an efficient barrier to an oxidation at 800°C in dry oxygen for 5 minutes. We thus have a very thin high quality stoechiometric nitride layer. Such a high quality nitride film can only be achieved using in-situ deposition i.e. on an oxide-free silicon surface. Finally, hybrid Si/SiN nanodots are integrated in a single memory cell with high-K interpoly dielectric. Electrical results show large threshold voltage shift of 6V. The use of silicon nitride shells on the silicon dots has therefore two main advantages: it provides both oxidation resistance and charge storage enhancement.

In this work the Si interstitial contribution of F+ implants in crystalline Si is quantified by the analysis of extended defects and B diffusion in samples implanted with 25 keV F+ and/or 40 keV Si+. We estimate that approximately 0.4-0.5 Si interstitials are generated per implanted F+ ion, which is in good agreement with the value resulting from the net separation of Frenkel pairs obtained from MARLOWE simulations. The damage created by F+ implants in crystalline Si may explain the presence of extended defects in F-enriched samples and the evolution of B profiles during annealing. For short anneals, B diffusion is reduced when F+ is co-implanted with Si+ compared to the sample only implanted with Si+, due to the formation of more stable defects that set a lower Si interstitial supersaturation. For longer anneals, when defects have dissolved and TED is complete, B diffusion is higher because the additional damage created by the F+ implant has contributed to enhance B diffusion.

For the mobility gap of hydrogenated micro-crystalline silicon (μc-Si:H) a value near 1.1 eV is commonly found, similar to the bandgap of crystalline silicon. However, in other studies mobility gap values have been reported to be in the range of 1.48-1.59 eV. Indeed, for accurate modeling of μc-Si:H solar cells it is paramount that key parameters like the mobility gap are accurately determined. In this work we will discuss a method to determine the mobility gap of μc-Si:H using the dark current activation energy of μc-Si:H pin devices, and apply this method to μc-Si:H solar cells with varying crystalline volume fraction. We found the mobility gap is around 1.2 eV to 1.26 eV for μc-Si:H solar cells with a crystalline volume fraction between 50 % and 70 %. For a highly crystalline solar cell we found a mobility gap of 1.07 eV.

We conducted molecular dynamics (MD) simulations of solid phase epitaxial growth of As-doped Si using a Tersoff potential characterized via comparison to DFT calculations, including energies of AsnV clusters. The Si:As systems were initialized by amorphizing the surface region of crystalline silicon via Si ion implantation and/or selective melting. The remaining crystalline region provides dual function of controlling temperature in system without perturbing regrowth and providing seed for recrystallization. After recrystallization, isolated As atoms occupy substitutional sites, with the average number of nearest neighbors for As changing from about 3.3 in amorphous Si to 4 after crystallization. We observe V incorporation associated with high As concentrations. A small fraction of isolated As atoms have associated vacancies, while vacancies are incorporated in the majority of cases in which there are sites with two As neighbors. These observations are consistent with our previous model developed to explain kinetics of As shallow junction formation which assumed V incorporation at sites with 2 or more As nearest neighbors to account for experimental data.

Mixed-phase hydrogenated amorphous silicon thin films containing nanocrystalline silicon inclusions have been synthesized in a dual chamber co-deposition system. A PECVD deposition system produces small crystalline silicon particles (3-5 nm diameter) in a flow-through reactor, and injects these particles into a separate capacitively-coupled plasma chamber in which hydrogenated amorphous silicon is deposited. Raman spectroscopy is used to determine the volume fraction of nanocrystals in the mixed phase thin films, while infra-red spectroscopy characterizes the hydrogen bonding structure as a function of nanocrystalline concentration. At a moderate concentration of 5 nm silicon crystallites, the dark conductivity and photoconductivity are consistently found to be higher than in mixed phase films with either lower or higher densities of nanocrystalline inclusions.

Fatigue properties of thin film materials are extremely important to design durable and reliable microelectromechanical systems (MEMS) devices. However, it is rather difficult to apply conventional fatigue testing method of bulk materials to thin films. Therefore, a fatigue testing method fitted to thin film materials is required. In this investigation, we have developed a fatigue testing method that uses a resonance of cantilever type specimen prepared from thin films. Cantilever beam specimens with dimensions of 1(W) × 3(L) × 0.01(t) mm3 were prepared from Ni-P amorphous alloy thin films and gold foils. In addition, cantilever beam specimens with dimension of 3(L) × 0.3(W) × 0.005(t) mm3 were also prepared from single crystalline silicon thin films. These specimens were fixed to a holder that is connected to an golddio speaker used as an actuator, and were resonated in bending mode. In order to check the validity of this testing method, Young's moduli of these specimens were measured from resonant frequencies. The average Young's modulus of Ni-P was 108 GPa and that of gold foil specimen was 63 GPa, and these values were comparable with those measured by other techniques. This indicates that the resonance occurred theoretically-predicted manner and this testing method is valid for measuring the fatigue properties of thin films. Resonant fatigue tests were carried out for these specimens by changing amplitude range of resonance, and S-N curves were successfully obtained.

Behavior of oxygen, carbon and minority-carrier lifetimes of multi-crystalline silicon (mc-Si) has been investigated by means of FTIR and QSSPCD after three step annealing. For comparison, the annealing of czochralski (CZ) silicon was also carried out under the same conditions. The results revealed that oxygen and carbon concentration of mc-Si had a larger decrease than that of CZ -Si, which means the more oxygen precipitates in mc-Si were generated. High density defects of mc-Si such as grain boundaries and dislocations accelerated formation of oxygen precipitates. Bulk lifetime of mc-Si and CZ -Si greatly increased. The reason of lifetime increase is probably due to the fact that lots of oxygen precipitates and defect complex compounds are generated after three step annealing, which could be suction center of defect, that reduced carrier decentralized recombination centers that resulted in improvement of lifetime of wafer. Tendency of difference of lifetime was correlated with interior structure of crystalline silicon.

Electrical techniques based on capacitance and conductance measurements are powerful tools for interface characterization in semiconductor heterostructures. We here detail their application to the study of the heterointerface formed between hydrogenated amorphous silicon (a-Si:H) and crystalline silicon (c-Si). The main parameters governing the device applications are the conduction and valence band mismatch, and the density of interface states. The presence of a high interface states density can be revealed by capacitance versus temperature and frequency measurements. For very high quality interfaces that are required for instance to reach high conversion efficiencies in solar cells, the usual measurements performed in the dark and at zero or reverse bias are not sensitive enough. We show that the sensivity to interface states can be enhanced by using capacitance measurements under illumination and at a forward bias close or equal to the open-circuit voltage. In this case, the measured capacitance is determined by the diffusion of free carriers in c-Si and limited by recombination at the interface. Regarding the determination of band offsets, the method using a plot of the inverse square capacitance as a function of bias to determine the intercept of the extrapolated linear region is shown to lead to errors even in the absence of any interface charge. This is due to the presence of a strong inversion layer in c-Si at the interface, the effect of which has been ignored so far in the literature. The presence of this strong inversion layer is evidenced from planar conductance measurements on (n) a-Si:H/(p) c-Si structures. We emphasize that these measurements are very sensitive to details of the band structure profile. In particular, it is shown that the temperature dependence of the sheet electron density allows the determination of the conduction band offset between a-Si:H and c-Si with a good precision. We find 0.15 ± 0.04 eV.

A novel crystallization method for silicon based thin film transistor (TFT) is proposed for the fabrication of high performance large size flat panel displays. In spite of using almost the same TFT fabrication process as that of hydrogenated amorphous silicon (a-Si:H) TFT, the proposed metal capped laser thermal annealing method realizes the formation of uniform and dense micro crystalline silicon (μc-Si), and provides mobility of 3.1 cm2/V•s, threshold voltage (ΔVth) of 2.3 V, and sub threshold slope (S) of 0.93 V/decade. Moreover, proposed stacked n+ amorphous silicon structure realizes extremely low off-current maintaining high on-current. As the reliability of TFT, a threshold voltage sift (ΔVth) under the high current bias stress test (BTS) condition was investigated, and realized the assumed ΔVth of +1.77 V after 100,000 hours stress of 10 μA and 50°C. This value is 2 orders smaller than that of a-Si:H TFT and only three times larger than that of low temperature poly silicon (LTPS) TFT.We believe that our μc-Si TFT technology is the suitable solution for the high quality, large size flat panel display mass-production.