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The article presents a model illustrating thermal flow in microwave printed-circuit boards (PCBs). It cites the use of a simple microstrip circuit to examine the effects of the plated-through-hole (PTH) for signal-ground connections in the PCB's isolated areas on the heat flow. Also explored are the impacts of the thermal conductivity (TC) on PCB materials with different thermal properties at various power levels.

The article discusses the semiconductor devices that operate at high junction temperatures for long period and its impact on the operating performance. It cites that designers should understand the thermal properties of a printed circuit board (PCB) design for a given Monolithic Microwave Integrated Circuit (MMIC) device to minimize thermal resistance and temperature rise. It also discusses the method for computing thermal resistance between a MMIC amplifier and the ambient environment.

The article focuses on the process of metallic plating of WR-10 stainless-steel waveguide. It includes a simple procedure for copper plating stainless-steel WR-10 waveguide sections, up to 40 centimeters in length. It is stated that an anode with a uniform separation from all interior walls of the wave guide allows for efficient plating. It is added that for experiments executed at low temperatures, it is desirable to use a stainless-steel waveguide in the refrigerator for thermal isolation and to plate the waveguide with a higher conductive metallic layer.

The article presents information about HyRelex, a low loss, high reliability, flexible laminates and bonding materials. HyRelex has been introduced by Taconic. The materials provide thermal, mechanical and electrical properties. These also provide superior moisture resistance. HyRelex produces low loss circuit performance because it lessens phase shift with frequency and temperature changes. HyRelex has outstanding properties. It has superb peel strength to aid in high temperature assembly operations and high power handling requirements.