Low Loss, HIGH RELIABILITY, THIN FLEXIBLE INTERCONNECT MATERIALS.

The article presents information about HyRelex, a low loss, high reliability, flexible laminates and bonding materials. HyRelex has been introduced by Taconic. The materials provide thermal, mechanical and electrical properties. These also provide superior moisture resistance. HyRelex produces low loss circuit performance because it lessens phase shift with frequency and temperature changes. HyRelex has outstanding properties. It has superb peel strength to aid in high temperature assembly operations and high power handling requirements.