Computing Thermal Resistance of PCB-Mounted MMIC Devices.

The article discusses the semiconductor devices that operate at high junction temperatures for long period and its impact on the operating performance. It cites that designers should understand the thermal properties of a printed circuit board (PCB) design for a given Monolithic Microwave Integrated Circuit (MMIC) device to minimize thermal resistance and temperature rise. It also discusses the method for computing thermal resistance between a MMIC amplifier and the ambient environment.