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Electromagnetic interference (EMI) issues are becoming crucial for three-dimensional integrated components which combine multi-core Systems-On-Chip, multi-band radio frequency circuits (RF), Giga-bit memories, as well as advanced analog circuits. In this first paper, the technology roadmap towards 3D-ICs is illustrated and the associated EMC challenges are described. This first paper also focuses on the role of interposers, associated electrical parasitics, and addresses concerns about signal and power integrity.

The purpose of the "SPOTLIGHT" column is to highlight the top downloaded papers for the Transactions on Electromagnetic Compatibility and Electromagnetic Compatibility Magazine, pre-selected based on the statistics of the IEEE Xplore digital library (http://ieeexplore.ieee.org), by presenting their corresponding abstracts. A balance of the top downloaded paper abstracts is published quarterly, giving to the technical and scientific community the opportunity of being informed about the contributions of a wide range of EMC topics, their authors and affiliations, and making the EMC field better known.

The purpose of the “SPOTLIGHT” column is to highlight the top downloaded papers from the IEEE Transactions on Electromagnetic Compatibility and Electromagnetic Compatibility Magazine, pre-selected based on the statistics of the IEEE Xplore digital library (http://ieeexplore.ieee.org), by presenting their corresponding abstracts. A balance of the top downloaded paper abstracts are published quarterly, giving to the technical and scientific community the opportunity of being informed about the contributions of a wide range of EMC topics, their authors and affiliations, and making the EMC field better known.

The paper aims at describing the nature of numerical models used in EMC studies and their inherent assumptions and limitations. The ultimate objective is to elucidate the manner in which, together with measurements, they can be used to get a better understanding of EMC phenomena and assist in the design of EMC compliant systems. Part I of the paper covers the more general generic aspects of numerical modeling and some more specific technical areas. Part II will address the remaining important technical aspects of EMC modeling.

The experimental results presented in the paper have shown that the application of the PEIs might cause EMC related problems, especially in the case of the application of a group of connected converters. The most convenient way to reduce EMI currents and prevent aggregation of EMI currents introduced by a group of converters is through passive compensation of voltage interference sources inside of the single converters. In the paper the concept of the passive compensation of CM voltage at the output of converters has been verified in an experimental arrangement. The obtained experimental results confirm that the compensation of the CM voltage brings about significant attenuation of the CM currents in load circuits. The presented compensator can be integrated with single DC-DC converters as well as applied at the output of a group of the connected converters.

In the fast paced electronics world, simulation has become an indispensable tool for every designer in recent years. In this paper, we present a guide to setting up a coupled simulation method from a SPICE-like circuit simulation and a full wave 3D simulation. This coupling offers the possibility to calculate the field distribution in a structure considering the effects of an attached circuit by applying the superposition theorem. As long as only elements on the circuit are modified, it allows fields to be calculated at the speed of a circuit simulation. The paper contains an introduction to the properties of time and frequency domain 3D solvers, discussing their effectiveness for different applications. In the main part of the paper we deal with the definition of ports in the 3D and circuit as the set-up of a coupled model needs special attention to the ground concept. Finally, the method is applied to the simulation of radiated and conducted emission on a realistic PCB.

Anechoic Chambers are used in many applications in the field of Electrical Engineering. They became very important infrastructure in antenna characterization, EMI/EMC testing and calibration of different types of electronic systems. Many varieties of anechoic chambers were installed by industry in the world to meet their testing requirements. Though the indoor testing of electromagnetic radiating devices began in the early 1950s, many companies started installing these chambers in 1980s onwards. This has led to research work on cost effective design, manufacturing, installation and evaluation of anechoic chambers in a very short span of time. In India, many defense and private organizations were equipped with anechoic chambers for their varied applications. The manufacturing and installation of these chambers in a short time became today's neccesity for industry. To achieve this, a few simple and effective methods are presented in this paper. The focus of the paper is mainly on design, simulation and validation of the rectangular anechoic chamber used for UWB applications and the experimental results are also presented in the paper.

The Joint EMC Symposium in Dresden was excellent! We had 400+ papers submitted, and a few over 260 papers were accepted. The venue offered multiple tracks covering both traditional EMC and Signal Integrity topics, including oral presentations, poster sessions, experiments and demonstrations, workshops and tutorials, with a large number of exhibitors supporting the event. We are certain we had over 700 attendees as we ran out of carry-all bags! Dresden itself was quite an attraction. The city celebrated the 807th anniversary of its founding the weekend before the Symposium started, with a local festival, live music, and a spectacular fireworks display on the final night of the celebration.

The 2022 ESA Workshop on Aerospace EMC was planned to be held in Potsdam, Germany on May 23–25 at the NH Potsdam Voltaire Hotel, organized by the European Space Agency (ESA) with co-sponsorship of the IEEE EMC Society. Unfortunately in February 2022, due to the unclear Covid situation we had to re-organize the workshop as a fully virtual event. This happened for the first time in the series 2019 (Budapest), 2016 (Valencia), 2012 (Venice), and 2009 (Florence). The organizers strive to hold these events every three years, so it was preferred to hold it virtually rather than postponing it, also considering the advanced status of the preparation (papers already submitted and reviewed). The Technical Program Committee as usual comprised a mix of members from various national space agencies, industry contractors and suppliers, as well as from academia.

SEM photographs of a typical copper conductors prepared by the PCB industry exhibit a 3-D "snowball" structure of copper surface distortions [1]. We have developed an analytical basis for the electromagnetic scattering by the copper "snowballs" to predict additional power losses to those presented by the propagating medium [2] that compare well with the observed measurements for a set of rough microstrip lines. In this paper we describe the fundamental concepts involved with the 3-D scattering theory of our analysis.

Testing of wireless devices and systems is becoming increasingly important in the technological development of Long Term Evolution (LTE) and 5G mobile networks. Both mobile and base station manufacturers are interested in assessing system performance and user perceived quality in realistic propagation environments, including indoor and outdoor conditions. Real-life electromagnetic environments exhibit rich multipath propagation and a strong attenuation of the wireless signal over the propagation channel. Emulating those conditions in anechoic chambers requires the careful arrangement of many interference sources in multiple configurations, which leads to complex and time-consuming measurements. The reverberation chamber (RC) is a metallic cavity where the signal created by a single source is reflected and diffused to create multipath fading. This paper gives an overview of how an RC can be tuned to emulate channel parameters, e.g., power delay profile, time delay spread, coherence bandwidth and Rician K-factor, of real-life environments The addition of absorbing material inside the RC allows for varying those parameters, thus recreating line of sight and imperfect propagation conditions experienced by the user equipment (UE). Compliant electromagnetic compatibility downlink and uplink tests are shown for selected MIMO configurations as well as for Internet of Things devices. The tests are carried out using a commercial base station connected to the live national mobile network of a mobile operator. Evaluated network parameters are throughput, signal to noise ratio, modulation schemes and other settings of both the base station and of the UE to assess the quality of the digital communication.

Stochastic electromagnetic fields originating from processes in digital circuitry affect the operation of the circuit, increase the error rate in the transmission of digital signals, degrade the circuit's performance, yield malfunction of the system or even lead to a complete failure of the system's operation. Interference from stochastic fields are not only disruptive but are becoming more common due to the increasing complexity of modern electronics. Stochastic electromagnetic fields under common circumstances are due to a mixture of emissions from different sources, which makes a quantification of stochastic fields very challenging. Since digital signals are clocked, the ensemble averages of the electromagnetic field transients representing the digital signal exhibit a periodic time dependence with the period of the clock interval. The probabilistic model of the cyclostationary random process was composed by appropriate transformations of the initial discrete random process of the binary symbols. Exploiting the cyclostationary characteristics of stochastic fields greatly simplifies their analysis. The physical signal propagating along the transmission line is considered also a source of the radiating electromagnetic field which preserves the cyclostationary properties of the binary sequence. The stochastic process of the measured near-field emissions inherits probability characteristicsfrom the random process of the physical signal in the transmission line. This paper presents an approach for quantifying emissions and coupling of stochastic fields using their cyclostationary properties. For practical evaluation of cyclostationary characteristics the statistical cyclic averaging of the measured signals are used. The important feature of the statistical cyclic averaging procedure is its capability to distinguish cyclostationary signals from a mixture of stochastic processes such as stationary noise with deterministic signals and even from other cyclostationary signals with distinct cyclic frequencies. The measurement setup for observing electromagnetic emissions from printed circuit boards (PCBs) hosting digital electronic devices comprises an automated positioning system with a scanning near-field probe attached to the moving scanner head. This scanning near-field probe and a properly position fixed or also movable reference probe are connected to the inputs of a multi-channel digital oscilloscope for simultaneous and synchronous sampling and registering of the magnetic field components. The registered data from the oscilloscope was transferred to a data acquisition computer. After the postprocessing procedure, the spatial localization of distributed radiating sources on the surface of the PCB was performed in conjunction with determination of their average power characteristics and specified cyclic frequencies. The proposed cyclic averaging was applied to the spatial separation of radiating sources with different bit rates and for the quantitative characterization of crosstalk and coupling between transmission lines carrying the data sequencesand subsequent estimation of bit error rate (BER) caused by the crosstalk using their cyclostationary properties.

In this issue of the EMC Magazine, we recognize and pay tribute to the legacy of Donald N. Heirman who passed away on October 30, 2020. Don Heirman was a memorable person. I recall meeting him at my first industry event after I had joined my father's company, LectroMagnetics, Inc. based in Los Angeles. This meeting took place at the 1982 IEEE International Symposium on EMC in Santa Clara, California. When Don entered the exhibition area and headed toward our booth, my father whispered in my ear, “Here comes Mr. Bell Labs.” My father had a nickname for those whom he had a special fondness for, and Don was one of them. Don's sense of humor, interest in accurate EMC measurements, and support of the IEEE and EMC Society resonated with my father. In fact, when EMC Society Historian, Dan Hoolihan, recently visited Don's office to go through his volumes of papers, Dan found a letter my father had sent to Don dated December 10, 1979. Dan sent me the original, slightly tattered letter that was typed on LectroMagnetics company letterhead. In the letter, my father relayed his personal and corporate support of the new EMC Chapter of the IEEE New Jersey Coast Section. Don was instrumental in the success of that chapter, serving as newsletter editor, vice-chair and then chair during the late 1970s. Dan also shared a photo he found of Don from that era that you may find on page 101. I got to know Mr. Bell Labs better as he would visit my father whenever Don had business in Los Angeles. My father's office was conveniently located near a huge Lionel Trains store; I learned of Don's fondness for trains during one of our many trips to that train store.

The IEEE Committee on Man and Radiation (COMAR) has released a New TIS on “Health and Safety Issues Concerning Exposure of the General Public to Electromagnetic Energy from 5G Wireless Communications Networks.” My colleague Bob Olsen, also an Associate Editor of the EMC Magazine, provided a related article to this activity, “RF Safety Regulation Background Relevant to 5G” in the last issue of the EMC Magazine, 2nd Quarter 2020, Volume 9, Issue 2. Associate Editor's Note — The following information is an abridged version of the full TIS. All errors and omissions are solely the Associate Editor's responsibility. Thanks to the COMAR authors of this paper for their efforts in putting together the TIS on this important topic. The full TIS can be found at the COMAR web page — https://ewh.ieee.org/soc/embs/comar/.

It is observed that the standards IEC 61000-3-2 and IEC 61000-3-3 do not discuss the calibration methods required to evaluate the performance of a Harmonics and Flicker emission test setup, used for Electromagnetic Compatibility (EMC) measurements. When the instrument does not have a direct standard procedure, reference data for comparison analysis is required to calibrate/verify any equipment or system. In particular, emission measurement systems in EMC laboratories necessarily require a reference source value to check the performance of the test system periodically. This necessitates the design and development of a Harmonics and Flicker Generator to not only identify a known repeatable Harmonics and Flicker value but also to find out the deviation of the test setup. The proposed Harmonics and Flicker Generator is intended to be used for the calibration of Harmonics and Flicker emission test setup and for Inter Laboratory Comparison analysis (ILC) to evaluate the performance capabilities of the EMC test laboratories. This paper discusses the Harmonics and Flicker generator design techniques, schematic circuit, functional description, performance analysis and results.

The paper discusses the use of affordable software-defined radio (SDR) platforms for measuring and characterizing man-made noise with impulsive components using Middleton noise models. For illustration, numerical results from a case study are presented, in which man-made noise is measured at three different locations corresponding to three distinct types of radio-frequency (RF) environments, and for which the parameters of the underlying Middleton Class A impulsive noise model are derived. The study demonstrates one of the many applications of SDR platforms, whose versatility enables dedicated noise measurements systems that can be configured through software.

An approach is presented for power integrity analysis on multi-layer printed circuit boards in this paper. Two critical current paths are analyzed. Inductance decomposition is applied to identify the critical parameters that can influence the PDN input impedance. Two types of stack-ups are used to perform sensitivity analysis to illustrate the effectiveness of PDN design guidelines. Based on the analysis of the inductance contribution from different blocks in the PCB PDN, a systematic approach to obtain a complete understanding of PDN behavior is proposed. The approach can be used to provide design guidance in PDN design practice.

Transfer impedance and insertion loss are two important performance parameters of current probes. In this paper the relationship between them is discussed and analyzed. First the analysis is carried out from the aspect of their definitions. Then the two parameters are analyzed from physical aspects. Preliminary experimental validation is presented in this paper whereafter. The measurement results have shown a satisfactory verification.

The purpose of the ″SPOTLIGHT″ column is to highlight the top downloaded papers from the IEEE Transactions on Electromagnetic Compatibility and Electromagnetic Compatibility Magazine, pre-selected based on the statistics of the IEEE Xplore digital library (http://ieeexplore.ieee.org), by presenting their corresponding abstracts. A balance of the top downloaded paper abstracts are published quarterly, giving the technical and scientific community the opportunity of being informed about the contributions of a wide range of EMC topics, their authors and affiliations, and making the EMC field better known.

Hello, and welcome to the 3rd Quarter Issue of the EMC Society magazine. It was wonderful to see so many friends, old and new, at our Symposium this year in Raleigh, North Carolina. We had many excellent technical papers, workshops and tutorials, experiments and demonstrations; outstanding social activities, with super food and entertainment; and some very interesting activities celebrating the anniversary of James Clerk Maxwell's monumental paper A Dynamical Theory of the Electromagnetic Field, read to the Royal Society in December of 1864 and published by the Royal Society in January of 1865. I hope you who were able to attend enjoyed everything there was to offer! For those were not able to join us, we missed you, every one of you!

The purpose of the “SPOTLIGHT” column is to highlight the top downloaded papers from the IEEE Transactions on Electromagnetic Compatibility and Electromagnetic Compatibility Magazine, pre-selected based on the statistics of the IEEE Xplore digital library (http://ieeexplore.ieee.org), by presenting their corresponding abstracts. A balance of the top downloaded paper abstracts are published quarterly, giving to the technical and scientific community the opportunity of being informed about the contributions of a wide range of EMC topics, their authors and affiliations, and making the EMC field better known.

In high-speed electrical system design, power integrity (PI) has become critical in designing a power distribution network (PDN). In this paper, a time-domain PDN design method is proposed from a charge delivery perspective. Firstly, the integrated circuit (IC) switching current, drawn from the PDN, is expanded into a series of triangular currents. Next, charge delivery models are presented for ideal passive components and a PDN consisting of these components. Finally, the PDN charge delivery model is combined with the IC switching current (expressed as a summation of triangular currents) to develop the time-domain PDN design method. A practical case study is demonstrated at the end of the paper to validate the proposed PDN design method.

Welcome to the Signal Integrity Column! In this issue, you will find a very interesting paper on power integrity. In modern high-speed digital designs, power distribution networks (PDNs) using power and ground planes are commonly used where decoupling capacitors are necessary to provide charge for logic transitions and, at the same time, to mitigate the noise generated during device switching. With the continuous increase of data rates and current consumption, as well as the decrease of logic levels, PDN design becomes increasingly challenging. More and more decoupling capacitors would be needed, which presents a seemingly unresolvable conflict with the industry trends for lower cost and more compact design. Prof. Madhavan Swaminathan, a well-known pioneer and expert on power integrity, presents his latest research effort in this paper to address this challenge. I hope his innovative idea can inspire the readers of the EMC Magazine to come up with more ideas to address this fundamental power integrity issue necessary for next generations of high-speed digital designs.

Maxwell's first published effort to describe electromagnetic phenomena was his paper "On Faraday's Lines of Force", published in 1855. In this first of four papers leading up to his Treatise, Maxwell opens his two-part presentation by stating in his introductory remarks that although much is known about the present state of electricity, areas still remain where knowledge is sparse and clear relationships have not been established. He goes on to say that it is necessary in any successful electrical theory to clearly show the connection between electricity at rest and current (moving) electricity, and the attractions and inductive effects of electricity in both states. Maxwell then asserts that in order to become familiar with the requirements of the science of electricity, one must become familiar with a large body of intricate mathematics, and that this in itself presents a significant hindrance to any progress. He goes on to express his desire to establish a method of investigation that would allow the grasp of a physical conception without creating a theory of the phenomena under study that relied on abstruse and purely analytical reasoning or that relied on a physical hypothesis before fully comprehending the various aspects of phenomena. Maxwell draws on his familiarity with Thomson's mathematical work to develop an analogical relationship between the flow of heat and the theory of action at a distance governed by an inverse square law.

Over-the-air performance testing of MIMO wireless devices requires the simulation of an RF environment similar to that experienced in the real world. There are a number of standardized spatial channel models that are considered acceptable for evaluating MIMO performance of LTE devices. A number of different methods have been proposed for generating MIMO test environments, but the ability of those methods to reproduce a target wireless channel, and the results they produce, vary. There are several methods for evaluating a spatial channel that are useful validation tools if the goal is to produce a specific known environment. This paper will present the results from several of those for different test cases. In addition, a set of reference device antenna systems have been developed to allow one MIMO radio to be tested with antennas designed for "good", "nominal", and "bad" performance. In this way, the ability of a MIMO test system to provide a relative distinction between different levels of device performance may be assessed. This paper will show results of this comparison for different system configurations and channel models and provide an indication of the suitability of these systems for evaluating MIMO device performance.

Welcome to the Signal Integrity Column! In this issue, you will find a practical paper of great interest. As you may know, electromagnetic band gap (EBG) structures have been extensively studied in the past several years due to their great potential in mitigating power-bus noise that propagates through the parallel planes in high-speed multilayer printed circuit boards. However, for practical applications of the EBG technology in engineering designs, potential issues such as size of the EBG structures, implementation of the EBG in internal layers, effects of vias, signal and noise-coupling consequences when traces are routed through the EBG region, etc., are often the concerns of many printed circuit board (PCB) engineers. This paper addresses some of the practical issues by proposing a narrow fence-type EBG region around noise sources. I am sure that readers will find some of the ideas and design methodologies proposed in this paper quite useful.

This summary article focuses on the threats and impacts of High Power Electromagnetic (HPEM) environments on power grids throughout the world and further introduces the implications of making the power grid “smarter” through the introduction of additional electronics and communications. A full paper on this topic has been accepted for the EMC Europe Conference and will be published in September 2012. Those interested in further details should consult that paper, which also includes detailed references.

There has been a desire for a long time to increase the efficiency of the way in which power is generated and delivered to customers. While there are many aspects to solve this desire, many of them entail the ability to know what power is used and when it is used and by whom. The point of common information is at the common power usage meter that resides on the outside wall of structures. From an EMC perspective, such devices should withstand the RF environment where they are located. The use of EMC standards and appropriate test levels are critical to the survivability of the intelligence that flows in both directions through the power meter. That intelligence has been identified as making the meter “smart” and hence the power grid “smart”. Moreover, this has been identified as the Smart Meter and the Smart Grid, respectively. This short paper provides an overview of the application of EMC principles to the Smart Grid. It will indicate where the EMC standards can best be applied and which are the main committees identifying these standards. It is not an exhaustive review as it is intended to highlight the topic with papers that follow providing much more detail.

Engineering college/university libraries, public libraries, company or corporate libraries, National Technical Information Services (NTIS), or the Defense Technical Information Center (DTIC) are all possible sources for copies of abstracted articles or papers. If the library you visit does not own the source document, the librarian can probably request the material or a copy from another library through interlibrary loan, or for a small fee, you can order it from NTIS or DTIC. Recently it became clear that EMCABs were more timely than publications which were being listed in data files. Therefore, additional information will be included, when available, to assist in obtaining desired articles or papers. Examples are: IEEE, SAE, ISBN, and Library of Congress identification numbers.

This paper compiles similarities and differences among Automotive EMC Standards. In particular, the paper concentrates on EMC standards dedicated to testing automotive components. The paper presents an introduction of the primary automotive component standards. Based on this introduction, CISPR 25 and the ISO 11452-2 are analyzed since they are the basis for most other standards. The anechoic chamber requirements are studied in detail.

Engineering college/university libraries, public libraries, company or corporate libraries, National Technical Information Services (NTIS), or the Defense Technical Information Center (DTIC) are all possible sources for copies of abstracted articles or papers. If the library you visit does not own the source document, the librarian can probably request the material or a copy from another library through interlibrary loan, or for a small fee, you can order it from NTIS or DTIC. Recently it became clear that EMCABs were more timely than publications which were being listed in data files. Therefore, additional information will be included, when available, to assist in obtaining desired articles or papers. Examples are: IEEE, SAE, ISBN, and Library of Congress identification numbers.

Isotropic field probes are used to characterize the electric field in radiated susceptibility testing of electronic systems. These probes are required to be periodically calibrated by the original equipment manufacturer, which is essential as per test requirements. Getting a probe calibration done is a time consuming process for an EMC laboratory. If the probe calibration is not done periodically, than the validity of test results are questionable. In this paper, we have demonstrated to use the ACD type D dot sensor in frequency domain in place of isotropic probes, in radiated susceptibility testing. The D dot sensors do not have active electronic circuitry and therefore are not required to be calibrated periodically.

Thank you to everyone who attended the 2019 IEEE EMC+SIPI Symposium in New Orleans! Here is some of the feedback I've received…appreciated the wide variety of papers and topics presented, thumbs up to the brass band, hurricanes, and plentiful food during the Welcome Reception (favorites included jambalaya, shrimp creole, and beignets), learned a lot about rocket engine-testing on the trip to the NASA Stennis Space Center, and really enjoyed NOLA (that's "New Orleans Louisiana" for the un-indoctrinated) hospitality and local flavor! Thank you and congratulations to all our committee members and volunteers who made the week a success! Looking ahead, plan to attend the 2020 Symposium in Reno next July!

The technical development towards the full vision of the Internet of Things (IoT) is expected to reach its full potential by the coming 5G wireless technologies. This will open up for so called massive IoT characterized by very large co-location densities. This development will affect the area of Electromagnetic Compatibility (EMC) in a number of ways and may even be the most challenging issue for the EMC area since it was born for over 100 years ago. The challenges that emerge as a result of the mass increase of wirelessly consumer devices, dense co-located, working in new frequency bands and in scenarios characterized by being highly dynamic, flexible and non-predictable, will be complex and will require new EMC equipment, theoretical models and methodologies for EMC analysis and testing to be developed. In this paper, some of these new challenges are highlighted and discussed. Furthermore, numerical results from some dense co-location scenarios are presented to show examples of interference challenges to be handled.

Fixture de-embedding is a technique to remove unwanted effect of the fixtures from a total measurement. Fixture de-embedding includes two steps: first S-Parameters of left and right fixtures are obtained and then they are de-embedded from left and right sides of measured scattering matrix. De-embedding techniques are well known when a network have even number of ports, i.e. when number of input and output ports are equal. In the present paper we propose a technique to generalize de-embedding algorithm for network parameters with odd number of ports.

An effective method for assessment of exposure to the electric field of the wireless signals from mobile communication systems is still lack, since the transmission of wireless signals is related to the traffic and the exposure level varies with the traffic load. In this paper we study the allocation mechanism of the traffic time slots in the mobile communication systems, and analyze the probability of the number of simultaneously occupied traffic time slots. Based on the queuing theory, the duty cycle of the wireless signal can be calculated by the traffic load. We establish the theoretical relationship between the exposure level and the traffic load. The exposure level in a certain period can be directly extrapolated by the calculated duty cycle, and the maximum electric field measured in the max-hold mode. By this method the maximum electric field only needs to be measured one time. Much effort on measurement can be avoided.

Due to the changes of energy storage sources, driving systems, vehicle control units, etc., the electromagnetic compatibility (EMC) of electric vehicles is facing greater challenges than that of conventional oil-fueled vehicles. On the one hand, the use of high-power and high-voltage electrical components will generate high electromagnetic interference (EMI) energies in actual operation. On the other hand, automotive electronics with high integration and sensitivity is more susceptible to EMI, which is directly related to the safety of vehicles. In this paper, the EMI mechanism and suppression measures of motor driving systems, charging systems and other low-voltage systems are investigated. The results show that the main sources of EMI in electric vehicles are the quick switching of power switches, the operation of motor windings and the issue of signal coupling between high voltage cables and low voltage cables, and the EMI can be suppressed effectively by shielding, filtering and optimization of system principles.

Pulse width modulated (PWM) variable frequency drives (VFDs) are commonly adopted in modern control of electro-mechanical drive systems. The use of insulated-gate bipolar transistor (IGBT) and higher switching frequencies has improved the efficiency of the motor drive systems significantly but they also cause high frequency common-mode (CM) currents in the motor bearings. Hence, new drive installations failed prematurely within months, which resulted in unnecessary downtime. Mitigation techniques such as CM filter and motor shaft grounding ring are possible solutions to prevent this kind of premature failure. In this paper, using a 5.5 kW motor drive system as a case study, the cause of bearing degradation is investigated and the various mitigation techniques are carefully evaluated.

This paper presents an electromagnetic interference (EMI) filter design procedure for a single-phase SiC MOSFET inverter. To ensure the EMI filter performance is both accurate and effective, the equivalent noise source impedances of common mode (CM) and differential mode (DM) noise models are extracted. Then the CM and DM EMI filters can be designed based on the known CM and DM noise source impedances, respectively. The EMI filter design based on the proposed method is validated both through simulation and experiments. The simulation and experiment results have verified the effectiveness of the proposed method.

High power density is the primary design consideration for power converters in more electric aircraft (MEA) to meet both space and weight requirements. Therefore, wide bandgap (WBG) semiconductor switching devices, such as SiC, have been chosen to push the switching frequency of the power converter further for size and weight reduction. To meet power quality and conducted emission requirements, a LCL filter is necessary between the converter output and the power grid. With the power switching devices operating at higher frequency, the parasitic effects of various key circuits of the converter cannot be ignored and must be accounted for in the simulation model. This paper describes a complete equivalent circuit model that includes these effects of DC bus-bar, power semiconductor device, gate driver and LCL filter. With the comprehensive model, common-mode (CM) conducted emissions can be predicted and evaluated during the design phase for performance optimization purpose.

Another journey into the past was accomplished at Don Heirman's house in New Jersey on May 16-20, 2021. Preparing to work with Art Wall (the executor of Don's estate) and Andrew Rose (Don's computer consultant the last few years), I arrived at Don's house the evening of May 16. The three of us held initial discussions on the plans for the next few days and reviewed the work that Art had done in moving some paper records from the upstairs office to the sun-room on the main floor; approximately 15 boxes of records.

LASCAS is the international symposium and flagship event of the IEEE Circuits and Systems (CAS) Society in IEEE Region 9 (Latin America). It started 14 years ago and took place for the first time in Ecuador developing activities in micro and nanoelectronics. The symposium, held from February 28 to March 3 at the Swiss Hotel in Quito, Ecuador, provided a high-quality exchange and networking forum for more than 100 researchers, professionals, and students, gathering an international audience with experts worldwide. The best paper of the conference will be published in the IEEE Transactions on Circuits and Systems. More information may be found on the conference website https://www.ieee-lascas.org/

Hello again, and welcome to the early spring issue of the EMC Society Magazine! I hope all who were able to attend the combined EMC and Signal Integrity Symposium event in March in Santa Clara, California, had a rewarding visit. At this symposium we introduced “Industry” papers, and both the quality and the presentation of these papers was impressive across the board, to say the least. Roughly a third of the papers were related to Signal Integrity, so it is clear that this is an area of great interest amongst our Society members, and we plan to continue the inclusion of both EMC and Signal Integrity in upcoming symposia. Please contact us with any comments you may have regarding this, we'd love to hear your feedback. Note that all of the technical papers from the Santa Clara Symposium will be available to the attendees for download for about a month or so, and then will be available to all members on IEEE Xplore. We had several excellent panel sessions, many special sessions on a wide variety of topics, some excellent experiments and demonstrations, and of course many wonderful vendors of all the fabulous hardware and software that we all use each day to get our jobs done.

This tutorial paper defines the various concepts of bandwidth used in RF-interference measurements, explains their significance, and indicates their inter-relationships. The approach is to examine the conventional selectivity curve of an IF amplifier in terms of bandwidths to steady-state signals. Impulse response of the IF amplifier is also presented and the importance thereto of the coefficient of coupling in double-tuned IF transformers is discussed. For both steady-state and transient signals, the basic concepts of effective bandwidth are presented. This concept is applied to IF amplifiers for three different types of effective bandwidth, steady-state, random noise, and impulse, and the significance of each is examined. For any given IF amplifier, each is related to the response of a given physical system and, hence, they are interrelated. These inter-relationships are indicated.

This paper presents a selection of research topics related to nano-electromagnetic compatibility (nano-EMC) issues in emerging carbon nanoelectronics. Carbon-based nano-interconnect modeling and analysis are first introduced. Then, the key techniques of carbon nanotube-filled through-silicon vias and carbon- based passive devices are discussed.

This paper presents a framework for a life cycleapproach electromagnetic compatibility (EMC) management to control the overall emission of the modern railway system to external environment. With a large number of electrical equipment interfaces following integration of mechanical and electrical subsystems, cooperation across all disciplines during system implementation through key EMC activities is described at each project development phase to guarantee the success of a large-scale project EMC safety assurance. A case study of a large Mass Rapid Transit project is examined to illustrate how the framework may be applied. The validation of safe railway system emission is demonstrated through positive system integration test results under EN 50121-2 criteria. The framework flexibility to accommodate foreseeable impacts of future change is also discussed.

Reprints abstracts (digests) of the papers presented in 1960 at the 2nd National Symposium on Radio Frequency Interference.

This paper discusses the electromagnetic compatibility and interference aspects related to wireless power transfer (WPT) systems for wearable and implantable devices. The cases of a near-field (reactive) link for recharging a pacemaker and a far-field (radiative) link for wearable devices are considered. For the first case a design approach, able to perform efficient energy transfer under the safety regulations constraints of medical devices is proposed. In the second case, a rigorous methodology is proposed to predict the transferred energy to a worn device able to account for interferences due to the human body or any other wireless system located close to the worn device. An implementation of grounded worn rectennas in the presence of unconventional radio channels is presented.

This paper presents a method to characterize power delivery network impedance seen at the silicon level in a high-speed I/O interface using pseudorandom bit stream (PRBS) patterns. Moreover, results from a transient simulation using the extracted impedance are compared with laboratory measurements, showing good correlation.

Wow! What a conference in Long Beach. I'd like to thank Ray Adams and the organizing committee for putting together such a tremendous event. As I mentioned in the last Chapter Chatter, Long Beach is one of my favorite venues. I especially enjoyed the engine room tour of the Queen Mary during the Wednesday Night Gala. It's hard to imagine what life was like onboard during her glory days and also during the war. I could have spent a couple of days wandering around the ship. The technical program was great this year. There just didn't seem to be enough time to attend all of the papers, workshops, and tutorials. Luckily I was able to catch a few of the presentations I missed via the online program. It was a special treat this year to have Constantine Balanis teach a short course on antennas. And on top of everything else, the weather was wonderful!