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- Source :
- IEEE Electromagnetic Compatibility Magazine; 2019, Vol. 8 Issue: 3 p8-18, 11p
- Publication Year :
- 2019
-
Abstract
- Thank you to everyone who attended the 2019 IEEE EMC+SIPI Symposium in New Orleans! Here is some of the feedback I've received…appreciated the wide variety of papers and topics presented, thumbs up to the brass band, hurricanes, and plentiful food during the Welcome Reception (favorites included jambalaya, shrimp creole, and beignets), learned a lot about rocket engine-testing on the trip to the NASA Stennis Space Center, and really enjoyed NOLA (that's "New Orleans Louisiana" for the un-indoctrinated) hospitality and local flavor! Thank you and congratulations to all our committee members and volunteers who made the week a success! Looking ahead, plan to attend the 2020 Symposium in Reno next July!
Details
- Language :
- English
- ISSN :
- 21622264 and 21622272
- Volume :
- 8
- Issue :
- 3
- Database :
- Supplemental Index
- Journal :
- IEEE Electromagnetic Compatibility Magazine
- Publication Type :
- Periodical
- Accession number :
- ejs51386668
- Full Text :
- https://doi.org/10.1109/MEMC.2019.8878220