226 results on '"Lee, S.H."'
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2. A triple band antenna for a wireless USB dongle.
3. The temperature depedence of quantum optical transition properties of GaN and GaAs in a infinite square well potential system.
4. Flash type MEMS-based Analog-to-Digital Converter of field emission.
5. Prediction of temperature rise in gas insulated busbar using multi-physics analysis.
6. Development and characteristic evaluation of USN node module for u-manufacturing.
7. Impact of dipole-induced dielectric relaxation on high-frequency performance in La-incorporated HfSiON/metal gate nMOSFET.
8. Implementation and performance evaluation of mobile ad hoc network for Emergency Telemedicine System in disaster areas.
9. Relation with Fuzzy Entropy and Similarity Measure Based on One-to-One Correspondence.
10. Bonding interfaces in wafer-level metal/adhesive bonded 3D integration.
11. 700V Lateral DMOS with New Source Fingertip Design.
12. Design and development of CO2 sensor controller using solid electrolyte.
13. Fabrication and evaluation of V-shaped MOS transistor probe.
14. Integrated Microfluidic Chip for Fast Diagnosis of Piscine Nodavirus.
15. Virtual Knee Joint Replacement Surgery System.
16. Rotor fault detection system for inverter driven induction motor using currents signal.
17. A study on Driving of 35W(T5) fluorescent lamp by the electronic ballast using piezoelectric transformer.
18. Fabrication and evaluation of metal-oxide-semiconductor transistor probe.
19. Reduction of Metal Artifact in Three-Dimensional Computed Tomography (3D CT) with Dental Impression Materials.
20. Optimal Clustering of Kinetic Patterns on Malignant Breast Lesions: Comparison between K-means Clustering and Three-time-points Method in Dynamic Contrast-enhanced MRI.
21. Development of bio-materials: Bio-active calcium phosphate-coated medical implant and Au-based dental alloys.
22. A Low Phase Noise Octa-Phase LC VCO for Multi-band Direct Conversion Receiver.
23. Status of HTS Motor Development in Korea.
24. Integrated Sensor System for Humidity Sensing of Robots Using Analog Mixed CMOS Technology.
25. Performance Characteristics of Vapor Chambers with Boiling Enhanced Multi-Wick Structures.
26. Resonance inverter power system for improving plasma sterilization effect.
27. A novel SPM probe with MOS transistor and nano tip for bio application.
28. Analyzing Input Harmonic Currents of a Six-pulse AC/DC Converter by an Efficient Time-domain Approach.
29. A novel high speed and high voltage complementary bipolar process using 1st base-poly silicon collector and soi technique.
30. A high performance complementary bipolar process controlling base poly-Si over-etching in emitter region and using SOI or PBSOI technique.
31. Advanced ring type contact technology for high density phase change memory.
32. Process technologies for the integration of high density phase change RAM.
33. Dynamic characteristic analysis and control parameter estimation of tubular type moving-magnet linear actuator with Halbach array.
34. Droplet-based magnetically activated cell separation.
35. Diffusion PDE-based denoising technique for magnetic resonance electrical impedance tomography.
36. Surface polishing of three dimensional micro structures.
37. Optical and lasing characteristics of 1.55 μm InGaAs/InGaAsP/InP quantum dots grown by MOCVD.
38. Highly manufacturable high density phase change memory of 64Mb and beyond.
39. PRAM process technology.
40. Improvement of data retention time in DRAM using recessed channel array transistors with asymmetric channel doping for 80 nm feature size and beyond.
41. Integration and cell characteristics for high density PRAM.
42. Fabrication of a ZnO piezoelectric cantilever with a high-aspect-ratio nano tip.
43. Improvement of data retention time using DRAM cell with metallic shield embedded (MSE)-STI for 90nm technology node and beyond.
44. High performance spiral inductors embedded on organic substrates for SOP applications.
45. A high performance complementary bipolar process using PBSOI technique.
46. Power efficient MPEG-4 decoder architecture featuring low-complexity error resilience.
47. Automated quantitation of non-steady flow and lumen area using temporal correlation [MRI].
48. A novel robust TiN/AHO/TiN capacitor and CoSi2 cell pad structure for 70nm stand-alone and embedded DRAM technology and beyond.
49. Highly manufacturable 90 nm DRAM technology.
50. Fully integrated 64 Kb MRAM with novel reference cell scheme.
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